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| Number | Title | Issue Date |
| 6395128 | RF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor deposition Plasma enhanced chemical vapor deposition (PECVD) reactors and methods of effecting the same are described. In accordance with a preferred implementation, a reaction chamber includes first and second electrodes operably associated therewith. A single RF p... | 05/28/2002 |
| 6387556 | Fuel cell power systems and methods of controlling a fuel cell power system Fuel cell power systems and methods of controlling a fuel cell power system are provided. According to one aspect, a fuel cell power system includes a plurality of fuel cells electrically coupled with plural terminals and individually configured to conver... | 05/14/2002 |
| 6356495 | Memory array architecture, method of operating a dynamic random access memory, and method of manufacturing a dynamic random access memory A dynamic random access memory includes a plate line; a digit line; a memory cell selectively coupled between the digit line and the plate line; sense circuitry selectively coupled to the memory cell to read the memory cell and capable of applying a first... | 03/12/2002 |
| 6352933 | Methods of forming insulating materials between conductive components and methods of forming insulating materials around a conductive component In one aspect, the invention encompasses a method of forming an insulating material around a conductive component. A first material is chemical vapor deposited over and around a conductive component. Cavities are formed within the first material. After th... | 03/05/2002 |
| 6342843 | Communications system and method with D/A converter A communications system including a radio frequency identification device including an integrated circuit having a single die including a microprocessor, a receiver coupled to the microprocessor, and a backscatter transmitter coupled to the microprocessor... | 01/29/2002 |
| 6339011 | Method of forming semiconductive active area having a proximity gettering region therein and method of processing a monocrystalline silicon substrate to have a proximity gettering region In one implementation, A method of forming semiconductive material active area having a proximity gettering region received therein includes providing a substrate comprising bulk semiconductive material. A proximity gettering region is formed within the b... | 01/15/2002 |
| 6338460 | Lap type siding mounted Christmas light clip A siding mounted light clip is described for releasable attachment to a lap type siding member. The clip includes a clip body with a light mount part and a siding mount part. The siding mount part includes a base member with a flange configured to slide u... | 01/15/2002 |
| 6337237 | Capacitor processing method and DRAM processing method A capacitor processing method includes forming a capacitor comprising first and second electrodes having a capacitor dielectric region therebetween. The first electrode interfaces with the capacitor dielectric region at a first interface. The second elect... | 01/08/2002 |
| 6337274 | Methods of forming buried bit line memory circuitry The invention includes buried bit line memory circuitry, methods of forming buried bit line memory circuitry, and semiconductor processing methods of forming conductive lines. In but one implementation, a semiconductor processing method of forming a condu... | 01/08/2002 |
| 6337261 | Semiconductor processing methods of forming integrated circuitry and semiconductor processing methods of forming dynamic random access memory (DRAM) circuitry Semiconductor processing methods of forming integrated circuitry, and in particular, dynamic random access memory (DRAM) circuitry are described. In one embodiment, a single masking step is utilized to form mask openings over a substrate, and both impurit... | 01/08/2002 |
| 6335049 | Chemical vapor deposition methods of forming a high K dielectric layer and methods of forming a capacitor A chemical vapor deposition method of forming a high k dielectric layer includes positioning a substrate within a chemical vapor deposition reactor. At least one metal comprising precursor and N2 O are provided within the reactor under conditio... | 01/01/2002 |
| 6335237 | Methods of forming capacitor and bitline structures The invention encompasses a method of forming bitlines. A substrate is provided, and comprises a plurality of spaced electrical nodes. A bitline layer is formed over at least some of the spaced electrical nodes. The bitline layer comprises at least one co... | 01/01/2002 |
| 6335270 | Semiconductor processing methods of forming contact openings, methods of forming memory circuitry, methods of forming electrical connections, and methods of forming dynamic random access memory (DRAM) circuitry Methods of forming contact openings, memory circuitry, and dynamic random access memory (DRAM) circuitry are described. In one implementation, an array of word lines and bit lines are formed over a substrate surface and separated by an intervening insulat... | 01/01/2002 |
| 6335282 | Method of forming a titanium comprising layer and method of forming a conductive silicide contact The invention includes methods of forming titanium comprising layers, and methods of forming conductive silicide contacts. In one implementation, a method of forming a titanium comprising layer includes chemical vapor depositing a layer a majority of whic... | 01/01/2002 |
| 6333225 | Integrated circuitry and methods of forming circuitry In one aspect, the invention includes a method of forming circuitry comprising: a) forming a capacitor electrode over one region of a substrate: b) forming a capacitor dielectric layer proximate the electrode; c) forming a conductive diffusion barrier lay... | 12/25/2001 |
| 6331461 | Semiconductor processing methods of forming devices on a substrate, forming device arrays on a substrate, forming conductive lines on a substrate, and forming capacitor arrays on a substrate, and integrated circuitry Semiconductor processing methods include forming a plurality of patterned device outlines over a semiconductor substrate, forming electrically insulative partitions or spacers on at least a portion of the patterned device outlines, and forming a plurality... | 12/18/2001 |
| 6323104 | Method of forming an integrated circuitry isolation trench, method of forming integrated circuitry, and integrated circuitry A method of forming an integrated circuitry trench isolation region includes etching a first portion of an isolation trench into a semiconductor substrate. The first portion has laterally opposing sidewalls and a trench base extending therebetween. A seco... | 11/27/2001 |
| 6319644 | Methods of reducing proximity effects in lithographic processes Methods of reducing proximity effects in lithographic processes wherein an integrated circuitry pattern is transferred from a mask onto a semiconductor substrate are described. In one embodiment, a desired spacing is defined between a main feature which i... | 11/20/2001 |
| 6316975 | Radio frequency data communications device A radio frequency identification device comprises an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single... | 11/13/2001 |
| 6312988 | Methods of forming capacitors, methods of forming capacitor-over-bit line memory circuitry, and related integrated circuitry constructions Methods of forming capacitors, methods of forming capacitor-over-bit line memory circuitry, and related integrated circuitry constructions are described. In one embodiment, a capacitor storage node is formed having an uppermost surface and an overlying in... | 11/06/2001 |
| 6304185 | Devices for sensing living organisms, devices for sensing termites, methods of forming devices for sensing termites, and methods for sensing termites The invention encompasses a device for sensing living organisms. Such device comprises a loop of conductive material extending over a substrate, and an insulative protective material over the loop of conductive material. The device further comprises a cir... | 10/16/2001 |
| 6300671 | Semiconductor wafer assemblies comprising photoresist over silicon nitride materials In one aspect, the invention includes a semiconductor processing method, comprising: a) providing a silicon nitride material having a surface; b) forming a barrier layer over the surface of the material, the barrier layer comprising silicon and nitrogen; ... | 10/09/2001 |
| 6300214 | Semiconductor processing methods of forming capacitor arrays on a substrate Semiconductor processing methods include forming a plurality of patterned device outlines over a semiconductor substrate, forming electrically insulative partitions or spacers on at least a portion of the patterned device outlines, and forming a plurality... | 10/09/2001 |
| 6297655 | Integrated circuit probing method A circuit probing method includes contacting a conductive probe with a contact pad of an electronic circuit. An electric signal is sent between the contacted probe and the contact pad. After sending the signal, the conductive probe and contact pad are rem... | 10/02/2001 |
| 6294455 | Conductive lines, coaxial lines, integrated circuitry, and methods of forming conductive lines, coaxial lines, and integrated circuitry Conductive lines, such as co-axial lines, integrated circuitry incorporating such conductive lines, and methods of forming the same are described. In one aspect, a substrate having an outer surface is provided. A masking material is formed over the outer ... | 09/25/2001 |
| 6286658 | Vibratory conveyor A vibratory conveyor employing an amplitude compensator to substantially impede the conveyor bed from moving beyond a given range of vibration amplitude is described. The amplitude compensator coacts with the conveyor bed as the vibrational amplitude of t... | 09/11/2001 |
| 6281447 | Substrate structure A semiconductor substrate structure includes a conductor supported by a substrate, and has an outer surface and a pair of spaced-apart conductive sidewalls joining with the outer surface at respective corners. A first layer of material is disposed over th... | 08/28/2001 |
| 6281058 | Method of forming DRAM circuitry on a semiconductor substrate A method of forming DRAM circuitry includes, a) defining a memory array area on a substrate for formation of first conductivity type DRAM field effect transistors and defining an area peripheral to the array on the substrate for formation of second conduc... | 08/28/2001 |
| 6281083 | Methods of forming field effect transistor gates, and methods of forming integrated circuitry A method of forming integrated circuitry includes forming a field effect transistor gate over a substrate. The gate comprises semiconductive material conductively doped with a conductivity enhancing impurity of a first type and a conductive diffusion barr... | 08/28/2001 |
| 6277737 | Semiconductor processing methods and integrated circuitry In aspect, the invention includes a semiconductor processing method comprising: a) forming an electrically insulative layer over a substrate; b) forming an opening within the electrically insulative layer, the opening having a periphery defined at least i... | 08/21/2001 |
| 6277687 | Method of forming a pair of capacitors having a common capacitor electrode, method of forming DRAM circuitry, integrated circuitry and DRAM circuitry A method of forming a pair of capacitors having a common capacitor electrode includes forming a pair of spaced first capacitor electrodes within insulating material. The first electrodes have uppermost surfaces which are below an uppermost surface of the ... | 08/21/2001 |
| 6277000 | Polishing chucks, semiconductor wafer polishing chucks, abrading method, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks are described. In one aspect a polishing chuck includes a body dimensioned to hold ... | 08/21/2001 |
| 6278369 | Methods of tagging an object having a conductive surface A transponder module includes a circuit board having top and bottom surfaces and an inverted-F receive antenna formed on the circuit board. The receive antenna includes a ground plane formed on one of the surfaces and an active element formed above the gr... | 08/21/2001 |
| 6271597 | Methods for forming electrically conductive interconnections and electrically interconnected substrates Methods of forming electrically conductive interconnections and electrically interconnected substrates are described. In one implementation, a first substrate having an outer surface is provided and a layer of material is formed thereover. Openings are fo... | 08/07/2001 |
| 6271153 | Semiconductor processing method and trench isolation method The invention includes semiconductor processing methods, including trench isolation. In one implementation, an oxide layer is deposited over a substrate. The deposited oxide layer is exposed to a chlorine containing gas effective to getter metals outwardl... | 08/07/2001 |
| 6268078 | Thin-profile battery circuits and constructions, button-type battery circuits and constructions, methods of forming thin-profile battery circuits and constructions, and methods of forming button-type battery circuits and constructions Thin-profile battery circuits and constructions, and in particular button-type battery circuits and constructions and methods of forming the same are described. In one implementation, a substrate is provided having an outer surface with a pair of spaced e... | 07/31/2001 |
| 6260775 | Fuel injector including outer valve needle and inner valve needle slidable within a passage provided in the outer valve needle A fuel injector includes a first needle, and a second needle slidable within a passage formed in the first needle. The needles are engageable with respective seatings to control fuel delivery through respective groups of outlet openings. A load transmitte... | 07/17/2001 |
| 6255186 | Methods of forming integrated circuitry and capacitors having a capacitor electrode having a base and a pair of walls projecting upwardly therefrom In accordance with one implementation the invention, a capacitor comprises two conductive capacitor electrodes separated by a capacitor dielectric layer, with at least one of the capacitor electrodes comprising at least one of Pt and Pd, and also comprisi... | 07/03/2001 |
| 6255993 | Right and left hand circularly polarized RFID backscatter antenna An antenna, system and method for transmitting and receiving RF signals over a first frequency band using a single antenna or two closely spaced antennas. In one embodiment, the antenna is configured to receive first signals in the first frequency band ha... | 07/03/2001 |
| 6251470 | Methods of forming insulating materials, and methods of forming insulating materials around a conductive component In one aspect, the invention encompasses a method of forming an insulating material around a conductive component. A first material is chemical vapor deposited over and around a conductive component. Cavities are formed within the first material. After th... | 06/26/2001 |
