Quotables
"The man with a new idea is a crank until the idea succeeds."
Samuel Clemens
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8178395 | Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal via A method of making a semiconductor chip assembly includes providing a post, a base, a support layer and an underlayer, wherein the post extends above the base and the support layer is sandwiched between the base and the underlayer, mounting an adhesive on the base i... | 05/15/2012 |
| 8163603 | Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an apertur... | 04/24/2012 |
| 8153477 | Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader A method of making a semiconductor chip assembly includes providing first and second posts, first and second adhesives, first and second conductive layers and a dielectric base, wherein the first post extends from the dielectric base in a first vertical direction in... | 04/10/2012 |
| 8148747 | Semiconductor chip assembly with post/base/cap heat spreader A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a ... | 04/03/2012 |
| 8148207 | Method of making a semiconductor chip assembly with a post/base/cap heat spreader A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aper... | 04/03/2012 |
| 8129742 | Semiconductor chip assembly with post/base heat spreader and plated through-hole A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post and a base. The conductive trace includes a pad, a terminal and a plated through-hole. The semiconductor device is e... | 03/06/2012 |
| 8110446 | Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive trace A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aper... | 02/07/2012 |
| 8076182 | Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the post A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a substrate on the adhesive including aligning the post with an aperture in... | 12/13/2011 |
| 8067784 | Semiconductor chip assembly with post/base heat spreader and substrate A semiconductor chip assembly includes a semiconductor device, a heat spreader, a substrate and an adhesive. The semiconductor device is electrically connected to the substrate and thermally connected to the heat spreader. The heat spreader includes a post and a bas... | 11/29/2011 |
| 8067270 | Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an apertur... | 11/29/2011 |
| 8062912 | Method of making a semiconductor chip assembly with a post/base heat spreader and horizontal signal routing A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an apertur... | 11/22/2011 |
| 8034645 | Method of making a semiconductor chip assembly with a copper/aluminum post/base heat spreader A method of making a semiconductor chip assembly includes providing a post and a base that include a copper surface layer and an aluminum core, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer... | 10/11/2011 |
| 8003416 | Method of making a semiconductor chip assembly with a post/base heat spreader and dual adhesives A method of making a semiconductor chip assembly includes providing a post and a base, mounting a first adhesive on the base including inserting the post through an opening in the first adhesive, mounting a conductive layer on the base including aligning the post wi... | 08/23/2011 |
| 8003415 | Method of making a semiconductor chip assembly with a post/base heat spreader and vertical signal routing A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an apertur... | 08/23/2011 |
| 7993983 | Method of making a semiconductor chip assembly with chip and encapsulant grinding A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip to a routing line, then forming an encapsulant that covers the chip, then grinding the encapsulant without grinding the chip and then grinding the encapsulant and t... | 08/09/2011 |
| 7951622 | Method of making a semiconductor chip assembly with a post/base heat spreader and a signal post A method of making a semiconductor chip assembly includes providing a thermal post, a signal post and a base, mounting an adhesive on the base including inserting the thermal post into a first opening in the adhesive and the signal post into a second opening in the ... | 05/31/2011 |
| 7948076 | Semiconductor chip assembly with post/base heat spreader and vertical signal routing A semiconductor chip assembly includes a semiconductor device, a heat spreader, a substrate and an adhesive. The semiconductor device is electrically connected to the substrate and thermally connected to the heat spreader. The heat spreader includes a post and a bas... | 05/24/2011 |
| 7939375 | Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the post A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a substrate on the adhesive including aligning the post with an aperture in... | 05/10/2011 |
| 7932165 | Method of making a semiconductor chip assembly with a laterally aligned filler and insulative base A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a bumped terminal and a filler, wherein the routing line contacts the bumped terminal and the filler, then mechanically attaching a semiconductor chip to the metal base... | 04/26/2011 |
| 7901993 | Method of making a semiconductor chip assembly with an aluminum post/base heat spreader and a silver/copper conductive trace A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a copper layer on the adhesive including aligning the post with an aperture... | 03/08/2011 |
| 7833827 | Method of making a semiconductor chip assembly with a bumped terminal, a filler and an insulative base A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a bumped terminal and a filler, wherein the routing line contacts the bumped terminal and the filler, then mechanically attaching a semiconductor chip to the metal base... | 11/16/2010 |
| 7811863 | Method of making a semiconductor chip assembly with metal pillar and encapsulant grinding and heat sink attachment A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip to a routing line, forming a metal pillar on the routing line, forming an encapsulant that covers the chip and the metal pillar, grinding the encapsulant without gr... | 10/12/2010 |
| 7750483 | Semiconductor chip assembly with welded metal pillar and enlarged plated contact terminal A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal pillar and an enlarged plated contact terminal, a connection joint that electrically connects the routing line and th... | 07/06/2010 |
| 7538415 | Semiconductor chip assembly with bumped terminal, filler and insulative base A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a filler, a connection joint that electrically connects the routing line and the pad, an encapsulant an... | 05/26/2009 |
| 7494843 | Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip to a routing line, forming a thermal conductor on the chip, forming an encapsulant that covers the chip and the thermal conductor, grinding the encapsulant without ... | 02/24/2009 |
| 7459385 | Method of making a semiconductor chip assembly with a laterally aligned bumped terminal and filler A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a bumped terminal and a filler, wherein the routing line is adjacent to the bumped terminal, then mechanically attaching a semiconductor chip to the metal base, the rou... | 12/02/2008 |
| 7453140 | Semiconductor chip assembly with laterally aligned filler and insulative base A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a filler, a connection joint that electrically connects the routing line and the pad, an encapsulant and an insulative bas... | 11/18/2008 |
| 7446419 | Semiconductor chip assembly with welded metal pillar of stacked metal balls A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip a... | 11/04/2008 |
| 7425759 | Semiconductor chip assembly with bumped terminal and filler A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a filler, a connection joint that electrically connects the routing line and the pad, and an encapsulan... | 09/16/2008 |
| 7419851 | Method of making a semiconductor chip assembly with a metal containment wall and a solder terminal A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a metal containment wall and a solder layer in which the metal containment wall includes a cavity and the solder terminal contacts the metal containment wall in the cav... | 09/02/2008 |
| 7417314 | Semiconductor chip assembly with laterally aligned bumped terminal and filler A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a filler, a connection joint that electrically connects the routing line and the pad, and an encapsulan... | 08/26/2008 |
| 7414319 | Semiconductor chip assembly with metal containment wall and solder terminal A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal containment wall and a solder terminal, and a connection joint that electrically connects the routing line and the pa... | 08/19/2008 |
| 7396703 | Method of making a semiconductor chip assembly with a bumped terminal and a filler A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a bumped terminal and a filler, wherein the routing line contacts the bumped terminal and the filler, then mechanically attaching a semiconductor chip to the metal base... | 07/08/2008 |
| 7319265 | Semiconductor chip assembly with precision-formed metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The metal ... | 01/15/2008 |
| 7268421 | Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip a... | 09/11/2007 |
| 7262082 | Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture A method of making a three-dimensional stacked semiconductor package includes providing a first semiconductor chip assembly that includes a first chip, a first conductive trace and a first encapsulant, wherein the first conductive trace includes a first metal pillar... | 08/28/2007 |
| 7245023 | Semiconductor chip assembly with solder-attached ground plane A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a pillar and a routing line, a solder joint and a ground plane. The pillar extends into an opening in the ground plane, the solder joint cont... | 07/17/2007 |
| 7232706 | Method of making a semiconductor chip assembly with a precision-formed metal pillar A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects... | 06/19/2007 |
| 7232707 | Method of making a semiconductor chip assembly with an interlocked contact terminal A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects... | 06/19/2007 |
| 7229853 | Method of making a semiconductor chip assembly using multiple etch steps to form a pillar after forming a routing line A method of making a semiconductor chip assembly includes providing a metal base that includes a metal plate and a metal layer, providing a routing line that contacts the metal layer and an etch mask that contacts the metal plate, providing a semiconductor chip that... | 06/12/2007 |
