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| Number | Title | Issue Date |
| 4481467 | Break-away test probe A test probe for the testing of electrical circuits and circuit boards comprises a probe head (52) breakably coupled to an elongated probe arm (51). The breakable coupling is achieved by securing a first ring (63) to the probe arm and a second ring (60) t... | 11/06/1984 |
| 4445360 | Method for ultrasonically determining characteristics of a body An ultrasonic technique for remotely inspecting a body is described. A transducer (14), capable of generating and detecting ultrasonic signals, is coupled to the body. An ultrasonic signal (Ao) is launched by the transducer (14) into the body (... | 05/01/1984 |
| 4441183 | Apparatus for testing digital and analog circuits A high-speed, high-resolution testing circuit for both analog and digital circuit packs is described. The testing circuit, which employs data compression techniques, comprises a shift register (22) having an overall length selectively variable under progr... | 04/03/1984 |
| 4419562 | Nondestructive real-time method for monitoring the quality of a weld Herein disclosed is a noncontact, nondestructive method for monitoring the quality of a high energy weld, e.g., laser beam weld. In accordance with the proposed method, an acoustic sensor (32) is positioned at a distance from the welding zone (34) and pic... | 12/06/1983 |
| 4417478 | Method for determining lead frame failure modes using acoustic emission and discriminant analysis techniques An automatic pull tester and an acoustic emission system are herein combined to analyze the failure modes of lead frames bonded to integrated circuits. By using a discriminant analysis technique, a specific failure mode can be determined in real-time by f... | 11/29/1983 |
| 4412642 | Cast solder leads for leadless semiconductor circuits The attachment of leadless chip carriers to printed wiring boards by means of soldering techniques must provide for a spacing between the chip carrier and the board. Such spacing is required for cleaning the area under the chip carrier, protecting the und... | 11/01/1983 |
| 4411060 | Method of manufacturing dielectrically-isolated single-crystal semiconductor substrates In the manufacture of integrated circuits, it is often necessary to prepare dielectrically-isolated single-crystal silicon regions to be used as substrates in which various circuit elements may be formed. These regions or substrates are formed by attachin... | 10/25/1983 |
| 4370568 | Superconducting, fast rise-time voltage source A pulse generator comprises a toroid (11) of a superconducting material such as Niobium on a glass or ceramic substrate (12). A cryogenic source such as liquid helium cools the toroid to within a few degrees of absolute zero and a perpetually circulatory ... | 01/25/1983 |
| 4306289 | Digital computer having code conversion apparatus for an encrypted program The architecture of a conventional digital computer, for example, a microprocessor, is modified by interposing a multiplexer (31), a logic array (32) and a demultiplexer (33) between the instruction register (17) and instruction decoder (18). The logic ar... | 12/15/1981 |
