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| Number | Title | Issue Date |
| 6306652 | Packaging systems for human recombinant adenovirus to be used in gene therapy Presented are ways to address the problem of replication competent adenovirus in adenoviral production for use with, for example, gene therapy. Packaging cells having no overlapping sequences with a selected vector and are suited for large scale productio... | 10/23/2001 |
| 6201304 | Flip chip adaptor package for bare die A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead placement arrangement. The board comprises a printed circu... | 03/13/2001 |
| 6152735 | Whip arm mounting for dental delivery system control head This invention is directed to a whip arm mounting (26) of the European style whip arms on the control head (10) of a dental delivery system, where multiple whip arms (26) are automatically centered and returned to the center rest or storage position witho... | 11/28/2000 |
| 6149481 | Extended life disposable pulse oximetry sensor and method of making An oximetry sensor comprising a foam wrap member including a fastener, back film mounting member, LED assembly and photodiode connected to a cable, support rings for the LED assembly and photodiode, window film for the LED assembly and photodiode, and a t... | 11/21/2000 |
| 6144083 | Method of reducing defects in anti-reflective coatings and semiconductor structures fabricated thereby A method of fabricating a substantially smooth-surfaced anti-reflective coating on a semiconductor device structure including generating a plasma from an inert gas in a process chamber in which the substantially smooth anti-reflective coating is to be dep... | 11/07/2000 |
| 6143589 | Tape under frame for conventional-type IC package assembly A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a section of tape that is supported by the ends of the lead ... | 11/07/2000 |
| 6144089 | Inner-digitized bond fingers on bus bars of semiconductor device package A semiconductor device package is formed with a lead frame including a plurality of lead members positioned in an array, and a semiconductor die is secured to the lead frame. At least one pair of bus bars is connected to the lead frame and positioned over... | 11/07/2000 |
| 6140827 | Method and apparatus for testing bumped die A method and apparatus for testing unpackaged semiconductor dice having raised contact locations is disclosed. The apparatus uses a temporary interconnect wafer that is adapted to establish an electrical connection with the raised ball contact locations o... | 10/31/2000 |
| 6140160 | Method for fabricating a simplified CMOS polysilicon thin film transistor and resulting structure A method of forming a MOS device using doped and activated n-type and p-type polysilicon layers wherein a first doped and activated polysilicon layer (either n-type and-p-type) is patterned on a substrate. An isolation material layer is formed abutting th... | 10/31/2000 |
| 6140154 | Multi-part lead frame with dissimilar materials and method of manufacturing A multi-part lead frame die assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame assemb... | 10/31/2000 |
| 6140696 | Vertically mountable semiconductor device and methods A vertically mountable semiconductor device including a plurality of bond pads disposed proximate to a single edge thereof. The bond pads are bumped with an electrically conductive material. The semiconductor device may also include a support member. Alte... | 10/31/2000 |
| 6138256 | Intelligent binning for electrically repairable semiconductor chips The present invention relates to a system and method for testing one or more semiconductor devices (e.g. packaged chips). Test equipment performs at least tests of a first type on the semiconductor device and identifies failures in the semiconductor devic... | 10/24/2000 |
| 6133638 | Die-to-insert permanent connection and method of forming The invention disclosed herein is a semiconductor die assembly and method of making the same having a die and insert substrate that are electrically interconnected by diffusing gold bumps attached to the connecting surface of the substrate to aluminum-bas... | 10/17/2000 |
| 6133622 | High speed IC package configuration Devices and methods for reducing lead inductance in integrated circuit (IC) packages. More specifically to an integrated circuit package configuration for high speed applications where the inductance of the leads is reduced or minimized in high capacity s... | 10/17/2000 |
| 6132570 | Method and apparatus for continuous processing of semiconductor wafers An electrochemical reaction assembly and methods of inducing electrochemical reactions, such as for deposition of materials on semiconductor substrates. The assembly and method achieve a highly uniform thickness and composition of deposition material or u... | 10/17/2000 |
| 6131255 | Repairable wafer scale integration system An apparatus for integrating wafer scale semiconductor integrated circuits and interfacing them with other systems. A wafer, partial wafer, die or plurality of same are mated to a printed circuit board (PCB) which electrically contacts the pads on each di... | 10/17/2000 |
| 6134111 | Vertical surface mount apparatus with thermal carrier A high density vertical surface mount package and thermal carrier therefor including a heat sink.... | 10/17/2000 |
| 6130474 | Leads under chip IC package A semiconductor device assembly including a semiconductor device having a plurality of bond pads on the active surface thereof and a lead frame having a portion of the plurality of lead fingers of the lead frame located below the semiconductor device in a... | 10/10/2000 |
| 6128518 | System and method for in-vivo hematocrit measurement using impedance and pressure plethysmography The hematocrit of blood (i.e., the percentage of whole blood volume occupied by red blood cells) perfusing a finger is determined by stimulating the finger with two current frequencies, one relatively high (e.g., 10 MHZ) and the other relatively low (e.g.... | 10/03/2000 |
| 6127096 | Method for reducing photolithographic steps in a semiconductor interconnect process A semiconductor wafer having a first layer and overlying insulating layer receives a photoresist layer. A first photoresist area is exposed to light having a first dosage, while a second, adjacent photoresist area is concurrently exposed to light having a... | 10/03/2000 |
| 6126062 | Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide ... | 10/03/2000 |
| 6125947 | Earth-boring drill bits with enhanced formation cuttings removal features and methods of drilling Rotary drag bits with enhanced formation cuttings removal achieved by apportioning drilling fluid flow in relationship to cuttings volume generated by various groups of cutters on the bit, each cutter group being located on a different blade of the bit. T... | 10/03/2000 |
| 6124634 | Micromachined chip scale package A chip scale package comprised of a semiconductor die having a silicon blank laminated to its active surface. The bond pads of the die are accessed through apertures micromachined through the blank. The package may be employed with wire bonds, or solder o... | 09/26/2000 |
| 6124565 | Laser cutting machine A laser cutting machine includes a driving apparatus for moving a laser head axially. An inner sleeve having a converging lens is coupled to the laser head. An outer sleeve having a nozzle is supported to move relative to the inner sleeve. A braking mecha... | 09/26/2000 |
| 6124150 | Transverse hybrid LOC package A hybrid semiconductor package is formed from a die having two opposed elongate die edges with conductive bond pads arranged transversely relative to the rows of outer leads. A first portion of inner leads is off-die wire bonded to some of the bond pads, ... | 09/26/2000 |
| 6123160 | Drill bit with gage definition region A drill bit and method of drilling employing a gage definition region on the bit to relatively gradually and incrementally increase the diameter of the borehole being drilled from a diameter that is cut by fixed face cutters or rolling cone cutters on the... | 09/26/2000 |
| 6124665 | Row lines of a field emission array and forming pixel openings therethrough A method of fabricating row lines over a field emission array. The method employs only two mask steps to define row lines and pixel openings through selected regions of each of the row lines. In accordance with the method of the resent invention, a layer ... | 09/26/2000 |
| 6121070 | Flip chip down-bond: method and apparatus A flip-chip semiconductor device comprises a carrier substrate having a conductor pattern on at least one side and at least one semiconductor die with an active surface and an opposed ground surface. A conductive backing plate is conductively bonded to th... | 09/19/2000 |
| 6120627 | Explosive with bioremediating capacity Technology for in situ remediation of undetonated explosive material. An explosive apparatus contains an explosive material in close proximity with microorganisms. An explosive mixture capable of self remediation in the form of an explosive material is in... | 09/19/2000 |
| 6121067 | Method for additive de-marking of packaged integrated circuits and resulting packages A method for additively de-marking a packaged integrated circuit die bearing engraved marking indicia on an exterior surface thereof. The marked surface is covered with an overlayer of material to fill the engraved markings and provide a surface suitable ... | 09/19/2000 |
| 6117351 | Method for etching dielectric films A method for removing a plurality of dielectric films from a supporting substrate by providing a substrate with a second dielectric layer overlying a first dielectric layer, contacting the substrate at a first temperature with a first acid solution exhibi... | 09/12/2000 |
| 6116974 | Spacers, display devices containing the same, and methods for making and using the same A display device, and a method for making and operating the display device are described. The display device comprises a base plate containing at least one emitter, a display screen, and a spacer located between the base plate and display screen, where th... | 09/12/2000 |
| 6116907 | System and method for encoding and retrieving visual signals A method and system are disclosed for encoding signs in a given sign language. The sign typically uses a dominant hand for some signs and a second hand is used for other signs the dominant hand remaining dominant of the two hands. In order to encode the s... | 09/12/2000 |
| 6116356 | Reaming apparatus and method with enhanced stability and transition from pilot hole to enlarged bore diameter A method and apparatus for reaming or enlarging a borehole with enhanced stability. A pilot stabilization pad (PSP) having an axially and circumferentially tapered entry surface and a circumferential transition surface thereabove is employed to enhance th... | 09/12/2000 |
| 6118291 | Test socket and methods A test socket for testing a vertical surface mount packaged semiconductor device, the test socket including a test substrate, a support member, and clamps. The test substrate includes terminals which are electrically connectable to a testing device. The s... | 09/12/2000 |
| 6118713 | Device and method for stress testing a semiconduction memory A DRAM is stress tested by writing a logic bit in a weakened state from a sense amplifier of the DRAM to a sub-array of the DRAM. This is accomplished by reducing an upper rail voltage supplied to a P-sense amp in the sense amplifier and increasing a lowe... | 09/12/2000 |
| 6117793 | Using silicide cap as an etch stop for multilayer metal process and structures so formed A layered trace configuration comprising a conductive trace capped with a silicide material which allows for removal of oxide polymer residues forming in vias used for interlayer contacts in a multilayer semiconductor device and eliminates or greatly redu... | 09/12/2000 |
| 6117382 | Method for encasing array packages The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator. The pair of devices is posi... | 09/12/2000 |
| 6112836 | Rotary drill bits employing tandem gage pad arrangement A rotary drag bit being suitable for directional drilling. The bit includes a bit body from which extend radially-oriented blades carrying PDC cutters. The blades extend to primary gage pads, above which secondary gage pads are either longitudinally space... | 09/05/2000 |
| 6114756 | Interdigitated capacitor design for integrated circuit leadframes A semiconductor device includes a two-part, coplanar, interdigitated decoupling capacitor formed as a part of the conductive lead frame. For down-bonded dice, the die attach paddle is formed as the interdigitated member. Alternatively, an interdigitated c... | 09/05/2000 |
