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Pizza Pie With Concentric Rings of Crust
A pizza mold for forming a plurality of concentric raised ridges of dough (i.e., crust) on the surface of a pizza pie.
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| Application No. | Application Title | Issue Date |
| 20100166952 | NANO-METAL SOLUTION, NANO-METAL COMPLEX GRAINS AND MANUFACTURING METHOD OF METAL FILM A nano-metal solution, nano-metal complex grains, and a manufacturing method of a metal film are provided. The nano-metal solution includes metal grains having an amount of 0.1˜30 wt %, metallic-organic self-decomposition molecules having an amount of 0.1˜50 wt % and ... | 07/01/2010 |
| 20100155108 | Electroless nickel plating solution composition, flexible printed circuit board and manufacturing method thereof The present invention relates to an electroless nickel plating solution composition, a flexible printed circuit board and a manufacturing method thereof, and more particularly, to an electroless nickel plating solution composition, a flexible printed circuit board and a... | 06/24/2010 |
| 20080260995 | INK COMPOSITION AND METALLIC MATERIAL To provide an ink composition capable of forming a metallic material which is excellent in adhesion to a substrate and free from ion migration. An ink composition having fine metallic copper particles and/or fine copper hydride particles, a... | 10/23/2008 |
| 20080131735 | Ni-X, Ni-Y, and Ni-X-Y alloys with or without oxides as sputter targets for perpendicular magnetic recording The various embodiments of the present invention generally relate to the deposition of a seedlayer for a magnetic recording medium used for perpendicular magnetic recording (PMR) applications, where the seedlayer provides for grain size refinement and reduced lattice mi... | 06/05/2008 |
| 20070251410 | Method For Reducing Metal Oxide Powder And Attaching It To A Heat Transfer Surface And The Heat Transfer Surface The purpose of the method developed is to form on top of a heat transfer surface a porous surface layer, which is to be fixed to the surface below it at a temperature and time applicable for industrial production. The heat transfer surface is copper or copper alloy. The... | 11/01/2007 |
| 20060016693 | Leveler compounds Plating baths containing a mixture of leveling agents, where the mixture includes a first level agent having a first diffusion coefficient and a second leveling agent having a second diffusion coefficient, are provided. Such plating baths deposit a metal layer, particul... | 01/26/2006 |
| 20050092616 | Baths, methods, and tools for superconformal deposition of conductive materials other than copper Superconformal deposition promoters are used to facilitate the superconformal deposition of conductive metals other than copper. Features deposited using the baths, methods, and tools that employ the superconformal deposition promoters are void free. The superconformal ... | 05/05/2005 |
| 20050092611 | Bath and method for high rate copper deposition A plating bath for electroplating copper on a microelectronic workpiece in a through-mask plating application at a rate of at least 2 μm/min where the bath includes: (a) 50-85 g/L of Cu2+; (b) 50-100 g/L of H2SO4; (c) 30-150 ppm of Clâ€... | 05/05/2005 |
| 20050079280 | Electroless copper plating solution, electroless copper plating process and production process of circuit board An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reacti... | 04/14/2005 |
