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| Number | Title | Issue Date |
| 8152046 | Conductive bumps, wire loops, and methods of forming the same A method of forming a conductive bump is provided. The method includes the steps of: (1) bonding a free air ball to a bonding location using a bonding tool to form a bonded ball; (2) raising the bonding tool to a desired height, with a wire clamp open, while paying ... | 04/10/2012 |
| 8141765 | Cutting blade for a wire bonding system A cutting blade for a wire bonding system is provided. The cutting blade comprises a body portion having an end portion. The end portion includes a blade tip configured to penetrate into a conductive material The end portion further includes a stepped portion proxim... | 03/27/2012 |
| 8100317 | Method of teaching eyepoints for wire bonding and related semiconductor processing operations A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one ... | 01/24/2012 |
| 8082661 | Device for fixing a flat object, in particular a substrate, to a work surface by means of low pressure An apparatus (1) for fixing a planar object, in particular a substrate (2), on a working area (4) by means of vacuum is provided with an at least partly transparent bearing plate (5), one side of which forms the working area and which has... | 12/27/2011 |
| 8066170 | Gas delivery system for reducing oxidation in wire bonding operations A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire b... | 11/29/2011 |
| 8063305 | Method of forming bends in a wire loop A method of forming a bend in a wire loop is provided. The method includes the steps of: (1) forming a first bend in the wire loop at a predetermined portion of the wire loop; (2) paying out a length of wire after step (1); and (3) forming a second bend in the wire ... | 11/22/2011 |
| 8056794 | Combination wedge bonding and ball bonding transducer A transducer configured for use with a manual wire bonding machine includes a body portion including an end portion, the end portion defining a bonding tool aperture configured to receive at least a portion of a bonding tool. The transducer also includes a first tig... | 11/15/2011 |
| 7981246 | Method and device for detaching a component which is attached to a flexible film The invention relates to a film (2) which comprises a component (1) to be detached therefrom. Said film is placed in the area of the component on a detaching tool (5) that is provided with at least one supporting element (6) for the film,... | 07/19/2011 |
| 7825549 | Linear motor with reduced cogging A linear motor is provided including a magnet track including a plurality of permanent magnets, and a coil assembly including a plurality of laminations. The coil assembly defines a plurality of teeth having slots therebetween. The plurality of teeth include (1) two... | 11/02/2010 |
| 7795557 | Electronic flame-off electrode with ball-shaped tip An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration. ... | 09/14/2010 |
| 7735716 | Method of controlling the trajectory of a bonding tool during the formation of a wire loop A method of determining a trajectory of an arc motion of a wire used in the formation of a wire loop is provided. The arc motion is between a first point and a second point of the trajectory. The method includes: (1) defining a pivot point with respect to the first ... | 06/15/2010 |
| 7681774 | Bond head link assembly for a wire bonding machine A bond head assembly for use with a bonding machine includes a wire bonding tool and a link mechanism coupled between the wire bonding tool and the wire bonding machine. The link mechanism includes a frame, a plurality of arm links pivotably connected to the frame, ... | 03/23/2010 |
| 7641097 | Moveable arm assembly for a wire bonder A wire bonding machine includes a moveable arm assembly and at least one component for a ball bonding operation of the wire bonding machine supported by the moveable arm assembly. The moveable arm assembly is configured to move between a ball bonding position and a ... | 01/05/2010 |
| 7637411 | Wire bonding apparatus and process A wire bonding machine includes (1) a support structure for supporting a work piece and (2) a pre-heat structure for supporting the work piece during a pre-heat operation. The pre-heat structure is moveable with respect to the support structure. ... | 12/29/2009 |
| 7624904 | Calibration apparatus for bondhead of wire bonding machine A wire bonding machine including a bondhead assembly having a transducer and a bonding tool is provided. The bondhead assembly is configured for substantially vertical movement with respect to a bonding surface of the wire bonding machine during a wire bonding opera... | 12/01/2009 |
| 7614538 | Device clamp for reducing oxidation in wire bonding A device clamp configured for use with a wire bonding machine is provided. The device clamp includes a body portion defining at least one device aperture. Each of the at least one device apertures is configured to be positioned adjacent a bond site area of the wire ... | 11/10/2009 |
| 7584881 | Low loop height ball bonding method and apparatus In accordance with the invention, a bump is formed on top of a die bond pad by forming a ball bond there. Then, without severing the wire, the capillary undergoes a set of coordinated motions to fold the wire on top of the ball bond. The wire is then bonded on top o... | 09/08/2009 |
| 7527186 | Method and apparatus for mapping a position of a capillary tool tip using a prism A system for determining wire bonding tool placement for use with a wire bonder and an optical imager is provided. The system includes a prism disposed below the optical imager and the wire bonding tool. The system also includes at least one lens positioned between ... | 05/05/2009 |
| 7523848 | Method and apparatus for measuring the size of free air balls on a wire bonder A system for measuring the size of free air balls for use with a wire bonder having a wire bonding tool and an Electric Flame Off (EFO) device is provided. The system includes an imager disposed above a first image plane, a prism disposed below the imager, and at le... | 04/28/2009 |
| 7500591 | Low-profile capillary for wire bonding A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less tha... | 03/10/2009 |
| 7500590 | Multi-part capillary A bonding tool for bonding a wire to a substrate. The bonding tool has a cylindrical body portion formed from a first material and a conical tip portion separately formed from a second material. The conical tip portion is coupled to one end of the body portion. ... | 03/10/2009 |
| 7464854 | Method and apparatus for forming a low profile wire loop A method of bonding a wire between a first bonding location and a second bonding location is provided. The method includes bonding a first end of a wire to a first bonding location using a wire bonding tool to form a first wire bond. The method also includes forming... | 12/16/2008 |
| 7431192 | Wire bonding apparatus A wire bonding machine includes (1) a support structure for supporting a work piece and (2) a pre-heat structure for supporting the work piece during a pre-heat operation. The pre-heat structure is moveable with respect to the support structure. ... | 10/07/2008 |
| 7411157 | Electronic flame-off electrode with ball-shaped tip An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration. ... | 08/12/2008 |
| 7377415 | Bond head link assembly for a wire bonding machine A bond head assembly for use with a bonding machine includes a wire bonding tool and a link mechanism coupled between the wire bonding tool and the wire bonding machine. The link mechanism includes a frame, a plurality of arm links pivotably connected to the frame, ... | 05/27/2008 |
| 7347352 | Low loop height ball bonding method and apparatus In accordance with the invention, a bump is formed on top of a die bond pad by forming a ball bond there. Then, without severing the wire, the capillary undergoes a set of coordinated motions to fold the wire on top of the ball bond. The wire is then bonded on top o... | 03/25/2008 |
| 7320425 | Low-profile capillary for wire bonding A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less tha... | 01/22/2008 |
| 7320424 | Linear split axis wire bonder A wire bonding machine for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. A bonding head conveyance syst... | 01/22/2008 |
| 7320423 | High speed linear and rotary split-axis wire bonder A wire bonding machine is disclosed for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. At least a portio... | 01/22/2008 |
| D557599 | Package for bonding tools | 12/18/2007 |
| 7294217 | Electrical interconnect structures for integrated circuits and methods of manufacturing the same Disclosed are interconnect structures and methods which utilize a bonding surface comprising copper nitride. The interconnect structures include a bonding surface comprising copper nitride which is effective at preventing oxidation and/or other unwanted corrosion of... | 11/13/2007 |
| 7249702 | Multi-part capillary A bonding tool for bonding a wire to a substrate. The bonding tool has a cylindrical body portion formed from a first material and a conical tip portion separately formed from a second material. The conical tip portion is coupled to one end of the body portion. ... | 07/31/2007 |
| 7229906 | Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine The present invention is a method and apparatus for forming a bump for semiconductor interconnect applications, such as reverse wire bonding or stud bumping for flip chip interconnections. The bump is formed by (1) ball bonding at the bump site, (2) raising the capi... | 06/12/2007 |
| 7199475 | Semiconductor copper bond pad surface protection Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal conta... | 04/03/2007 |
| 7188759 | Methods for forming conductive bumps and wire loops A method of forming a conductive bump is provided. The method includes depositing a conductive bump on a bonding location using a bonding tool such that a junction exists between (1) a length of wire extending at least partially within the bonding tool and (2) the d... | 03/13/2007 |
| 7179688 | Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method A method of packaging a multi-tier wire bonded semiconductor device is provided. The method includes applying an insulative material across only a portion of at least two of a plurality of conductors per layer providing interconnection between elements in the multi-... | 02/20/2007 |
| 7160797 | Method of bumping die pads for wafer testing A method of processing a semiconductor wafer including a plurality of semiconductor dies is provided. The method includes providing a semiconductor wafer including a plurality of semiconductor dies, at least a portion of the semiconductor dies including contact pads... | 01/09/2007 |
| 7137543 | Integrated flexure mount scheme for dynamic isolation of ultrasonic transducers The present invention is directed to an integrated flexure mount scheme for dynamic isolation of ultrasonic transducers for use with a wire bonding machine. The transducer has a body of a generally elongated shape having front, rear, and main portions. The transduce... | 11/21/2006 |
| 6992001 | Screen print under-bump metalization (UBM) to produce low cost flip chip substrate A method for forming an integrated circuit interconnect pad is described. In one embodiment a method of forming an integrated circuit comprises screen printing a conductive paste onto a terminal metalization pad and curing the conductive paste in an inert or reducin... | 01/31/2006 |
