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| Number | Title | Issue Date |
| 7495589 | Circuit and method for gain error correction in ADC Gain errors are corrected in an ADC chip including an integrator (17), a comparator (30), and a digital filter (37) by storing a gain-adjusted LSB size based on measured gain error in a memory (44). The gain-adjusted LSB size is applied t... | 02/24/2009 |
| 7495508 | Switched capacitor notch filter circuits Switched capacitor notch filter circuits are disclosed. An example switched capacitor notch filter circuit described herein includes a switched capacitor amplifier to receive an input signal and a first feedback signal, to amplify the input signal and the first feed... | 02/24/2009 |
| 7466201 | Class AB output stage and method for providing wide supply voltage range A class AB output stage includes first (MP) and a second (MN) output transistors having sources coupled to first (VDD) and second reference voltages, respectively, drains coupled to an output (13), and gates coupled to first (... | 12/16/2008 |
| 7453659 | Circuit and method for write current driver System and method for write current drivers for inductive heads used in mass storage drives. A preferred embodiment comprises a write current circuit coupled to an inductive write head, a MOS transistor boost circuit and a matching circuit, both coupled to the write... | 11/18/2008 |
| 7452799 | Ball film for integrated circuit fabrication and testing According to one embodiment of the invention, a method of fabricating ball grid array packages includes providing a substrate, providing a ball film that includes a plurality of metal balls movably contained within respective slots of a thin film, coupling the metal... | 11/18/2008 |
| 7450329 | Method to vary symmetry and coupling in symmetrical write drivers for disk driver preamplifiers The present invention achieves technical advantages as a preamplifier write driver (10) having a varying common-mode output voltage. This varying common-mode output voltage also adjusts the derivative of the common-mode voltage, which is proportional to the a... | 11/11/2008 |
| 7449924 | Latch-based serial port output buffer An integrated circuit (22) having a serial interface (25) with improved access times is disclosed. The serial interface (25) includes a serial output port arranged as a shift register of flip-flop stages (321 through 32n | 11/11/2008 |
| 7449783 | Nonlinear via arrays for resistors to reduce systematic circuit offsets A thin film resistor structure includes a plurality of thin film resistor sections. Conductive vias (5) are disposed on a first end of each of the thin film resistor sections, respectively. The first conductor (2) is connected to the vias of the first ... | 11/11/2008 |
| 7436168 | Test error detection method and system According to one embodiment, a method of test error detection for a wafer having a plurality of rows of integrated circuit (IC) chips is provided. The method includes determining that a first number of IC chips that are indicated as failing a test has increased from... | 10/14/2008 |
| 7413974 | Copper-metallized integrated circuits having electroless thick copper bond pads A metal structure (100) for a contact pad of a semiconductor, which has interconnecting traces of a first copper layer (102). The substrate is protected by an insulating overcoat (104). The first copper layer of first thickness and first crystal... | 08/19/2008 |
| 7402893 | System and method for improved auto-boating According to one embodiment of the invention, a system used in auto-boating includes a tape substrate supported by a boat. The tape substrate includes a pair of lateral edges parallel to one another and each having respective first and second ends, and a pair of lon... | 07/22/2008 |
| 7402270 | Method and system for integrated circuit packaging According to one embodiment of the invention, a mold tool for packaging integrated circuits includes a first mold press die including a first non-planar surface and a second mold press die including a second non-planar surface. The first and second non-planar surfac... | 07/22/2008 |
| 7400121 | Soft-start system for voltage regulator and method of implementing soft-start A system and method to provide a slow start up voltage, such as that can slowly ramp up or down by cyclically coupling a pair of associated energy storage devices, such as capacitors, during a start-up phase. The cyclic coupling of the capacitors, in conjunction wit... | 07/15/2008 |
| 7372649 | Apparatus and method for applying write signals for driving a write head An apparatus for use in applying write signals for driving a write head to effect writing information to a memory device; the write signals including a first write signal and a second write signal; includes: (a) a directing circuit receiving the write signals, direc... | 05/13/2008 |
| 7371673 | Method and apparatus for attaching an IC package to a PCB assembly A technique for attaching solder balls of a BGA to a PCB. In one example embodiment, this is accomplished by applying solder paste onto at least one of a plurality of contact pads on a PCB. At least one of a plurality of solder balls of an IC device are then onto th... | 05/13/2008 |
| 7358617 | Bond pad for ball grid array package A device (100) and a method (200) for controlling resin bleed, the device comprising a substrate (105) having a surface (107), an integrated circuit (115) having a plurality of leads (120) extending therefrom, and an adhesiv... | 04/15/2008 |
| 7326025 | System for detecting warped carriers and associated methods Disclosed herein is a warp detection system (200) for determining warping in a carrier (110) configured to carry substrates (120) for processing. In one embodiment, the system (200) includes a guide plate (210) configured to guide ... | 02/05/2008 |
| 7323362 | Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices A system (100) for manufacturing product, in which a first work station (101) is operable to perform a first manufacturing action on the product parts; this first station has a first entrance (101a) and a first exit 101b). A... | 01/29/2008 |
| 7268415 | Semiconductor device having post-mold nickel/palladium/gold plated leads A semiconductor device having a leadframe comprised of a base metal (110, e.g., copper), a chip mount pad (103) and a plurality of lead segments (104). Each of the segments has a first end (104a) near the mount pad and a second end... | 09/11/2007 |
