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| Number | Title | Issue Date |
| 8133812 | Methods and systems for barrier layer surface passivation This invention pertains to methods and systems for fabricating semiconductor devices. One aspect of the present invention is a method of depositing a gapfill copper layer onto a barrier layer for semiconductor device metallization. In one embodiment, the method incl... | 03/13/2012 |
| 8084356 | Methods of low-K dielectric and metal process integration An integrated process for forming metallization layers for electronic devices that use damascene structures that include low-k dielectric and metal. According to one embodiment of the present invention, the integrated process includes planarizing a gapfill metal in ... | 12/27/2011 |
| 8058164 | Methods of fabricating electronic devices using direct copper plating The present invention relates to methods and structures for the metallization of semiconductor devices. One aspect of the present invention is a method of forming a semiconductor device having copper metallization. In one embodiment, the method includes providing a ... | 11/15/2011 |
| 8053355 | Methods and systems for low interfacial oxide contact between barrier and copper metallization The present invention relates to methods and systems for the metallization of semiconductor devices. One aspect of the present invention is a method of depositing a copper layer onto a barrier layer so as to produce a substantially oxygen free interface therebetween... | 11/08/2011 |
| 8034409 | Methods, apparatuses, and systems for fabricating three dimensional integrated circuits The present invention pertains to methods, apparatuses, and systems for fabricating three-dimensional integrated circuits. One embodiment of the method comprises providing a wafer or other substrate having a plurality of through holes. In addition, the method includ... | 10/11/2011 |
| 7749893 | Methods and systems for low interfacial oxide contact between barrier and copper metallization The present invention relates to methods and systems for the metallization of semiconductor devices. One aspect of the present invention is a method of depositing a copper layer onto a barrier layer so as to produce a substantially oxygen free interface therebetween... | 07/06/2010 |
| 7615480 | Methods of post-contact back end of the line through-hole via integration Presented are methods of fabricating three-dimensional integrated circuits that include post-contact back end of line through-hole via integration for the three-dimensional integrated circuits. In one embodiment, the method comprises forming metal plug contacts thro... | 11/10/2009 |
| 7592259 | Methods and systems for barrier layer surface passivation This invention pertains to methods and systems for fabricating semiconductor devices. One aspect of the present invention is a method of depositing a gapfill copper layer onto barrier layer for semiconductor device metallization. In one embodiment, the method includ... | 09/22/2009 |
| 7299148 | Methods and apparatus for low distortion parameter measurements This invention seeks to provide methods and apparatus that can improve the accuracy of measured parameter data used for processing workpieces. One aspect of the present invention includes methods of measuring process conditions with low distortion of the measurement... | 11/20/2007 |
| 7282889 | Maintenance unit for a sensor apparatus Presented are methods, systems, and apparatuses for managing and maintaining an electronic device such as a sensor apparatus. ... | 10/16/2007 |
| 7212950 | Methods and apparatus for equipment matching and characterization Computer program products, methods, systems, and apparatus for fingerprinting and process matching process tools such as process tools used for processing workpieces are described. One embodiment includes a method to determine process matching of one or more process... | 05/01/2007 |
| 7127362 | Process tolerant methods and apparatus for obtaining data Data are collected for deriving response models and information required for developing and maintaining processes and process tools. Methods and apparatus for collecting the data include a process tolerant sensor apparatus capable of collecting data with less pertur... | 10/24/2006 |
| 7118461 | Smooth pads for CMP and polishing substrates Pads and methods of making the pads for applications such as polishing substrates and chemical mechanical planarization of substrates are provided. The pads include a substantially smooth surface for improved performance. ... | 10/10/2006 |
| 7073306 | Method of building This is an improved method of building with fibrous material though other materials can be substituted. A binding secures fibrous material to form a wall assembly (10). Wall surfacing (20) can be included in the binding and forming process, reducing th... | 07/11/2006 |
| 7016754 | Methods of and apparatus for controlling process profiles Presented are methods and apparatus for controlling the processing of a substrate during a process step that is sensitive to one or more process conditions. One embodiment includes a method performed with corresponding apparatus that includes a controller. One step ... | 03/21/2006 |
| 6989752 | Methods and apparatus for a security system Described are methods and apparatus for a security system. In one embodiment, the system includes capabilities to aid in locating an item that is being monitored when the item's location is unknown. The embodiment also includes capabilities for sounding an alarm whe... | 01/24/2006 |
| 6971036 | Methods and apparatus for low power delay control A method of producing a time delay is provided. The method is performed with an information processor having a first timer and a second timer. The information processor is capable of maintaining a sleep mode. The method involves using the second timer to measure the... | 11/29/2005 |
| 6907364 | Methods and apparatus for deriving thermal flux data for processing a workpiece Presented are methods, systems, and apparatus for deriving heat flux information and using heat flux information for a workpiece used in temperature sensitive processes. ... | 06/14/2005 |
| 6789034 | Data collection methods and apparatus with parasitic correction Information transfer is effected using a network of electrical signal conductors and sensors forming crosspoint connections. The sensors are capable of representing a measurement parameter as an electrical impedance. One embodiment of the present invention includes ... | 09/07/2004 |
| 6774060 | Methods and apparatus for thermally processing wafers The method provides a temperature controlled environment for processing semiconductor wafers at elevated temperatures. A hot wall process chamber is used for the process steps. The process chamber includes three zones with independent temperature control capabilitie... | 08/10/2004 |
| 6752599 | Apparatus for photoresist delivery A controller for a photoresist dispense pump is described that actively monitors the operation of the pump and dynamically determines completion of the refill of the pump. In one embodiment, pressure measurements are made during the refill step. Changes in the press... | 06/22/2004 |
| 6741945 | Sensor geometry correction methods and apparatus Described are methods and apparatus for collecting measured parameter data for applications such as deriving response models and information required for developing and maintaining processes and process tools. The methods and apparatus are capable of deriving correc... | 05/25/2004 |
| 6738722 | Data collection and correction methods and apparatus Described are methods and apparatus for collecting measured parameter data for applications such as deriving response models and information required for developing and maintaining processes and process tools. The methods and apparatus are capable of deriving correc... | 05/18/2004 |
| 6719456 | Methods and apparatus for firefighting A method of detecting fire ignition sources includes using an electronic temperature sensor to probe potential ignition sites. The fire hazards for the sites are determined based on at least one of measurements of temperatures at or near the site, measurements of ra... | 04/13/2004 |
| 6696662 | Methods and apparatus for plasma processing Plasma processing is carried out at pressures of about atmospheric pressure, at pressures below atmospheric pressure, or at pressures above atmospheric pressure. The plasmas are generated using a RF power source and a rectangular waveguide. The plasmas ca... | 02/24/2004 |
| 6691068 | Methods and apparatus for obtaining data for process operation, optimization, monitoring, and control Data are collected for deriving response models and information required for developing and maintaining processes and process tools. Methods and apparatus for collecting the data include a sensor apparatus capable of collecting data with less perturbation... | 02/10/2004 |
| 6671660 | Methods and apparatus for power control Described are methods and apparatus that can provide increased power use efficiency for some applications of wireless telecommunications devices. An aspect of the present invention includes an apparatus for wireless communication. The apparatus includes a... | 12/30/2003 |
| 6542835 | Data collection methods and apparatus Information transfer is effected using a network of electrical signal conductors and sensors forming crosspoint connections. The sensors are capable of representing a measurement parameter as an electrical impedance. One embodiment of the present inventio... | 04/01/2003 |
| 6392210 | Methods and apparatus for RF power process operations with automatic input power control A variable frequency RF power delivery system is used with a control system that adjusts the output frequency of the RF power delivery system. Frequency adjustments are made so as to maintain the required input current and input voltage within the capabil... | 05/21/2002 |
| 6331212 | Methods and apparatus for thermally processing wafers The apparatus provides a temperature controlled environment for processing semiconductor wafers at elevated temperatures. A hot wall process chamber is used for the process steps. The process chamber includes three zones with independent temperature contr... | 12/18/2001 |
| 6326584 | Methods and apparatus for RF power delivery RF power is delivered to a load in an RF power processor for carrying out process operations. The RF power delivery is performed using a variable frequency RF power amplifier and a control system. The control system maintains RF power delivery using contr... | 12/04/2001 |
| 6291938 | Methods and apparatus for igniting and sustaining inductively coupled plasma Plasma processing is carried out in an apparatus having improved stability and reliability for plasma ignition. The improved plasma ignition characteristics result from a modified RF induction coil. One or more nonresonant sections have been added to the ... | 09/18/2001 |
| 6156667 | Methods and apparatus for plasma processing The reliability of a plasma processing chamber has been increased using a heat moderating material to facilitate controlling heat removal from dielectric parts of the plasma chamber. The heat moderating material performs at least one of the functions: mod... | 12/05/2000 |
