Quotables
"This is the patent age of new inventions for killing bodies, and for saving souls. All propagated with the best intentions."
Lord Byron ;
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 4847731 | Liquid cooled high density packaging for high speed circuits High power dissipating micro electronic circuit chips are cooled in a high ensity package by mounting individual chips on sintered stainless steel pads and surrounding the micro chips with a liquid fluoro-chemical to achieve cooling. The chips are directly... | 07/11/1989 |
