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| Number | Title | Issue Date |
| 8142640 | Chloride analysis in acid copper plating baths The chloride concentration in an acid copper plating bath is determined from the chloride oxidation current measured under controlled hydrodynamic conditions at a noble metal electrode using specific voltammetric parameters. The measurement is made directly on the u... | 03/27/2012 |
| 8118988 | Analysis of copper ion and complexing agent in copper plating baths A simple titration method involving a single copper ion titrant detected by a copper ion specific electrode provides the concentrations of both copper ions and bath complexing agent (ethylene diamine, for example) in alkaline copper electroplating baths of the type ... | 02/21/2012 |
| 8008087 | Analysis of silicon concentration in phosphoric acid etchant solutions Low concentrations of silicon in an etchant solution are analyzed by adding a predetermined concentration of fluoride ions to a test solution comprising a predetermined volume of the etchant solution, and measuring the concentration of fluoride ions in the test solu... | 08/30/2011 |
| 7932094 | Method and apparatus for determining the stability of an electroless plating bath The stability of an electroless plating bath for depositing a metal (e.g., nickel) is determined by titrating a sample of the plating bath with a titrant comprising ions of a catalytic metal (e.g., palladium) and detecting hydrogen released at the titration endpoint... | 04/26/2011 |
| 7879222 | Detection of additive breakdown products in acid copper plating baths An additive breakdown product in an acid copper plating bath sample is detected by performing a voltammetric analysis for the leveler additive in two measurement solutions comprising different volume fractions of the copper plating bath sample in a background electr... | 02/01/2011 |
| 7874423 | Device and method for displaying neckties The invention provides a device and a method for packaging of one or more neckties for retail display. The device includes a hanger part for hanging neckties on a rack, and a fastener part for holding the neckties together so as to maintain an orderly appearance. Th... | 01/25/2011 |
| 7653511 | Thermoconductimetric analyzer for soldering process improvement Performance of a flux in a soldering process is assessed by monitoring the activity of the flux via its electrical conductance measured using a probe having interdigitated metallic traces and a temperature sensor. The measured conductance-temperature time profile pr... | 01/26/2010 |
| 7327448 | Laser-ultrasonic detection of flip chip attachment defects Underfill voids and solder ball defects are detected via laser generation and laser detection of an ultrasonic wave at the top surface of flip chips. High resolution is provided by using small laser spot sizes and closely-spaced laser beams of wavelengths that are a... | 02/05/2008 |
| 7291253 | Detection of an unstable additive breakdown product in a plating bath The 3-mercaptopropylsulfonic acid (MPSA) breakdown product of the bis(sodiumsulfopropyl)disulfide (SPS) additive used in acid copper plating baths accelerates copper electrodeposition and can be detected by cyclic voltammetric stripping (CVS) analysis. In the presen... | 11/06/2007 |
| 7278315 | Laser-ultrasonic detection of subsurface defects in processed metals Subsurface defects in a processed metal are detected by a laser-ultrasonic method involving generation of a surface acoustic wave at one location on the processed metal surface, and detection of a scattered acoustic wave at another location on the processed metal su... | 10/09/2007 |
| 7186326 | Efficient analysis of organic additives in an acid copper plating bath Suppressor and anti-suppressor additives in an acid copper sulfate plating bath are analyzed by the cyclic voltammetric stripping (CVS) method without cleaning or rinsing the cell between the two analyses. The suppressor analysis is performed first and the suppresso... | 03/06/2007 |
| 7117741 | Method and device for ultrasonic vibration detection during high-performance machining Dynamic vibration monitoring of a cutting tool or workpiece is provided by propagating an ultrasonic carrier beam in a stream of fluid flowing from a probe chamber, which includes a transducer, to the cutting tool or workpiece target area. The modulated ultrasonic b... | 10/10/2006 |
| 7022210 | Locally-distributed electrode and method of fabrication A locally distributed electrode is made by placing a conducting metallic oxide layer and a counter electrode in contact with a noble metal electroplating solution and applying a negative potential to the metallic oxide layer relative to the counter electrode, such t... | 04/04/2006 |
| 6890758 | Measurement of complexing agent concentration in an electroless plating bath The concentration of citrate complexing agent in an electroless cobalt or nickel plating bath is determined by titrating a sample of the electroless plating bath containing a small concentration of free fluoride ion with a standard lanthanum nitrate solution. During... | 05/10/2005 |
| 6749739 | Detection of suppressor breakdown contaminants in a plating bath Relative concentrations of active suppressor additive species and suppressor breakdown contaminants in an acid copper electroplating bath are determined by cyclic voltammetric stripping (CVS) dilution titration analysis using two negative electrode potential limits.... | 06/15/2004 |
| 6733656 | Voltammetric reference electrode calibration In the present invention, the test reference electrode used for voltammetric analysis of a plating bath is calibrated relative to the zero-current point between metal plating and stripping at a rotating platinum disk electrode in the plating bath supporting electrol... | 05/11/2004 |
| 6721080 | Optimum switching of a reversible electrochemical mirror device Reversible electrochemical mirror (REM) devices typically comprise a conductive oxide mirror electrode that is substantially transparent to radiation of some wavelengths, a counter electrode that may also be substantially transparent, and an electrolyte that contain... | 04/13/2004 |
| 6709561 | Measurement of the concentration of a reducing agent in an electroless plating bath The concentration of a reducing agent in an electroless bath for plating a first metal is determined from the effect of the reducing agent on the electrodeposition rate of a second metal. For electroless cobalt and nickel baths, a sample of the electroless plating b... | 03/23/2004 |
| 6673226 | Voltammetric measurement of halide ion concentration The concentration of chloride ion in an acid copper electroplating bath is determined from the effect that chloride exerts on the copper electrodeposition rate in the presence of organic additives. A cyclic voltammetric stripping (CVS) rate parameter is m... | 01/06/2004 |
| 6572753 | Method for analysis of three organic additives in an acid copper plating bath Acid copper electroplating baths used to form ultra-fine circuitry features on semiconductor chips contain suppressor, anti-suppressor and leveler additives that must be closely controlled in order to obtain acceptable copper deposits. Cyclic voltammetric... | 06/03/2003 |
| 6565227 | Method and device for tool alignment The present invention is a device and method for aligning a hand drill so that holes can be drilled at a desired angle in a workpiece. A light source and a template are attached to the drill so that an image is projected onto the workpiece surface. For dr... | 05/20/2003 |
