Did You Know...
...that Charles Goodyear performed some of his experiments on rubber while in debtor's prison? He was there so often he referred to it as his "hotel". Chronically in debt because of poor business sense and ill health, Goodyear depended on the generosity of friends and family. Even after he unlocked the secret to vulcanizing rubber, he was unable to improve his financial situation. When he died, his estate was $200,000 in debt.
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| Number | Title | Issue Date |
| 8178976 | IC device having low resistance TSV comprising ground connection A semiconductor device includes an integrated circuit (IC) die including a substrate, and at least one through substrate via (TSV) that extends through the substrate to a protruding integral tip that includes sidewalls and a distal end. The protruding integral tip h... | 05/15/2012 |
| 8175021 | Method for transmission of unicast control in broadcast/multicast transmission time intervals Embodiments of the invention provide methods for maximizing the bandwidth utilization in the uplink of a communication system supporting time division multiplexing between unicast and multicast/broadcast communication modes during transmission time intervals in the ... | 05/08/2012 |
| 8174276 | Coaxial four-point probe for low resistance measurements Various exemplary embodiments provide probes, systems and methods for measuring an effective electrical resistance/resistivity with high sensitivity. In one embodiment, the measuring system can include an upper probe set and a similar lower probe set having a sample... | 05/08/2012 |
| 8159377 | System, method, and circuitry for blind timing mismatch estimation of interleaved analog-to-digital converters A timing skew estimation system is disclosed that includes a plurality of interleaved analog-to-digital converter circuits (ADCs), a timing mismatch estimation unit, and a correction unit. The timing mismatch estimation unit calculates a correlation between each of ... | 04/17/2012 |
| 8158460 | Method of forming metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compounds A leadframe for the assembly of a semiconductor chip has regions (112) with an original smooth surface of glossy appearance and regions (113, 114, 210) of a frosty appearance with rough surface contours. The regions of rough surface contours include tw... | 04/17/2012 |
| 8156334 | Public key out-of-band transfer for mutual authentication Methods for key exchange and mutual authentication are provided that allow for inherent authentication and secret key derivation of parties communicating through an unsecured medium. These methods allow for greater security than existing key exchange and authenticat... | 04/10/2012 |
| 8155600 | Digital communication using an inexpensive reference crystal Systems and methods for digital communication using an inexpensive reference crystal are described herein. Some illustrative embodiments include a method that includes setting a center frequency of a local oscillator used by a radio frequency (RF) transceiver, seque... | 04/10/2012 |
| 8155217 | Systems and methods for low-complexity MIMO detection with analytical leaf-node prediction Systems and methods for providing multiple-input multiple-output (MIMO) detection, comprising a leaf node predictor for receiving a processed communications stream, computing at least one channel metric corresponding to the communications stream for a given channel ... | 04/10/2012 |
| 8154443 | Method and system for GNSS coexistence A system and method for operating a wireless transmitter and a global navigation satellite (“GNSS”) receiver coexistent in a mobile wireless device. A mobile wireless device includes a GNSS receiver and a wireless networking system. The wireless networking syste... | 04/10/2012 |
| 8154134 | Packaged electronic devices with face-up die having TSV connection to leads and die pad A packaged electronic device includes a leadframe including a die pad, a first, second, and third lead pin surrounding the die pad. An IC die is assembled in a face-up configuration on the lead frame. The IC die includes a substrate having an active top surface and ... | 04/10/2012 |
| 8154117 | High power integrated circuit device having bump pads An integrated circuit (IC) includes a substrate having a semiconducting surface, a first array of devices on and in the semiconducting surface including first and second coacting current conducting nodes, a plurality of layers disposed on the substrate and including... | 04/10/2012 |
| 8154109 | Leadframe having delamination resistant die pad A lead frame (410) including a die pad (100) for mounting at least one integrated circuit (405) thereon and a plurality of lead fingers (413). The die pad (100) includes a metal including substrate (105) having a periphery t... | 04/10/2012 |
| 8151995 | Methods and apparatus to prevent mold compound feeder jams in systems to package integrated circuits Methods and apparatus to preventing mold feeder jams in a system to package integrated circuits. An example method includes detecting if a mold compound tablet has a first alignment on a path and removing the mold compound tablet from the path if the mold compound t... | 04/10/2012 |
| 8144807 | Crosstalk cancellation in digital subscriber line communications A digital subscriber line (DSL) modem that has a canceller digital filter for cancelling crosstalk and RF interference in a received DSL signal is disclosed. The modem includes common-mode sense circuitry and also differential-mode sense circuitry. Samples of the co... | 03/27/2012 |
| 8143704 | Electronic assemblies including mechanically secured protruding bonding conductor joints An electronic assembly includes an IC die including a semiconductor top surface having active circuitry thereon and a bottom surface, and at least one protruding bonding feature having sidewall surfaces and a leading edge surface extending outward from the IC die. A... | 03/27/2012 |
| 8138026 | Low cost lead-free preplated leadframe having improved adhesion and solderability A leadframe with a structure made of a base metal (105), wherein the structure has a plurality of surfaces. On each of these surfaces are metal layers in a stack adherent to the base metal. The stack comprises a nickel layer (201) in contact with the b... | 03/20/2012 |
| 8135563 | Apparatus and method for evaluating the performance of systems having time-varying output characteristics An apparatus for evaluating a system. The apparatus can include a storage element for receiving at least one time-varying output characteristic of the system, the time-varying output characteristic comprising a plurality of raw data points representing a plurality o... | 03/13/2012 |
| 8133763 | Method for semiconductor leadframes in low volume and rapid turnaround A method for fabricating a leadframe for a QFN/SON semiconductor device by selecting (301) a strip of a first metal as the leadframe core, then plating (302) a layer of a second metal over both surfaces of the strip, then cutting (304) a pattern... | 03/13/2012 |
| 8133761 | Packaged system of semiconductor chips having a semiconductor interposer A semiconductor system (200) of one or more semiconductor interposers (201) with a certain dimension (210), conductive vias (212) extending from the first to the second surface, with terminals and attached non-reflow metal studs (215 | 03/13/2012 |
| 8131230 | Method and system for FM transmitter coexistence A system and method for operating an FM system and wireless networking system coexistent in a mobile wireless device. A mobile wireless device includes a frequency modulation (“FM”) system that includes an FM transmitter and, optionally, an FM receiver. The mobi... | 03/06/2012 |
| 8130791 | Receiver and method for processing a stream of data packets when an error occurred on the physical layer A receiver which receives a stream of data packets including video data packets over a physical data link and drops data packets when an error on a physical communication layer is detected, wherein the receiver comprises a processor, configured so that it is able to... | 03/06/2012 |
| 8130653 | Deletion request after number of failed acknowledgements to addition requests Network circuitry and a method of operating the same in establishing and deleting a service flow in a wireless network. A network station receives a request, from an initiating network station, to establish a service flow. The network station receiving the request i... | 03/06/2012 |
| 8130032 | Systems and methods for high-sensitivity detection of input bias current The invention relates to systems and methods for high-sensitivity detection of input bias current. The invention more particularly relates to platforms and techniques for the calibration and measurement of input bias current in op amps or other devices. In embodimen... | 03/06/2012 |
| 8129228 | Manufacturing method for integrating a shunt resistor into a semiconductor package An integrated circuit package that comprises a lead frame, an integrated circuit located on the lead frame and a shunt resistor coupled to the lead frame and to the integrated circuit. The shunt resistor has a lower temperature coefficient of resistance than the lea... | 03/06/2012 |
| 8129227 | Semiconductor device having grooved leads to confine solder wicking A packaged surface-mount semiconductor device has the outer, un-encapsulated lead segments structured in five adjoining portions: The first portion protrudes from the encapsulation about horizontally; the second portion forms a convex bend downwardly; the third port... | 03/06/2012 |
| 8129224 | Stud bumps as local heat sinks during transient power operations A thermal management configuration for a flip chip semiconductor device is disclosed. The device includes a high power silicon based die having a metal bonding surface. A plurality of interconnects are formed on the metal surface and connected to a substrate. A plur... | 03/06/2012 |
| 8115310 | Copper pillar bonding for fine pitch flip chip devices A semiconductor device assembly can include a semiconductor chip, a receiving substrate, and a spacer structure interposed between the semiconductor chip and the receiving substrate. The spacer provides an unoccupied space between a pillar and a bond finger for exce... | 02/14/2012 |
| 8114706 | Selective removal of gold from a lead frame A method of packaging an integrated circuit, including providing a lead frame having lead fingers, where the lead frame has a gold layer thereon on a top surface and a bottom surface. An integrated circuit die is attached to the lead frame. The gold layer is substan... | 02/14/2012 |
| 8110438 | Thermal method to control underfill flow in semiconductor devices A method and apparatus for assembling a semiconductor device. A chip (901) with solder bodies (903) on its contact pads is flipped onto a substrate (904). After the reflow process, a gap (910) spaces chip and substrate apart. A polymer pr... | 02/07/2012 |
| 8102187 | Localized calibration of programmable digital logic cells An integrated circuit (IC) includes self-calibrating programmable digital logic circuitry. The IC includes at least one programmable digital logic cell, wherein the first programmable digital logic cell provides (i) a plurality of different accessible circuit config... | 01/24/2012 |
| 8102038 | Semiconductor chip attach configuration having improved thermal characteristics A semiconductor chip 101 with surface 101b free of circuitry assembled on a metal carrier 102 by an attachment layer 103 with thickness 103a. Included in layer 103 are metal bodies 104 and an adhesive po... | 01/24/2012 |
| 8099658 | Reduced complexity Viterbi decoder A Viterbi decoder includes a branch metric unit, an add-compare select unit coupled to the branch metric unit, and a trace-back unit coupled to the add-compare select unit. The branch metric unit includes a branch metric computation unit coupled to a thresholder uni... | 01/17/2012 |
| 8097964 | IC having TSV arrays with reduced TSV induced stress An integrated circuit (IC) includes a substrate having a top side having active circuitry thereon including a plurality of metal interconnect levels including a first metal interconnect level and a top metal interconnect level, and a bottom side. At least one TSV ar... | 01/17/2012 |
| 8068871 | Systems and methods for time optimization for silencing wireless devices in coexistence networks Embodiments provide systems and methods to optimize the time when to transmit a silencing frame, and hence, improve the overall network throughput and avoid access point transmission rate fall-back mechanism having an avalanche effect during coexistence of dissimila... | 11/29/2011 |
| 8059764 | Systems and methods for low-complexity max-log MIMO detection Embodiments provide novel systems and methods for multiple-input multiple-output (MIMO) Max-Log detection. These systems and methods enable near-optimal performance with low complexity for a two-input two-output channel. Some embodiments comprise using a Max-Log det... | 11/15/2011 |
| 8059745 | Sharing logic circuitry for a maximum likelihood MIMO decoder and a viterbi decoder A receiver system for receiving and decoding modulated communications signals in a multiple-input, multiple-output (MIMO) environment, where the signals are modulated according to Orthogonal Frequency Division Modulation (OFDM). The receiver system includes shared d... | 11/15/2011 |
| 8059670 | Hardware queue management with distributed linking information A network element including a processor with logic for managing packet queues by way of packet descriptor index values that are mapped to addresses in the memory space of the packet descriptors. A linking memory is implemented in the same integrated circuit as the p... | 11/15/2011 |
| 8054914 | Noise variance estimation A method and system for estimating noise variance. A method for noise variance estimation comprises receiving a first multi-sample symbol and receiving a second multi-sample symbol. The first multi-sample symbol is subtracted from the second multi-sample symbol to p... | 11/08/2011 |
| 8054742 | System and method for sidelobe suppression in communications systems A system and method for sidelobe suppression in OFDM communications systems is provided. A method for transmitting an information symbol having a plurality of information sub-carriers and a plurality of active interference cancellation (AIC) sub-carriers includes ge... | 11/08/2011 |
| 8054056 | Frequency regulated hysteretic average current mode converter A switch mode power converter that precisely controls average switching current and operating frequency. The switching control operative in hysteretic average current mode control provides wide bandwidth operation without the need for slope correction. The switching... | 11/08/2011 |
