"There is no reason anyone would want a computer in their home."
Ken Olsen, chairman and founder of Digital Equipment Corporation ; 1977
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| Number | Title | Issue Date |
| 7310944 | Wave energy converters (WECs) with velocity multiplication A WEC system embodying the invention includes a column and shell, arranged to move relative to each other, and a lever-like apparatus having an input end and an output end and an intermediate point, between the two ends, the intermediate point being rotatably connec... | 12/25/2007 |
| 6886187 | Swimming pool safety covers Pool covers embodying the invention are formed of a very dense mesh material which ensures substantially one hundred percent shade while allowing water to pass uniformly through the cover and which is adequately strong to support the weight of an adult. The pool cov... | 05/03/2005 |
| 6287307 | Apparatus and methods for clamping split bone sections A clamping assembly for clamping together first and second sections of bone having, when so clamped, a common external surface generally perpendicular to contacting surfaces of the first and second bone sections, and each bone section having a side surfac... | 09/11/2001 |
| 6184692 | Loop back test apparatus and technique A system for testing a circuit which includes a receive section, a transmit section and a lock-out circuit for preventing the receive and transmit sections to be operative at the same time. The receive section has an input for receiving digital signals an... | 02/06/2001 |
| 5970343 | Fabrication of conductivity enhanced MOS-gated semiconductor devices In the manufacture of an MOS gated semiconductor device, indentations are provided on a surface of a semiconductor wafer extending inwardly of respective spaced apart regions at the wafer surface having doping concentrations greater than that present in t... | 10/19/1999 |
| 5900643 | Integrated circuit chip structure for improved packaging First and second electrical components on an integrated circuit chip are electrically connected respectively to a wire bonding pad and to a probe contacting area of a size significantly less than the bonding pad. The pad and contacting area are electrical... | 05/04/1999 |