Did You Know...
...When G.G. Hubbard learned of his future son-in-law's invention, he called it "only a toy." His daughter was engaged to a young man named Alexander Graham Bell.
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| Number | Title | Issue Date |
| 7544578 | Structure and method for stochastic integrated circuit personalization A method of forming a stochastically based integrated circuit encryption structure includes forming a lower conductive layer over a substrate, forming a short prevention layer over the lower conductive layer, forming an intermediate layer over the short prevention l... | 06/09/2009 |
| 7514271 | Method of forming high density planar magnetic domain wall memory A method of forming a magnetic domain wall memory apparatus with write/read capability includes forming a plurality of coplanar shift register structures each comprising an elongated track formed from a ferromagnetic material having a plurality of magnetic domains t... | 04/07/2009 |
| 7501345 | Selective silicide formation by electrodeposit displacement reaction Silicide formation processes are disclosed that use an electrochemical displacement reaction in the absence of an externally applied current or potential. In an embodiment, a method for forming an integrated circuit comprises: depositing a metallic material upon sel... | 03/10/2009 |
| 7227265 | Electroplated copper interconnection structure, process for making and electroplating bath Interconnect structures with copper conductors being at least substantially free of internal seams or voids are obtained employing an electroplating copper bath containing dissolved cupric salt wherein the concentration of the salt is at least about 0.4 molar and up... | 06/05/2007 |
| 7223654 | MIM capacitor and method of fabricating same A damascene MIM capacitor and a method of fabricating the MIM capacitor. The MIN capacitor includes a dielectric layer having top and bottom surfaces; a trench in the dielectric layer, the trench extending from the top surface to the bottom surface of the dielectric... | 05/29/2007 |
| 7214548 | Apparatus and method for flattening a warped substrate A method, apparatus, and computer program product for flattening a warped substrate. The substrate is placed on a planar surface of a clamping apparatus in direct mechanical contact with the planar surface. The substrate comprises surface regions S1, S | 05/08/2007 |
| 7190079 | Selective capping of copper wiring Patterned copper structures are fabricated by selectively capping the copper employing selective etching and/or selective electroplating in the presence of a liner material. Apparatus for addressing the problem of an increased resistive path as electrolyte during el... | 03/13/2007 |
| 6979393 | Method for plating copper conductors and devices formed A method for plating copper conductors on an electronic substrate and devices formed are disclosed. In the method, an electroplating copper bath that is filled with an electroplating solution kept at a temperature between about 0° C. and about 18° C. is first prov... | 12/27/2005 |
| 6953984 | Hydrogenated oxidized silicon carbon material A low dielectric constant, thermally stable hydrogenated oxidized silicon carbon film which can be used as an interconnect dielectric in IC chips is disclosed. Also disclosed is a method for fabricating a thermally stable hydrogenated oxidized silicon carbon low die... | 10/11/2005 |
| 6733602 | Polycrystalline material with surface features projecting from a surface thereof A method of forming extruded structures from a polycrystalline material and structures formed thereby. The method generally entails forming a structure that comprises a polycrystalline material constrained by a second material in all but one direction, with the poly... | 05/11/2004 |
