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| Number | Title | Issue Date |
| 7667854 | Hand-held survey probe A system for providing operational feedback to a user of a detection probe may include an optical sensor to generate data corresponding to a position of the detection probe with respect to a surface; a microprocessor to receive the data; a software medium having cod... | 02/23/2010 |
| D603144 | Cap with extendable interior flap | 11/03/2009 |
| D600872 | Cleaning cart | 09/22/2009 |
| 7557603 | Method and apparatus for output driver calibration, and memory devices and system embodying same A method, system, and output driver calibration circuit determine calibration values for configuring adjustable impedance output drivers. The calibration circuit includes a pull-up calibration circuit configured to generate an averaged pull-up count signal for calib... | 07/07/2009 |
| 7549485 | Expandable reamer apparatus for enlarging subterranean boreholes and methods of use An expandable reamer apparatus and methods for reaming a borehole are disclosed, including at least one laterally movable blade carried by a tubular body selectively positioned at an inward position and an expanded position. The at least one laterally movable blade,... | 06/23/2009 |
| 7549374 | Fuze mounting for a penetrator and method thereof A fuze mounting assembly for a penetrating weapon configured as a projectable device, the fuze mounting assembly having fasteners, a fuze well and a fuze. The fuze includes an integral bolt flange for securing to the fuze well with the fasteners, wherein an amplific... | 06/23/2009 |
| D594631 | Sports bra | 06/23/2009 |
| 6831219 | Chromatic music notation system The harmonic structure of music is visually represented by establishing a correlation of each degree of the diatonic scale with a specified color and applying that correlation to a musical composition so that each note of the composition is represented by the respec... | 12/14/2004 |
| 7355273 | Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods An apparatus and method of rerouting redistribution lines from an active surface of a semiconductor substrate to a back surface thereof and assembling and packaging individual and multiple semiconductor dice with such rerouted redistribution lines formed thereon. Th... | 04/08/2008 |
| 7339423 | Technique to improve the gain and signal to noise ratio in CMOS switched capacitor amplifiers The present invention comprises switched capacitor amplifiers including positive feedback on semiconductor devices, wafers, and systems incorporating same and methods for amplifying signals using positive feedback, while maintaining a stable gain and producing an im... | 03/04/2008 |
| 7329945 | Flip-chip adaptor package for bare die A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead placement arrangement. The board comprises a printed circuit board in... | 02/12/2008 |
| 7307353 | Technique for attaching die to leads A semiconductor die assembly comprising a semiconductor die with bond pads, a plurality of leads which extend across the semiconductor die and terminates over their respective bond pads, and an alpha barrier preferably positioned between the leads and the semiconduc... | 12/11/2007 |
| 7304516 | Method and apparatus for digital phase generation for high frequency clock applications An apparatus and method for generating phase-related clocks are disclosed. A clock input is delayed by an alignment magnitude to generate a first phase signal. The first phase signal is delayed by the phase alignment magnitude to generate a first phase delay signal.... | 12/04/2007 |
| 7297637 | Use of pulsed grounding source in a plasma reactor A method for grounding a semiconductor substrate pedestal during a portion of a high voltage power bias oscillation cycle to reduce or eliminate the detrimental effects of feature charging during the operation of a plasma reactor. ... | 11/20/2007 |
| 7294790 | Apparatus for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer Apparatus is provided for measuring the potential for mutual coupling in an integrated circuit package of any type or configuration using a network analyzer in conjunction with a coaxial test probe. Simple, low-cost test fixturing and methods of testing may be used ... | 11/13/2007 |
| 7288441 | Method for two-stage transfer molding device to encapsulate MMC module A method for fabricating a semiconductor card includes a printed circuit substrate upon which is mounted a card circuit including one or more semiconductor components such as dice or packages. External contacts link the card circuit to the circuit of another apparat... | 10/30/2007 |
| 7288953 | Method for testing using a universal wafer carrier for wafer level die burn-in A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the ... | 10/30/2007 |
| 7285442 | Stackable ceramic FBGA for high thermal applications An apparatus package for high-temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor devices. ... | 10/23/2007 |
| 7285037 | Systems including differential pressure application apparatus A differential pressure application apparatus is configured to apply different amounts of pressure to different locations of a substrate, such as a semiconductor device structure. The apparatus may be used during polishing or planarization processes. The apparatus i... | 10/23/2007 |
| 7285850 | Support elements for semiconductor devices with peripherally located bond pads A support structure for a semiconductor device with peripherally disposed contacts includes a support substrate and at least one conductive column protruding from the support substrate. The at least one conductive column is configured to contact an outer connector o... | 10/23/2007 |
| 7281952 | Edge connector including internal layer contact, printed circuit board and electronic module incorporating same An edge connector, system, printed circuit board and electronic module are described, which include an edge connector comprised of a substrate, including a first major exterior surface, a second major exterior surface, and a minor exterior surface. The edge connecto... | 10/16/2007 |
| 7282805 | Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element A rerouting element for a semiconductor device includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that correspond to the locations of bond pads of a semiconductor device wit... | 10/16/2007 |
| 7282794 | Multiple die stack apparatus employing t-shaped interposer elements Multiple integrated circuit devices in a stacked configuration that use a spacing element for allowing increased device density and increased thermal conduction or heat removal for semiconductor devices and the methods for the stacking thereof are disclosed. ... | 10/16/2007 |
| 7282457 | Apparatus for stabilizing high pressure oxidation of a semiconductor device A method and apparatus for preventing N2O from becoming super critical during a high pressure oxidation stage within a high pressure oxidation furnace is disclosed. The method and apparatus utilize a catalyst to catalytically disassociate N2O a... | 10/16/2007 |
| 7282439 | Anti-reflective coating doped with carbon for use in integrated circuit technology and method of formation The invention pertains to films comprising silicon, oxygen and carbon and the use of the films in integrated circuit technology, such as capacitor constructions, DRAM constructions, semiconductive material assemblies, etching processes, and methods for forming capac... | 10/16/2007 |
| 7282397 | Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices A rerouting element for a semiconductor device includes a substantially planar member that carries at least one contact location, at least one conductive, at least one rerouted bond pad. The contact location is positioned adjacent to a first periphered edge of the s... | 10/16/2007 |
| 7279788 | Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate A spring contact for establishing electrical contact between a lead element of an IC device and a substrate. The spring contact generally comprises a contact portion and a base portion. The contact portion, which generally comprises a coil-type compression spring, i... | 10/09/2007 |
| 7279780 | Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same A quad flat no-lead (QFN) grid array semiconductor package and method for making the same are provided. The package includes a semiconductor die and a lead frame having a plurality of conductive elements patterned in a grid-type array. A plurality of bond pads on th... | 10/09/2007 |
| 7279781 | Two-stage transfer molding device to encapsulate MMC module A semiconductor card includes a printed circuit substrate upon which is mounted a card circuit including one or more semiconductor components such as dice or packages. External contacts link the card circuit to the circuit of another apparatus by removable insertion... | 10/09/2007 |
| 7280162 | Apparatus for assisting video compression in a computer system One embodiment of the present invention provides an apparatus that facilitates compression of video data in a computer system by performing the time-consuming task of computing the difference between successive frames of video data. Thus, one embodiment of the prese... | 10/09/2007 |
| 7276790 | Methods of forming a multi-chip module having discrete spacers An assembly method that includes providing a first semiconductor device and positioning a second semiconductor device at least partially over the first semiconductor device is disclosed. Spacers space the active surface of the first semiconductor device substantiall... | 10/02/2007 |
| 7276672 | Method for sorting integrated circuit devices A method for sorting integrated circuit (IC) devices of the type having a substantially unique identification (ID) code, such as a fuse ID, including automatically reading the ID code of each of the IC devices and sorting the IC devices in accordance with their auto... | 10/02/2007 |
| 7276449 | Gas assisted method for applying resist stripper and gas-resist stripper combinations A method for moving resist stripper across the surface of a semiconductor substrate includes applying a wet chemical resist stripper, such as an organic or oxidizing wet chemical resist stripper, to at least a portion of a photomask positioned over the semiconductor... | 10/02/2007 |
| 7276315 | Methods for generating or designing sidelobe inhibitors for radiation patterning tools Design methods and a computer-readable medium having computer-executable instructions thereon for sidelobe suppression in a radiation-patterning tool or mask. Sidelobe artifacts are mitigated by identifying elements as a function of the radiation wavelength for form... | 10/02/2007 |
| 7278038 | Operational voltage control circuit and method A method and apparatus for providing a preferred operating voltage to a memory device as specified by a stored configuration parameter. The apparatus includes a nonvolatile memory configured to store a preferred memory device voltage configuration corresponding to a... | 10/02/2007 |
| 7274239 | Method and apparatus to set a tuning range for an analog delay An apparatus and method for an analog fine delay line, a hybrid delay line, and a delay locked loop (DLL) is described. In the DLL, a coarse phase detector compares a reference signal and feedback signal in controlling coarse phase adjustment signals indicating whet... | 09/25/2007 |
| 7273684 | Mask having transmissive elements and a common sidelobe inhibitor for sidelobe suppression in radiated patterning A mask having transmissive elements and one or more sidelobe inhibitors for sidelobe suppression during a radiation-patterning process is provided. Sidelobe artifacts are mitigated by identifying elements as a function of the radiation wavelength for forming desired... | 09/25/2007 |
| 7274228 | Method and apparatus for digital phase generation at high frequencies An apparatus and method for generating phase related clocks, includes delaying a clock input by a cycle delay magnitude to generate a cycle delay signal and N delay taps is disclosed. Each delay tap has a delay equal to a fractional amount of the cycle delay magnitu... | 09/25/2007 |
| 7274220 | Method and apparatus for amplifying a regulated differential signal to a higher voltage A sense amplifier for use in a memory device and in a memory-resident system. The sense amplifier operates on a lower voltage consistent with the voltage range of the differential input data and the sense amplifier further operates on a higher voltage to level-shift... | 09/25/2007 |
| 7274138 | Spacers for field emission displays The disclosed method for forming a field emission display includes forming a cathode and an anode, forming a plurality of photoresist posts over the cathode, and coating the posts with a layer of coating material. The layer of coating material forms sidewalls around... | 09/25/2007 |
