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| Number | Title | Issue Date |
| 6682350 | Laser pistol and method or system for retrofitting sharpshooting pistols A laser pistol and a method or system for retrofitting sharpshooting pistols whose recoil mechanism is complicated in design and has an unrealistic trigger resistance. A conversion of known sharpshooting pistols into simulation-type laser pistols, whose m... | 01/27/2004 |
| 6670022 | Nanoporous dielectric films with graded density and process for making such films The present invention relates to nanoporous dielectric films and to a process for their manufacture. A substrate having a plurality of raised lines on its surface is provided with a relatively high porosity, low dielectric constant, silicon containing pol... | 12/30/2003 |
| 6660406 | Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit There are provided an electrodeposited copper foil with carrier that can be used for manufacturing a printed wiring board that excels in the finished accuracy of the resistor circuit in comparison with a conventional printed wiring board with resistor cir... | 12/09/2003 |
| 6657849 | Formation of an embedded capacitor plane using a thin dielectric A capacitor, which has a pair of conductive foils each having a dielectric layer on its surface, wherein the dielectric layers are attached to one another. In one process for its production, a capacitor is formed by applying a first dielectric layer onto ... | 12/02/2003 |
| 6652922 | Electron-beam processed films for microelectronics structures An improved method for producing substrates coated with dielectric films for use in microelectronic applications wherein the films are processed by exposing the coated substrate surfaces to a flux of electron beam. Substrates cured via electron beam expos... | 11/25/2003 |
| 6629348 | Substrate adhesion enhancement to film The invention relates to the manufacture of printed circuit boards having improved interlayer adhesion. More particularly, the present invention pertains to adhesiveless printed circuit boards having excellent thermal performance and useful for producing ... | 10/07/2003 |
| 6610417 | Nickel coated copper as electrodes for embedded passive devices The invention relates to the manufacture of metal foil electrodes useful in the manufacture of printed circuit boards having passive circuit components such as capacitors, resistors or inductors configured in a planar orientation. A copper foil is coated ... | 08/26/2003 |
| 6610182 | Cup-type plating apparatus and method for plating wafers The present cup-type plating apparatus improves a conventional cup-type plating apparatus and prevents the surface of a wafer due to a mist of the plating solutions from being contaminated. A plating solution is supplied to a wafer which is placed on a wa... | 08/26/2003 |
| 6610145 | Deposition of nanoporous silica films using a closed cup coater A process for forming a uniform nanoporous dielectric film on a substrate. The process includes horizontally positioning a flat substrate within a cup; depositing a liquid alkoxysilane composition onto the substrate surface; covering the cup such that the... | 08/26/2003 |
| 6607794 | Light-reflecting molded articles and methods of making the same A light-reflecting article having an average total reflectivity of at least about 93%, e.g., at least about 95%, for light in a 400 to 700 nanometer wavelength range comprises a thermoplastic or thermoset polymer matrix, such as an acrylonitrile-butadiene... | 08/19/2003 |
| 6607991 | Method for curing spin-on dielectric films utilizing electron beam radiation An electron beam exposure method is described which provides a means of curing spin-on-glass or spin-on-polymer dielectric material formed on a semiconductor wafer. The dielectric material insulates the conductive metal layer and planarizes the topography... | 08/19/2003 |
| 6606792 | Process to manufacturing tight tolerance embedded elements for printed circuit boards A process for forming printed circuit substrates incorporating impedance elements in which a pattern of impedance elements and a conductor pattern are incorporated on an insulating support. The process involves depositing a layer of an impedance material ... | 08/19/2003 |
| 6589889 | Contact planarization using nanoporous silica materials A process for forming a substantially planarized nanoporous dielectric silica coating on a substrate suitable for preparing a semiconductor device, and semiconductor devices produced by the methods of the invention. The process includes the steps of apply... | 07/08/2003 |
| 6589862 | Process of using siloxane dielectric films in the integration of organic dielectric films in electronic devices The invention relates to cured dielectric films and a process for their manufacture which are useful in the production of integrated circuits. Dual layered dielectric films are produced in which a lower layer comprises a non-silicon containing organic pol... | 07/08/2003 |
| 6582640 | Process for the continuous production of a preform mat From about 50 to about 90% by weight of fibers, in particular wood fibers, and/or pellets made from cellulose or from wood, are mixed with from about 10 to about 50% by weight of a hot-curing resin, each of the percentages by weight being based on the tot... | 06/24/2003 |
| 6583047 | Method for eliminating reaction between photoresist and OSG A method of forming a microelectronic device while preventing photoresist poisoning. Various layers of conductive metals and dielectric materials are deposited onto a substrate in selective sequence to form an integrated circuit. Vias and trenches are for... | 06/24/2003 |
| 6559071 | Process for producing dielectric thin films A process for forming a nanoporous silica dielectric coating on a substrate. A substrate containing a deposited film is suspended within a sealable hotplate, while remaining free of contact with the hotplate. The hotplate is sealed and an inert gas is flo... | 05/06/2003 |
| 6559045 | Fabrication of integrated circuits with borderless vias The invention relates to the formation of structures in microelectronic devices such as integrated circuit devices by means of borderless via architectures in intermetal dielectrics. An integrated circuit structure has a substrate, a layer of a second die... | 05/06/2003 |
| 6550942 | Linear illumination sources and systems Improved linear illumination sources are disclosed which utilize external, highly reflective enclosures containing one or more linear openings and thereby achieve improved source efficiency, output irradiance and/or output radiance. Such improved illumina... | 04/22/2003 |
| 6551926 | Electron beam annealing of metals, alloys, nitrides and silicides A process for the formation of structures in microelectronic devices such as integrated circuit devices wherein a patterned layer of a metal, alloy, nitride or silicide is subjected to a low temperature, wide beam electron beam annealing. The process invo... | 04/22/2003 |
| 6547633 | Method of closing a stuffed toy A stuffed toy formed by providing stuffable toy shell having several fabric members fastened together, thereby defining a container which encloses an interior chamber and which has an exterior surface defining a shape of a toy. The container has an openin... | 04/15/2003 |
| 6548899 | Method of processing films prior to chemical vapor deposition using electron beam processing A treated substrate produced by a process for treating a dielectric layer on a substrate, which comprises applying a sufficient amount of a liquid dielectric composition onto an upper surface of a semiconductor substrate to thereby form a dielectric layer... | 04/15/2003 |
| 6542684 | Optimized multi-layer optical waveguiding system A single mode optical waveguide which is lithographically formed and employs polymeric materials having low propagation loss. The optical waveguide has a substrate, a polymeric, buffer layer having an index of refraction nb disposed on a surfac... | 04/01/2003 |
| 6536741 | Insulating insert for magnetic valves An insulating insert for a magnetic air valve having a metal housing. The insert minimizes electrical contact between the metal housing and wires or other conductive objects contained within the metal housing. The insert comprises an electrically insulati... | 03/25/2003 |
| 6537845 | Chemical surface deposition of ultra-thin semiconductors A chemical surface deposition process for forming an ultra-thin semiconducting film of Group IIB-VIA compounds onto a substrate. This process eliminates particulates formed by homogeneous reactions in bath, dramatically increases the utilization of Group ... | 03/25/2003 |
| 6518205 | Multifunctional reagents for the surface modification of nanoporous silica films A process for treating silica dielectric film on a substrate, which includes reacting a suitable hydrophilic silica film with an effective amount of a multifunctional surface modification agent. The film is present on a substrate and optionally has a pore... | 02/11/2003 |
| 6515110 | Multivalent antigen-binding proteins Compositions of, genetic constructions coding for, and methods for producing multivalent antigen-binding proteins are described and claimed. The methods include purification of compositions containing both monomeric and multivalent forms of single polypep... | 02/04/2003 |
| 6509259 | Process of using siloxane dielectric films in the integration of organic dielectric films in electronic devices The invention relates to cured dielectric films and a process for their manufacture which are useful in the production of integrated circuits. Dual layered dielectric films are produced in which a lower layer comprises a non-silicon containing organic pol... | 01/21/2003 |
| 6506730 | Nasal transmucosal delivery of peptide conjugated with biocompatible polymers The present invention relates to a pharmaceutical composition for the nasal transmucosal delivery of a biocompatible polymer-biologically active peptide conjugate. The pharmaceutical composition of the present invention increases the water solubility of p... | 01/14/2003 |
| 6504708 | Key chain organizer assembly A hand held electronic data organizer which may conveniently serve as a portable key chain device. The organizer includes a housing which contains internal electronic components such as a microprocessor coupled to a data memory. These internal components ... | 01/07/2003 |
| 6503850 | Process for producing nanoporous dielectric films at high pH The present invention relates to nanoporous dielectric films and to a process for their manufacture. Such films are useful in the production of integrated circuits. A precursor of an alkoxysilane, and low and high volatility solvents are mixed at a pH of ... | 01/07/2003 |
| 6504247 | Integrated having a self-aligned Cu diffusion barrier A microelectronic device having a self aligned metal diffusion barrier is disclosed. A microelectronic device having a substrate and a dielectric layer on the substrate. A trench having inside walls is formed through the dielectric layer. A lining of a ba... | 01/07/2003 |
| 6500349 | Manufacture of printed circuits using single layer processing techniques A continuous process for forming multilayer circuit structures which includes applying and curing a film forming polymer onto the matte side of a copper foil. The opposite (shiny) side of the foil is optionally but preferably cleaned, and applied with a p... | 12/31/2002 |
| 6498399 | Low dielectric-constant dielectric for etchstop in dual damascene backend of integrated circuits The invention provides microelectronic devices such as integrated circuit devices. Such have vias, interconnect metallization and wiring lines using dissimilar low dielectric constant intermetal dielectrics. The use of both organic and inorganic low-k die... | 12/24/2002 |
| 6495906 | Simplified process for producing nanoporous silica The present invention relates to low dielectric constant nanoporous silica films and to processes for their manufacture. A substrate, e.g., a wafer suitable for the production of an integrated circuit, having a plurality of raised lines and/or electronic ... | 12/17/2002 |
| 6495163 | Moisture barrier film coating composition, method and coated form A dry moisture barrier film coating composition for forming a moisture barrier film coating for pharmaceutical tablets and the like comprises polyvinyl alcohol, soya lecithin, and optionally a flow aid, a colorant, and/or a suspending agent. A liquid coat... | 12/17/2002 |
| 6495479 | Simplified method to produce nanoporous silicon-based films A nanoporous dielectric film useful for the production of semiconductor devices, integrated circuits and the like, is provided, together with processes for producing these improved films. The films are produced by a process that includes (a) preparing a s... | 12/17/2002 |
| 6489225 | Method for controlling dopant profiles and dopant activation by electron beam processing An improved dopant application system and method for the manufacture of microelectronic devices accurately places dopant on and within a dielectric or semiconductor surface. Diffusing and activating p-type and n-type dopants in dielectric or semiconductor... | 12/03/2002 |
| 6489030 | Low dielectric constant films used as copper diffusion barrier A microelectronic device having a cured polycarbosilane diffusion barrier is disclosed. A microelectronic device has a substrate, a dielectric layer on the substrate and metal filled vias formed through the dielectric layer. A covering of a cured polycarb... | 12/03/2002 |
| 6487354 | Design of low insertion loss, single-mode polymeric waveguides The invention provides organic optical waveguide devices which are lithographically formed and employ polymeric materials having low propagation loss. An optical waveguide has a substrate; a polymeric buffer layer on a surface of the substrate; a thin, po... | 11/26/2002 |
