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| Number | Title | Issue Date |
| 8001647 | Flocked foam applicator An improved flocked foam applicator has a cylindrically shaped hollow rigid shell configured to slide onto a rigid core coupled to a handle. A rigid planar surface extends from the bottom of the hollow rigid shell forward. Applicator flock extends downward from the ... | 08/23/2011 |
| 7779058 | Method and apparatus for managing a digital inventory of multimedia files stored across a dynamic distributed network A video network includes public kiosks having digital storage capacity. Centralized inventory control manages the video files stored at individual kiosks or network LANs. A user requests a multimedia file for download, and selects various ancillary files and control... | 08/17/2010 |
| 7750446 | IC package structures having separate circuit interconnection structures and assemblies constructed thereof Disclosed are IC package structures comprised of standard IC packages modified with separate circuit interconnection structures and disposed to interconnect either directly to other IC packages or to intermediate pedestal connectors which serve to support and interc... | 07/06/2010 |
| 7737545 | Multi-surface IC packaging structures and methods for their manufacture An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other device... | 06/15/2010 |
| 7732904 | Multi-surface contact IC packaging structures and assemblies A cost effective, high performance, IC package assembly of the present invention comprises stair-stepped layers of redistribution circuits from at least one chip to terminals on any of multiple surfaces and levels of the IC package assembly. Critical path circuits o... | 06/08/2010 |
| 7701323 | Low profile discrete electronic components and applications of same Disclosed are low profile discrete electronic component structures that are suitable for placement and use in a vertical interconnection mode either within an electronic interconnection substrate, between interconnection substrate and electronic component or within ... | 04/20/2010 |
| 7663504 | Emergency vehicle warning system An emergency vehicle transmits a Vehicle Present Signal when in transit on public roads responding to an emergency. The signal can include information relating to the type of emergency vehicle, local highway and terrain data, and the location, speed and direction of... | 02/16/2010 |
| 7652381 | Interconnect system without through-holes Structures employed by a plurality of packages, printed circuit boards, connectors and interposers to create signal paths which reduce the deleterious signal quality issues associated with the use of through-holes. Disclosed structures can coexist with through-hole ... | 01/26/2010 |
| 7651382 | Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity An electrical interconnection device for establishing redundant contacts between the ends of two conductive elements to be mated, creating a electrical interconnection without capacitive stubs. ... | 01/26/2010 |
| 7651336 | High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised ... | 01/26/2010 |
| 7613011 | Signal-segregating connector system A signal-segregating connector for use in a system having a printed circuit board, a first electrical structure and a second electrical structure. The connector includes a first set of conductive elements to convey signals between the first electrical structure and ... | 11/03/2009 |
| 7466021 | Memory packages having stair step interconnection layers Disclosed are IC package structures having stair stepped layers and which have no plated vias. Such structures can be fabricated either as discrete packages or as strips such as might be beneficial in for use with memory devices wherein critical or high speed signal... | 12/16/2008 |
| 7404746 | Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity An electrical interconnection device for establishing redundant contacts between the ends of two conductive elements to be mated, creating a electrical interconnection without capacitive stubs. ... | 07/29/2008 |
| 7388279 | Tapered dielectric and conductor structures and applications thereof Disclosed are tapered dielectric and conductor structures which provide controlled impedance interconnection while signal conductor lines transition from finer pitches to coarser pitches thereby obviating electrical discontinuities generally associated with changes ... | 06/17/2008 |
| 7347697 | Active connector Interconnection assemblies which adjust their alignment and performance through the use of control feedback from the data transferred through the assemblies. ... | 03/25/2008 |
| 7310239 | IC packaging interposer having controlled impedance or optical interconnections and an integral heat spreader Disclosed are embodiments of an integrated circuit die interconnection interposer suited to controlled high performance transmission of electronic or optical signals or combinations thereof. The various embodiments are designed to provide direct path interconnection... | 12/18/2007 |
| 7308524 | Memory chain A memory system having a plurality of memory devices and a memory controller. The memory devices are coupled to one another in a chain. The memory controller is coupled to the chain and configured to output a memory access command that is received by each of the mem... | 12/11/2007 |
| 7307293 | Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors extend between the first and second integrated circuit packages susp... | 12/11/2007 |
| 7205613 | Insulating substrate for IC packages having integral ESD protection An IC package substrate having integral ESD protection features and elements and a method for construction of the same are disclosed ... | 04/17/2007 |
| 7192320 | Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity An electrical interconnection device for establishing redundant contacts between the ends of two conductive elements to be mated, creating a electrical interconnection without capacitive stubs. ... | 03/20/2007 |
| 7176580 | Structures and methods for wire bonding over active, brittle and low K dielectric areas of an IC chip Disclosed are structures and methods that facilitate the use of wire bonding technology over active areas of an IC chip. The invention is also suitable for use with IC structures that use brittle dielectric materials such as low K dielectrics. ... | 02/13/2007 |
