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| Application No. | Application Title | Issue Date |
| 20120070605 | SILICON CARBIDE INGOT, SILICON CARBIDE SUBSTRATE, MANUFACTURING METHOD THEREOF, CRUCIBLE, AND SEMICONDUCTOR SUBSTRATE An SiC ingot includes a bottom face having 4 sides; four side faces extending from the bottom face in a direction intersecting the direction of the bottom face; and a growth face connected with the side faces located at a side opposite to the bottom face. At least one o... | 03/22/2012 |
| 20120037140 | FIXED ABRASIVE SAWING WIRE WITH A ROUGH INTERFACE BETWEEN CORE AND OUTER SHEATH A fixed abrasive sawing wire is presented that comprises a core (310) and an outer sheath layer (320) that is softer than the core. In the sheath abrasive particles are embedded that are held by a binding layer. The bond between core and sheath is enhanced... | 02/16/2012 |
| 20110294403 | WAFER PROCESSING METHOD, WAFER POLISHING APPARATUS, AND INGOT SLICING APPARATUS In a wafer processing method, an ingot is sliced into a wafer and the wafer is planarized by polishing a surface of the wafer. When the wafer is planarized, the wafer is disposed on a wafer holder and the wafer is rotated, a heat quantity is applied to a portion of the ... | 12/01/2011 |
| 20110226326 | SILICON SUBSTRATE FOR SOLAR BATTERY, MANUFACTURING APPARATUS THEREOF, MANUFACTURING METHOD THEREOF, AND SOLAR BATTERY The present invention relates to a silicon substrate 10 for a solar battery, wherein the silicon substrate 10 comprises: a plurality of curves 13 constituted by concave parts 11 and convex parts 12 to absorb sunlight; and planes 14<... | 09/22/2011 |
| 20110225908 | SYSTEM AND METHOD FOR CONCRETE SLAB CONNECTION Systems and methods of transferring loads between adjacent cast-in-place slabs, such as concrete slabs, and for accurately positioning dowels between adjacent sections of slabs are provided. A generally planar plate-type dowel is used which may be positioned within a cu... | 09/22/2011 |
| 20110203565 | Vehicle-Mounted Hydraulic Slab Cutter A cutting implement configured to be attached to an implement carrier of a power machine. The cutting implement includes an attachment structure that is capable of engaging and being secured to the implement carrier. The cutting implement further includes a boom having ... | 08/25/2011 |
| 20110155114 | INDEPENDENTLY SUPPORTED CONCRETE SAW APPARATUS AND METHOD A saw apparatus for sawing paving slabs has a frame mounted on a ground contacting propulsion member such that the frame may move above a slab to be cut. A saw support assembly has an engaged position and a removed position; the engaged position disposing a blade of a s... | 06/30/2011 |
| 20110041827 | System And Method For Cutting Ceramic Ware Cutting and grinding of ceramic-type logs to a desired piece length is disclosed. A method of manufacturing ceramic ware is disclosed which comprises transversely cutting a piece from a ceramic-type log having a longitudinal axis by cutting into the log with a blade at ... | 02/24/2011 |
| 20110011838 | Method for fabricating semicoductor wafers applicable to integrated circuit manufacture The present invention discloses a method for fabricating semiconductor wafers applicable to IC manufacture, which comprises steps: providing an ingot; slicing the ingot into a plurality of wafers; using a laser to illuminate the surface of the wafers to eliminate the sa... | 01/20/2011 |
| 20100300422 | DEVICE FOR THE SUPPORT, DRIVE AND/OR TRANSMISSION OF MOTION TO A DIAMOND WIRE ON MACHINES FOR CUTTING STONES A device for the support and/or drive of diamond wire of machines for cutting natural or agglomerate stones includes at least one pulley, wheel or drum for support and/or drive, provided with at least one groove for holding at least one diamond wire for cutting; soft ma... | 12/02/2010 |
| 20100258102 | DEVICE AND METHOD FOR PROCESSING SLABS OF STONE OR STONE-LIKE MATERIALS A device (1) for processing a slab of stone or stone-like material, comprises a support table (2), adapted for receiving slab, and a fixed guide rail (3) running in a first direction (X) along a side of the support table. The device further comprise... | 10/14/2010 |
| 20100089209 | METHOD FOR SIMULTANEOUSLY CUTTING A COMPOUND ROD OF SEMICONDUCTOR MATERIAL INTO A MULTIPLICITY OF WAFERS A method for simultaneously cutting a compound rod of semiconductor material into a multiplicity of wafers. The method includes selecting a first workpiece and a second workpiece, each having two end surfaces; grinding at least one of the two end surfaces of each workpi... | 04/15/2010 |
| 20100051009 | WIRE MONITORING A sawing device for sawing silicon blocks comprises at least one cutting element for sawing silicon blocks, the cutting element being drivable by means of a drive device, at least one guide device, with the at least one cutting element being alignable along a predetermi... | 03/04/2010 |
| 20100038456 | METHOD AND SYSTEM FOR SEPARATING A MULTIPLICITY OF CERAMIC COMPONENTS FROM A COMPONENT BLOCK In a method for detaching a plurality of ceramic components (11-15) from a ceramic component block (1), the following steps are provided: providing the component block (1); mounting a plurality of parallel wire segments (21-26) ... | 02/18/2010 |
| 20100006982 | METHOD OF PRODUCING SEMICONDUCTOR WAFER There is provided a method of producing a semiconductor wafer which is high in the beveling accuracy and the yield for large-size wafers having a diameter of not less than 450 mm, comprising a slicing step for cutting out a disc-shaped wafer having a diameter of not les... | 01/14/2010 |
| 20100006081 | METHOD FOR MANUFACTURING SILICON MATTER FOR PLASMA PROCESSING APPARATUS The present invention relates to a method for manufacturing silicon articles for a plasma processing apparatus. The present invention provides a method for manufacturing silicon articles, comprising: preparing a silicon ingot; forming a hollow silicon cylinder and a sil... | 01/14/2010 |
| 20100003492 | HIGH QUALITY LARGE AREA BULK NON-POLAR OR SEMIPOLAR GALLIUM BASED SUBSTRATES AND METHODS A large area nitride crystal, comprising gallium and nitrogen, with a non-polar or semi-polar large-area face, is disclosed, along with a method for making. The crystal is useful as a substrate for a light emitting diode, a laser diode, a transistor, a photodetector, a ... | 01/07/2010 |
| 20090311948 | METHOD FOR PRODUCING SEMICONDUCTOR WAFER A semiconductor wafer is produced by a method comprising a slicing step, a fixed grain bonded abrasive grinding step and a beveling step, in which the kerf loss is reduced and the flatness is improved.... | 12/17/2009 |
| 20090293856 | UNDERWATER DIAMOND WIRE SAW ASSEMBLY A wire saw assembly having a slide frame, support frames, a tensioning carriage, and a diamond wire cutting saw. The slide frame has a mounting plate attached slidably to mounting plate rails. The mounting plate engages a lead screw so that rotation of the lead screw mo... | 12/03/2009 |
| 20090258580 | AQUEOUS ABRASIVES DISPERSION MEDIUM COMPOSITION [Problems to be Solved by the Invention] An object of the present invention is to provide an aqueous abrasives dispersion medium composition which does not have a problem of inflammability and which is excellent in dispersion stability of a... | 10/15/2009 |
| 20080141994 | Method For Slicing A Multiplicity Of Wafers From A Workpiece A multiplicity of wafers are sliced from a workpiece which has a longitudinal axis and a cross section, the workpiece fastened on a table being fed by a relative movement directed perpendicularly to the longitudinal axis of the workpiece between the table and the wire g... | 06/19/2008 |
| 20080038514 | Granite Slabs Cut With Frame Saw Employing Blades With Diamond-Containing Segments And Method Of Cutting Thereof A graphite block cut into slabs by a sawing device comprising a plurality of generally parallel, spaced-apart blades with each of the blades having a plurality of cutting segments mounted thereon, each of the cutting segments comprising a continuous phase impregnated wi... | 02/14/2008 |
| 20080017182 | Vehicle-mounted hydraulic slab cutter A vehicle-mounted cutter for cutting a paved surface such as concrete is disclosed. The cutter utilizes the hydraulic power from a vehicle to operate a saw motor that rotates a blade operably attached to a trolley, an orbital motor that engages causes the trolley to mov... | 01/24/2008 |
| 20080000466 | Chainsaw Chain for Concrete The invention relates to a chainsaw chain, especially for use in cutting concrete, comprising a plurality of teeth which are respectively provided with at least one cutting segment carrier and at least one cutting segment. The cutting segment comprises diamond punches w... | 01/03/2008 |
| 20070157917 | High pressure superabrasive particle synthesis An improved method for controlling nucleation sites during superabrasive particle synthesis can provide high quality industrial superabrasive particles with high yield and a narrow size distribution. The synthesis method can include forming a particulate crystal growth ... | 07/12/2007 |
| 20070051355 | Brazed diamond tools and methods for making the same Multi-layered superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be pr... | 03/08/2007 |
| 20070051354 | Brazed diamond tools and methods for making the same Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be provided as a po... | 03/08/2007 |
| 20060016443 | Wafer dividing method and apparatus A method of dividing a wafer whose strength is reduced along a plurality of dividing lines formed on the front surface in a lattice pattern, along the dividing lines, comprising: a tape affixing step for affixing a protective tape to one surface side of the wafer; a hol... | 01/26/2006 |
| 20050279340 | Guard for a moving tool Abrading and cutting devices such as saws include waste containment systems and methods to improve removal of slurry or other contaminants from a work area during operations, and separation of slurry from a carrying medium such as air. A blade guard includes fluid chann... | 12/22/2005 |
| 20050268763 | Method and apparatus for cutting semiconductor wafers Improperly mounted wafer saw blades can damage wafers cut or diced with the blades. Embodiments of this invention employ sensors to measure a distance to the blade to help indicate if the blade is improperly mounted. In one method of the invention, a the distance to the... | 12/08/2005 |
| 20050268897 | Apparatus for cutting a mitered edge in stone A system for supporting and positioning a portable stone-cutting track saw to make a mitered cut in a piece stone-type material is described. The system includes lightweight support fixtures that clamp to the stone and that are configured to support rails of the portabl... | 12/08/2005 |
| 20050241629 | Granite slabs cut with frame saw employing blades with diamond-containing segments and method of cutting thereof A graphite block cut into slabs by a sawing device comprising a plurality of generally parallel, spaced-apart blades with each of the blades having a plurality of cutting segments mounted thereon, each of the cutting segments comprising a continuous phase impregnated wi... | 11/03/2005 |
| 20050186761 | Group encapsulated dicing chuck A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafer... | 08/25/2005 |
| 20050066955 | Facing machine for hard-fired ceramic tiles The facing machine for hard-fired ceramic tiles comprises: a structure for supporting, and setting the cutting depth of, at least one pair or rotary rollers at a grooving station, the axis of said rollers lying transverse to the infeed path of said tiles as carried on a... | 03/31/2005 |
