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Class 118/733 - Chamber seal


Subclass of Class 118 - Coating apparatus
Definition: Apparatus wherein a means is provided to prevent communication
No. of applications: 60
Last issue date: 01/12/2012


1    
Application No.Application TitleIssue Date
20120006268SUBSTRATE PROCESSING APPARATUS AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
A CVD device has a reaction furnace (39) for processing a wafer (1); a seal cap (20) for sealing the reaction furnace (39) hermetically; an isolation flange (42) opposite to the seal cap (20); a small chamber (43) formed ...
01/12/2012
20110274837ALD REACTOR, METHOD FOR LOADING ALD REACTOR, AND PRODUCTION LINE
An ALD reactor for treating one or more substrates is provided. The ALD reactor includes at least one reaction chamber which has a front plate including gas connections for introducing starting materials, flushing gases and the like gases into the reaction chamber. In a...
11/10/2011
20110255950System and Method for Sealing a Vapor Deposition Source
A system and method for movably sealing a vapor deposition source is described. One embodiment includes a system for coating a substrate, the system comprising a deposition chamber; a vapor pocket located within the deposition chamber; and an at least one movable seal, ...
10/20/2011
20110236569SYSTEMS AND METHODS FOR PREVENTING OR REDUCING CONTAMINATION ENHANCED LASER INDUCED DAMAGE (C-LID) TO OPTICAL COMPONENTS USING GAS PHASE ADDITIVES
Systems and methods for preventing or reducing contamination enhanced laser induced damage (C-LID) to optical components are provided including a housing enclosing an optical component, a container configured to hold a gas phase additive and operatively coupled to the h...
09/29/2011
20110155049MODERN HYDRIDE VAPOR-PHASE EPITAXY SYSTEM & METHODS
Hydride vapor-phase deposition (HVPE) systems are disclosed. An HVPE hydride vapor-phase deposition system may include a reactant source chamber and a growth chamber containing a susceptor coupled to the reactant source chamber. The reactant source chamber may be config...
06/30/2011
20110041769APPARATUS FOR CHEMICAL VAPOR DEPOSITION AND APPARATUS FOR PROCESSING SUBSTRATE
Provided are a chemical vapor deposition (CVD) apparatus and a substrate processing apparatus. The CVD apparatus includes a chamber defining a processing chamber for forming a thin film on a substrate, a shower head that discharges processing gas into the processing cha...
02/24/2011
20100275845ULTRAVIOLET-RESISTANT MATERIALS AND DEVICES AND SYSTEMS INCLUDING SAME
UV-resistant materials are disclosed that include at least one self-supporting film of UV-resistant clay particles and that are substantially non-reactive to incident UV radiation. An exemplary material is substantially non-transmissive to at least one UV wavelength of ...
11/04/2010
20100122659METERING AND VAPORIZING PARTICULATE MATERIAL
Apparatus for metering and vaporizing a particulate material, includes: a metering device for metering particulate material having: a reservoir for receiving particulate material; a housing having first and second openings; a rotatable shaft disposed in the internal vol...
05/20/2010
20100062182Method for Repairing Display Device and Apparatus for Same
An object of the present invention is to provide a method for repairing a display device according to which a wide variety of regions can be repaired in various ways using various materials, as well as an apparatus for the same. The present invention provides a repairin...
03/11/2010
20100050945SUBSTRATE PROCESSING APPARATUS
When a quartz part is placed on a floor, the inside of a furnace is not polluted by contaminants attached from the floor to a seal surface of the quartz part and entering the inside of the furnace. A substrate processing apparatus includes a reaction tube, a first joini...
03/04/2010
20100024872SEMICONDUCTOR LAYER MANUFACTURING METHOD, SEMICONDUCTOR LAYER MANUFACTURING APPARATUS, AND SEMICONDUCTOR DEVICE MANUFACTURED USING SUCH METHOD AND APPARATUS
Provided are a semiconductor layer manufacturing method and a semiconductor manufacturing apparatus capable of forming a high quality semiconductor layer even by a single chamber system, with a shortened process time required for reducing a concentration of impurities t...
02/04/2010
20090272324SLIT VALVE HAVING INCREASED FLOW UNIFORMITY
Methods and apparatus for increasing flow uniformity are provided herein. In some embodiments, a slit valve having increased flow uniformity may be provided, the slit valve may include a housing having an opening disposed therethrough, the opening configured to allow a ...
11/05/2009
20090255466REAGENT DISPENSING APPARATUS AND DELIVERY METHOD
This invention relates to a vapor or liquid phase reagent dispensing apparatus that may be used for dispensing vapor or liquid phase reagents such as precursors for deposition of materials in the manufacture of semiconductor materials and devices. This invention reduces...
10/15/2009
20090205563TEMPERATURE-CONTROLLED PURGE GATE VALVE FOR CHEMICAL VAPOR DEPOSITION CHAMBER
The present invention relates to methods and apparatus that are optimized for producing Group III-N (nitrogen) compound semiconductor wafers and specifically for producing GaN wafers. Specifically, the methods relate to substantially preventing the formation of unwanted...
08/20/2009
20090126631CHEMICAL VAPOR DEPOSITION REACTOR HAVING MULTIPLE INLETS
A chemical vapor deposition reactor has a wafer carrier which cooperates with a chamber of the reactor to facilitate laminar flow of reaction gas within the chamber and a plurality of injectors configured in flow controllable zones so as to mitigate depletion....
05/21/2009
20090120368ROTATING TEMPERATURE CONTROLLED SUBSTRATE PEDESTAL FOR FILM UNIFORMITY
Substrate processing systems are described. The systems may include a processing chamber, and a substrate support assembly at least partially disposed within the chamber. The substrate support assembly is rotatable by a motor yet still allows electricity, cooling fluids...
05/14/2009
20090096349CROSS FLOW CVD REACTOR
A cross flow chemical vapor deposition chamber can comprise an inlet duct having a generally rectangular cross-section and an outlet duct having a generally rectangular cross-section. The rectangular inlet duct and the rectangular outlet duct can facilitate laminar flow...
04/16/2009
20090087932SUBSTRATE SUPPORTING APPARATUS, SUBSTRATE SUPPORTING METHOD, SEMICONDUCTOR MANUFACTURING APPARATUS AND STORAGE MEDIUM
A substrate supporting apparatus includes a substrate supporting portion having a substrate supporting surface facing a rear surface of a substrate; plural protruding portions provided on the substrate supporting surface, for preventing the substrate from being slid on ...
04/02/2009
20090056631APPARATUS FOR MANUFACTURING SEMICONDUCTOR LAYER
An apparatus for manufacturing a semiconductor layer on a substrate typically includes a reaction chamber, a first feed pipe, and a second feed pipe. The reaction chamber is configured for receiving the substrate therein. The first feed pipe and the second feed pipe com...
03/05/2009
20090017218Manufacturing Method for Producing Wick Structures of a Vapor Chamber by Using a Powder Thermal Spray Gun
Simplifying a manufacturing method for producing wick structures of a vapor chamber includes providing a metal lid, providing a powder thermal spray gun to generate a high temperature blaze to melt a sprayed first powder into a melting surface status, and directly spray...
01/15/2009
20080315141Slit Valve Door
The present invention provides a slit valve for sealing an opening in a chamber, wherein the slit valve includes a door having an interior and an exterior surface. A sealing member is disposed on the interior surface of the door near a periphery of the interior surface ...
12/25/2008
20080317956Device and Method for Continuous Chemical Vapour Deposition Under Atmospheric Pressure and Use Thereof
The invention relates to a device and a method for continuous chemical vapour deposition under atmospheric pressure on substrates. The device is hereby based on a reaction chamber, along the open sides of which the substrates are guided, as a result of which the corresp...
12/25/2008
20080282977Gas processing apparatus, gas processing method and integrated valve unit for gas processing apparatus
A process gas line (255) for carrying WF6 gas for nucleation, a process gas line (259) for carrying WF6 gas for film deposition after nucleation are joined at a single joint (280) to a carrier gas line (256). A gas line ...
11/20/2008
20080268143Device For Providing Vapors Of A Solid Precursor To A Processing Device
The present invention relates to a device for providing vapors of at least one solid precursor intended to supply a physico-chemical processing device, comprising an enclosure capable of containing particles of the solid precursor and comprising an inlet and an outlet, ...
10/30/2008
20080241379Method and apparatus for reducing substrate temperature variability
A method and apparatus for treating a substrate in a processing system. The processing system includes a process chamber having a pumping system configured to evacuate the process chamber, a substrate holder coupled to the process chamber and configured to support the s...
10/02/2008
20080236499Vent groove modified sputter target assembly and apparatus containing same
A sputter target assembly including vent grooves having a certain configuration so as to reduce target arcing during the physical vapor deposition of a film....
10/02/2008
20080210170SEMICONDUCTOR MANUFACTURING EQUIPMENT AND MANUFACTURING METHOD OF THE SAME
A semiconductor manufacturing equipment includes a first chamber that has a first connection hole, a second chamber that has a second connection hole connected to the first connection hole of the first chamber, an O-ring that is provided between the first chamber and th...
09/04/2008
20080202418ENTRY LOCK SYSTEM, WEB PROCESSING INSTALLATION, AND METHOD FOR USING THE SAME
An entry lock system for feeding web from a web supply to a web processing installation, the entry lock system comprising a first chamber having an inlet port and an outlet port, a second chamber having an inlet port, a first seal positioned at the inlet port of the fir...
08/28/2008
20080168947GAS-PURGED VACUUM VALVE
A vacuum valve assembly for use in a vacuum processing chamber includes a seat defining an opening in the vacuum valve, with the seat having a sealing face adjacent the opening and normal to the direction of the opening; and a gate having a sealing face adapted to mate ...
07/17/2008
20080171147FORMING THIN FILMS USING A RESEALABLE VIAL CARRIER OF AMPHIPHILIC MOLECULES
A method of forming a thin film of amphiphilic molecules on a substrate by using a resealable vial carrier is provided. The method includes placing the substrate in a vacuum chamber. A resealable cap member of the vial carrier is opened. The vial carrier may contain a l...
07/17/2008
20080121184IN-SITU METHOD OF CLEANING VAPORIZER DURING DIELECTRIC LAYER DEPOSITION PROCESS
Provided is an in-situ method of cleaning a vaporizer of an atomic layer deposition apparatus during a dielectric layer deposition process, to prevent nozzle blocking in the vaporizer and an atomic layer deposition apparatus. During the dielectric layer deposition proce...
05/29/2008
20080099146SUSPENSION FOR SHOWERHEAD IN PROCESS CHAMBER
Stress within a suspension wall for suspending a showerhead in a process chamber is ameliorated by one or more of: (1) Openings in the suspension wall that reduce exposure of the suspension wall to process gas or ambient atmosphere when the chamber lid is opened.

05/01/2008
20080099145GAS SEALING SKIRT FOR SUSPENDED SHOWERHEAD IN PROCESS CHAMBER
Stress within a suspension wall for suspending a showerhead in a process chamber is ameliorated by one or more of: (1) A gas sealing skirt that helps protect the suspension wall from direct contact with process gas. The gas sealing skirt is connected to either the chamb...
05/01/2008
20080087222ROTATING PRESSURE DISTRIBUTOR AND CAROUSEL-TYPE MACHINE FOR TREATING HOLLOW BODIES WHICH IS EQUIPPED THEREWITH
Rotating pressure distributor (1) for a carousel-type machine for treating hollow bodies in a plurality of identical treatment stations, comprising two rings, (2) fixed and (3) rotating, in sealing contact, the ring (3) having orifices (6<...
04/17/2008
20080032059Device and Process for Plasma Coating/Sterilization
A device for treating containers such as bottles, preferably PET containers, such as PET bottles, with a plasma, whereby the device is designed for sterilizing and/or coating the containers. In addition, the device also relates to a method for treating containers, prefe...
02/07/2008
20080011232Device for depositing a coating on an internal surface of a container
Device for depositing a coating on an internal surface of a container (10), of the type in which the deposition is carried out by means of a low-pressure plasma created inside the container (10) by excitation of a precursor gas by microwave-type electromag...
01/17/2008
20080014350Apparatus and Methods for Chemical Vapor Deposition
Methods and apparatus are disclosed for the formation of vaporizing liquid precursor materials. The methods or apparatus can be used as part of a chemical vapor deposition apparatus or system, for example for forming films on substrates. The methods and apparatus involv...
01/17/2008
20070231485Silane process chamber with double door seal
A process chamber for the coating of substrates with silanes with a double door seal. The double door seal may have a cavity between the seals which may be evacuated or pressurized, including with an inert gas. An apparatus for the coating of substrates comprising a pro...
10/04/2007
20070209588Exhaust system for a vacuum processing system
A method, computer readable medium, and system for treating a substrate in a process space of a vacuum processing system is described. A vacuum pump in fluid communication with the vacuum processing system and configured to evacuate the process space, while a process ma...
09/13/2007
20070212484Exhaust apparatus configured to reduce particle contamination in a deposition system
A method and system for vapor deposition on a substrate that disposes a substrate in a process space of a processing system that is isolated from a transfer space of the processing system, processes the substrate at either of a first position or a second position in the...
09/13/2007
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