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...When G.G. Hubbard learned of his future son-in-law's invention, he called it "only a toy." His daughter was engaged to a young man named Alexander Graham Bell.
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| Application No. | Application Title | Issue Date |
| 20120128865 | APPARATUS FOR FORMING ELECTRODE AND METHOD FOR FORMING ELECTRODE USING THE SAME Disclosed herein is an apparatus for forming an electrode on a surface of a ceramic laminate. The apparatus for forming an electrode includes: a blast surface plate having ruggedness to which an electrode material paste is applied; and a moving device moving a ceramic l... | 05/24/2012 |
| 20110266705 | TEMPLATE REPAIR METHOD, PATTERN FORMING METHOD, AND TEMPLATE REPAIR APPARATUS A template repair method according to one embodiment is a method for repairing a template including a template base material and a first mold release layer formed on a pattern surface of the template base material, and a restorative material is supplied to the pattern s... | 11/03/2011 |
| 20110223751 | DOPING OF SEMICONDUCTOR SUBSTRATE THROUGH CARBONLESS PHOSPHOROUS-CONTAINING LAYER A method and system are disclosed for doping a semiconductor substrate. In one embodiment, the method comprises forming a carbon free layer of phosphoric acid on a semiconductor substrate, and diffusing phosphorous from the layer of phosphoric acid in the substrate to f... | 09/15/2011 |
| 20110223314 | EFFICIENT MICROENCAPSULATION A device and method for generating microcapsules employs an inertial-focusing channel for introducing particles dispersed in a prepolymer suspension fluid, a droplet-generating junction for introducing oil evenly onto the flow of particles to create separated droplets o... | 09/15/2011 |
| 20110151242 | COMPOSITE MATERIAL COMPRISING SILICON MATRIX AND METHOD OF PRODUCING THE SAME Proposed are a composite material, wherein non-penetrating pores that are formed in a silicon surface layer are filled up with a metal or the like without leaving any voids by using the plating technique, and a method of producing the composite material. A composite mat... | 06/23/2011 |
| 20110123813 | COMPOSITE MATERIAL, METHOD FOR PRODUCING THE SAME, AND APPARATUS FOR PRODUCING THE SAME Disclosed is a composite material wherein adhesion between a silicon surface and a plating material is enhanced. A method and an apparatus for producing the composite material are also disclosed. The method for producing a composite material comprises a dispersion/alloc... | 05/26/2011 |
| 20100323106 | Apparatus for Automatic Depositing of Multiple Ultra-Thin Layers Using Layer-by Layer Deposition and Method for Using the Same Novel methods and apparatus for thin film layer-by-layer depositions on substrates is provided. More specifically, provided herein is a layer-by-layer deposition of polymers and colloids on substrates of varying sizes and shapes including, for example, flat solid substr... | 12/23/2010 |
| 20100312007 | Solution component recovery method, solution component recovery apparatus, and impregnation process/impregnation component recovery system A solution component recovery method, a solution component recovery apparatus, and an impregnation process/impregnation component recovery system for separating a first component from a second component. The separation between the first and second components is accompli... | 12/09/2010 |
| 20100285214 | Fluid Bed Granulation Process and Apparatus A fluid bed granulation process and apparatus, wherein a suitable fluid bed of a particulate material is maintained in a granulator (1) fed by an input flow (F) comprising a growth liquid (L) and by a flow (S1) of seeds adapted to promote the granulation, ... | 11/11/2010 |
| 20100255269 | COPPER FILLING-UP METHOD [Problem to be Solved] To provide a method of well filling copper in a non-through hole on a conductivity-rendered substrate by using a copper plating bath containing fewer additives. [Means for Solving the Problem] A method of filling copp... | 10/07/2010 |
| 20100221836 | SOL-GEL MATERIALS FOR CELLULAR MODULATION A modified sol-gel material and method of making the same is provided herein. More particularly, sol-gels disclosed herein have been modified to have one or more bioactive peptides covalently bound to the surface of the sol-gel. In one embodiment the peptide presenting ... | 09/02/2010 |
| 20100180950 | LOW-TEMPERATURE SURFACE DOPING/ALLOYING/COATING OF LARGE SCALE SEMICONDUCTOR NANOWIRE ARRAYS A method and corresponding system for providing a uniform nanowire array including uniform nanowires composed of at least three elements is presented. An embodiment of the method includes growing an array of two-element nanowires, and thereafter uniformly doping or allo... | 07/22/2010 |
| 20100163529 | ELECTRODE WIRE FOR WIRE ELECTRODISCHARGE MACHINING, METHOD OF MANUFACTURING THE SAME, AND SYSTEM FOR MANUFACUTRING BASE WIRE FOR THE SAME An electrode wire for wire electrodischarge machining includes a core made of copper or copper alloy, a pure zinc layer formed by hot-dip galvanizing the core, and a relatively thin copper-zinc alloy layer formed by mutual thermal diffusion across the interface between ... | 07/01/2010 |
| 20100143725 | AQUEOUS COMPOSITIONS, PRECURSOR SYSTEMS AND APPLICATION SYSTEMS An aqueous gel-forming composition, e.g. a fire retardant coating composition, comprises an aluminosilicate, the aluminosilicate comprising alkali metal aluminate and an alkali metal silicate, and an organic liquid having a boiling point greater than 11O° C., e.g. sili... | 06/10/2010 |
| 20100143715 | METHOD AND APPARATUS FOR MANUFACTURING A COMPOSITE MATERIAL A method of manufacturing a composite material, the method comprising: providing a first layer (14) of CNTs reinforcement elements (13) with liquid matrix material in interstitial gaps between the reinforcement elements; dipping a second layer of reinforce... | 06/10/2010 |
| 20100136244 | ELECTROLESS NICKEL PLATING BATH AND METHOD FOR ELECTROLESS NICKEL PLATING Disclosed is an electroless nickel plating bath not containing harmful metal species. In the electroless nickel plating bath, there are contained at least an iron ion source and an iodide ion source. With the use of the electroless nickel plating bath containing at leas... | 06/03/2010 |
| 20100075059 | COAT FILM FORMING METHOD AND COAT FILM FORMING APPARATUS A coating membrane forming method for forming a coating membrane on an object to be coated, the method comprising the steps of: setting the object to be coated for forming a coating membrane thereon in a dipping tank; sending an application liquid for forming the coatin... | 03/25/2010 |
| 20100032410 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD A substrate processing apparatus includes a bath in which a liquid or a gas is fed, and a mechanism which feeds out a liquid or a gas into the bath. The substrate processing apparatus processes a to-be-processed substrate which is disposed in the bath. The mechanism inc... | 02/11/2010 |
| 20100016890 | Spool Dip And Overcoat Process For Medical Devices A system and method for coating a suture are disclosed. The system includes a spool including a core having a suture wrapped thereabout and a dip tank including a first coating composition. The dip tank is configured to submerge the spool therein, thereby coating the su... | 01/21/2010 |
| 20090288593 | ELECTROLESS DEPOSITION SYSTEM An electroless deposition system includes a deposition solution, and saturating the deposition solution with an oxygen concentration in a range from about two thousand parts per million to about twenty thousand parts per million.... | 11/26/2009 |
| 20090288594 | ELECTROLESS DEPOSITION CHEMICAL SYSTEM LIMITING STRONGLY ADSORBED SPECIES An electroless deposition chemical system includes an electroless solution including a metal component, and a strongly adsorbed species component having a concentration less than a concentration of the metal component.... | 11/26/2009 |
| 20090253262 | ELECTROLESS PLATING SYSTEM An electroless plating system includes a plating solution, and controlling reducing agents in the plating solution for deposition over outlier features smaller than about five hundred nanometers and isolated by about one thousand nanometers.... | 10/08/2009 |
| 20090130315 | Method for Continuously Operating Acid or Alkaline Zinc or Zinc Alloy Baths The invention provides a process for depositing metallic layers from acidic or alkaline zinc or zinc alloy baths containing organic additives selected from brighteners, surfactants and complexing agents, a soluble zinc salt and optionally further metal salts selected fr... | 05/21/2009 |
| 20090101170 | SYSTEM FOR SOAKING ROLLS OF ABSORBING MATERIAL TO BE USED IN PRINTING MACHINE CLEANING System for soaking absorbing material rolls or sheets (1b, 2b) with a solvent (1a, 2a), such a solvent being contained into a bag made of plastic divided into two separated partitions, one (A) suited to contain the... | 04/23/2009 |
| 20080224314 | Method and Apparatus for Forming a Noble Metal Layer, Notably on Inlaid Metal Features A cap layer for a metal feature such as a copper interconnect on a semiconductor wafer is formed by immersion plating a more noble metal (e.g. Pd) onto the copper interconnect and breaking up, preferably by mechanical abrasion, loose nodules of the noble metal that form... | 09/18/2008 |
| 20080160204 | Spontaneous copper seed deposition process for metal interconnects A method for depositing a copper seed layer onto a semiconductor substrate comprises applying a SCuD plating bath onto a surface of a substrate, rinsing the surface with an organic solvent, applying a co-reactant bath to the surface, and again rinsing the surface with a... | 07/03/2008 |
| 20080141933 | Semiconductor plating system for plating semiconductor object Provided is a semiconductor plating system for plating a semiconductor object with a desired layer. The semiconductor plating system include a plating tank configured to accommodate a plating solution for use in plating the semiconductor object, and a plating solution i... | 06/19/2008 |
| 20080085370 | ELECTROLESS PLATING METHOD AND APPARATUS An electroless plating system is provided. The system includes a first vacuum chuck supporting a first wafer and a second vacuum chuck supporting a second wafer such that a top surface of the second wafer is opposing a top surface of the first wafer. The system also inc... | 04/10/2008 |
| 20080073402 | WEB GUIDING ROLLER AND WEB CONVEYING APPARATUS A web conveying apparatus is provided with a plurality of web guiding rollers. The web guiding rollers convey a web on which a functional material has just been coated in a coating section. Concave portions and convex portions that have a substantially semicircular cros... | 03/27/2008 |
| 20080057211 | METHODS FOR PLATING AND FABRICATION APPARATUS THEREOF A method for plating includes positioning a substrate facing a plating solution. The method also includes immersing the substrate into the plating solution while plating a layer of material over a surface of the substrate, wherein an immersion speed of the substrate is ... | 03/06/2008 |
| 20080011228 | Semiconductor device, method for manufacturing the same, and plating solution The present invention relates to a semiconductor device and a method for manufacturing the same. The semiconductor device has an embedded interconnect structure in which an electric conductor, such as copper or silver, is embedded in fine recesses formed in a surface of... | 01/17/2008 |
| 20080003372 | Method for Curing Radically Curable Compounds in a Protective Atmosphere and Device for Carrying Out Said Method A method of curing free-radically curable compositions under an inert gas atmosphere, where the curing, which proceeds in accordance with a free-radical mechanism, is initiated, or initiated and maintained, in the free-radically curable compositions by radiation and the... | 01/03/2008 |
| 20070275177 | Ceramic foam-filled sandwich panels and method To produce a ceramic foam-filled structural sandwich panel, a coating of a pre-ceramic slurry is applied on a preform. The preform includes a foam template sandwiched between a plurality of panels. In addition, the coating is cured to the preform, the preform is modifie... | 11/29/2007 |
| 20070266937 | Device for Spreading Adhesive The invention relates to a device (1), for spreading adhesive for floor coverings, comprising a quadrilateral housing (2) open on at least the lower face thereof, said housing (2) being provided with a handle (4), arranged on a fourth vertica... | 11/22/2007 |
| 20070240643 | Layer forming apparatus for electrophotographic photoreceptor There is provided a layer forming apparatus for forming a photosensitive layer of an electrophotographic photoreceptor, containing no bubbles in a coating liquid. In the layer forming apparatus for forming the photosensitive layer of the electrophotographic photorecepto... | 10/18/2007 |
| 20070231458 | Spotting Device and Method for High Concentration Spot Deposition on Microarrays and Other Micorscale Devices Disclosed is a spotter device and methods for the formation of microassays, biochips, biosensors, and cell cultures. The spotter may be used to deposit highly concentrated spots of protein or other materials on a microarray a slide, wafer, or other substrate. The spotte... | 10/04/2007 |
| 20070224360 | METHOD FOR COATING WITH COATING LIQUID, COATING APPARATUSES FOR USE THEREIN, AND METHOD FOR DESIGNING THE SAME A method for coating with a coating liquid according to the present invention is a method for coating an object-to-be-coated with a coating liquid containing dispersed particles, using a die, wherein the flowage of the coating liquid within a manifold 5 provided ... | 09/27/2007 |
| 20070224363 | PROCESS AND DEVICE FOR PREDICTING COATING THICKNESS A process and a device for prediction of the thickness of a layer of a coating or paint applied upon an object by dip painting. The paint layer thickness (h) at at least one point on the surface of the object (2) is predicted. A correlation between the paint laye... | 09/27/2007 |
| 20070166476 | Method and device for hot-dip coating a metal strand The invention relates to a device for hot-dip coating a metal strand (1), especially a steel strip, in which the metal strand (1) is vertically guided through a container (3) accommodating the molten coating metal (2) and through a guide chan... | 07/19/2007 |
| 20070148327 | Method for determining solvent permeability of films A method is disclosed to measure the permeability of films or coatings towards solvents (e.g. water). First a substrate comprising an absorption or container layer is provided, preferably the material is a porous material. To study water permeability, the porous materia... | 06/28/2007 |
