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| Number | Title | Issue Date |
| 5288458 | Machinable copper alloys having reduced lead content Machinable alpha beta brass having a reduced lead concentration is claimed. The alloy contains bismuth to improve machinability. Either a portion of the zinc is replaced with aluminum, silicon or tin, or a portion of the copper is replaced with iron, nick... | 02/22/1994 |
| 5268043 | Magnetic sensor wire There is provided a magnetic device having first and second portions with different magnetic coercivities. A magnetic field is induced in both the first and second portion. When exposed to a sufficiently high external magnetic field, the polarity of the f... | 12/07/1993 |
| 5261157 | Assembly of electronic packages by vacuum lamination A process for the assembly of a pin grid array electronic package by vacuum lamination is provided. A vacuum is applied to the package components at the same time the components are bonded with a dielectric sealant. The sealant flow into holes formed in t... | 11/16/1993 |
| 5250363 | Chromium-zinc anti-tarnish coating for copper foil having a dark color A technique for improving the tarnish and oxidation resistance of metallic substrate is disclosed. The substrate is immersed in an aqueous solution containing sodium hydroxide, zinc ions and chromium (VI) ions. Either the temperature of the aqueous soluti... | 10/05/1993 |
| 5239131 | Electronic package having controlled epoxy flow There is provided an electronic package assembly having a die attach paddle bonded to the package base by a compliant adhesive. A recessed channel formed in the base is partially overlapped by the die attach paddle. During package sealing, excess adhesive... | 08/24/1993 |
| 5236789 | Palladium alloys having utility in electrical applications A palladium alloy of the form Pdx My M'z where M is at least one element selected from the group consisting of silicon, iron, nickel, copper, chromium, cobalt, boron and aluminum and M' is at least one element selected fro... | 08/17/1993 |
| 5234536 | Process for the manufacture of an interconnect circuit A method for the manufacture of an electronic circuit is provided. A substrate is provided with an indexing means and personality windows by etching. An adhesive is deposited on one surface of the substrate to coat at least those regions to be laminated t... | 08/10/1993 |
| 5213638 | Surface modified copper alloys There is provided a composite copper alloy having a copper alloy core and a modified surface layer containing a nitride or carbide film. Alternatively, the modified surface layer may contain a carbo-nitride film. The alloy is formed by reacting a copper a... | 05/25/1993 |
| 5209787 | Surface modification of copper alloys A composite copper alloy having a modified surface is provided. An element or combination of elements both soluble in copper and reactive with nitrogen are cast with copper or a copper alloy forming a solid state solution. The alloy is reacted with a nitr... | 05/11/1993 |
| 5188985 | Surface mount device with high thermal conductivity A surface mount package for encapsulating an electronic device is provided. The package has a ceramic frame containing a plurality of apertures. Copper-tungsten composite metallic components are bonded to the ceramic frame and individually extend across e... | 02/23/1993 |
| 5181770 | Surface topography optimization through control of chloride concentration in electroformed copper foil An electrolyte solution for the electroforming of metal foil, such as copper, is provided. The electrolyte contains an effective concentration of chloride ions to promote the formation of a uniformly matte surface finish. Foil so formed forms a strong mec... | 01/26/1993 |
| 5156716 | Process for the manufacture of a three layer tape for tape automated bonding A method for the manufacture of an electronic circuit is provided. A non-conductive substrate is provided with an indexing means and personality windows by etching. An adhesive is deposited on one surface of the substrate to coat at least those regions to... | 10/20/1992 |
| 5155299 | Aluminum alloy semiconductor packages The present invention relates to a packagae adapted to house an electronic device, such as a semiconductor integrated circuit. The package components are comprised of aluminum based alloy. At least a portion of the surfaces of the package components are a... | 10/13/1992 |
| 5144412 | Process for manufacturing plastic pin grid arrays and the product produced thereby A pin grid array package is provided. An array of terminal pins pass through apertures formed in an interconnect tape. The terminal pins are electrically connected to circuit traces formed on interconnect tape. The electrically conductive bond between the... | 09/01/1992 |
| 5141702 | Method of making coated electrical connectors A method for depositing a composite coating on a substrate is provided. The coating contains a mixture of ductile metal particles and a uniformly dispersed polymer particles. The polymer is present in a concentration effective to reduce frictional forces.... | 08/25/1992 |
| 5139891 | Palladium alloys having utility in electrical applications A palladium alloy of the form PdNbM where M is at least one element selected from the group consisting of silicon, iron, nickel, copper, cobalt, boron and aluminum is provided. The alloys exhibit oxidation resistance and electrical contact resistance and ... | 08/18/1992 |
| 5139890 | Silver-coated electrical components There has been provided an electrical component having resistance to oxidation and wear. The component has a copper or copper alloy substrate coated with a relatively thick layer of silver. A thin layer of gold may be deposited on the external surface of ... | 08/18/1992 |
| 5137685 | Machinable copper alloys having reduced lead content Machinable copper alloys having a reduced lead concentration are disclosed. An additive to the alloy accumulates both at the grain boundaries and intragranularly. The additive facilitates chip fracture or lubricates the tool. One additive is a mixture of ... | 08/11/1992 |
| 5132773 | Carrier ring having first and second ring means with bonded surfaces A two-piece carrier ring is provided. First and second rings are affixed to opposing sides of the exterior portion of a leadframe and protect the leads from distortion. The rings are molded prior to bonding to the leadframe so that the rings may be formed... | 07/21/1992 |
| 5122858 | Lead frame having polymer coated surface portions A composite leadframe for electronic packages is provided. A polymer layer coats a portion of the leadframe. The polymer layer increases the adhesive bond between the leadframe and a molding resin. Water vapor does not accumulate under the leads and die a... | 06/16/1992 |
| 5117011 | Non-catalytic oxidation of propylene to propylene oxide There is provided a process for the non-catalytic oxidation of gaseous hydrocarbons, preferably propylene. A mixture of propylene, oxygen and a inert diluent are provided to a rector vessel capable of maintaining an isothermal reaction. Maintaining a temp... | 05/26/1992 |
| 5113764 | Semiconductor bridge (SCB) packaging system The present invention is direct to primer housings to secure a semiconductor bridge device in close proximity to an energetic charge. The primar housings are formed from an electrically conductive alloy and contain a dielectric medium disposed between com... | 05/19/1992 |
| 5111277 | Surface mount device with high thermal conductivity A surface mount package for encapsulating an electronic device is provided. The package has a ceramic frame containing a plurality of apertures. Copper-tungsten composite metallic components are bonded to the ceramic frame and individually extend across e... | 05/05/1992 |
| 5108553 | G-tab manufacturing process and the product produced thereby A thin, preferably flexible circuit having multiple conductive planes separated by a non-conductive layer is provided. Conductive vias electrically interconnect the conductive planes. The conductive vias comprise carbon coated blind vias which are made co... | 04/28/1992 |
| 5106825 | Fabrication of superconducting wire and product A method of fabricating a rugged, flexible, superconducting wire comprising: mixing a superconducting material, such as YBa2 Cu3 Ox, with a metallic powder to form a metal/superconductor mixture; and loading a metal shell ... | 04/21/1992 |
| 5102620 | Copper alloys with dispersed metal nitrides and method of manufacture Spray cast alloys having reduced porosity and increased ductility are provided as well as a process for the manufacture of the alloys. An effective amount of a reactive metal which reacts with the spray casting atmosphere but not with the desired alloy is... | 04/07/1992 |
| 5103292 | Metal pin grid array package A metal pin grid array package and a process for the assembly of the package is provided. The package includes a metal or metal alloy base component having an ordered array of holes. Terminal pins are electrically interconnected to a desired circuit and e... | 04/07/1992 |
| 5099079 | Process for separating acid from nitro substituted aromatics using a molten nitrate salt Described herein is a process for separating an acid impurity from a solution containing acid and a nitro substituted aromatic compound by contacting the solution with at least one molten nitrate salt.... | 03/24/1992 |
| 5098796 | Chromium-zinc anti-tarnish coating on copper foil A technique for improving the tarnish and oxidation resistance of copper and copper based alloy materials is disclosed. Copper or a copper alloy is immersed in an aqueous solution containing sodium hydroxide, zinc ions and chromium (VI) ions. While the co... | 03/24/1992 |
| 5098487 | Copper alloys for shaped charge liners A metal liner for a shaped charge device having a ductile metal matrix and a discrete second phase is provided. The allow composition is selected so the second phase is molten when the liner is accelerated following detonation. The molten phase reduces th... | 03/24/1992 |
| 5098864 | Process for manufacturing a metal pin grid array package A metal pin grid array package and a process for the assembly of the package is provided. The package includes a metal or metal alloy base component having an ordered array of holes. Terminal pins are electrically interconnected to a desired circuit and e... | 03/24/1992 |
| 5096508 | Surface modified copper alloys A composite copper alloy having a modified surface is provided. An element or combination of elements both soluble in copper and reactive with nitrogen are cast with copper or a copper alloy forming a solid state solution. The alloy is reacted with a nitr... | 03/17/1992 |
| 5074933 | Copper-nickel-tin-silicon alloys having improved processability The invention provides a process for the manufacture of copper alloys having improved processability. The alloys are melted and atomized into droplets which are spray cast into a coherent deposit. The spray cast alloys are characterized by a finer dispers... | 12/24/1991 |
| 5073521 | Method for housing a tape-bonded electronic device and the package employed A method for the assembly of an adhesively sealed tape package having base and cover components is provided. An electronic device is first bonded to the inner leads of a tape leadframe. The chip on tape is then disposed between the base component and the ... | 12/17/1991 |
| 5066368 | Process for producing black integrally colored anodized aluminum components A process for producing electronic package components from an aluminum alloy is disclosed. The components have a black color through integral color anodization. The desired color, thickness and surface finish are achieved by regulation of amperage during ... | 11/19/1991 |
| 5065228 | G-TAB having particular through hole A thin, preferably flexible circuit having multiple conductive planes separated by a non-conductive layer is provided. Conductive vias electrically interconnect the conductive planes. The conductive vias comprise carbon coated blind vias which are made co... | 11/12/1991 |
| 5046971 | Terminal pins for flexible circuits The present invention relates to a terminal pin for electronic circuitry. The terminal pin includes an axial passageway. Various processes for electrically connecting the pin to the circuit are provided. The processes include riveting, welding and solderi... | 09/10/1991 |
| 5047371 | Glass/ceramic sealing system The present invention relates to a glass/ceramic sealing system. A sealing glass having a coefficient of thermal expansion in excess of 160×10-7 in/in/° C. is provided. The glass is useful for matched sealing of copper and copper based alloys... | 09/10/1991 |
| 5043534 | Metal electronic package having improved resistance to electromagnetic interference A metal electronic package is provided having improved electromagnetic interference shielding. Metal base and cover components are electrically interconnected to remain at same voltage potential thereby reducing EMI induced mutual inductance. An electrica... | 08/27/1991 |
| 5043222 | Metal sealing glass composite with matched coefficients of thermal expansion The present invention relates to a glass for making glass to metal seals. The coefficient of thermal expansion of the glass is in excess of 160×10-7 in/in/°C. making the glass particularly useful for sealing copper and copper based alloys. Th... | 08/27/1991 |
