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| Number | Title | Issue Date |
| 8143721 | Package substrate dynamic pressure structure Devices and methods for their formation, including electronic assemblies having a shape memory material structure, are described. In one embodiment, a device includes a package substrate and an electronic component coupled to the package substrate. The device also i... | 03/27/2012 |
| 8127979 | Electrolytic depositon and via filling in coreless substrate processing Electronic assemblies including coreless substrates and their manufacture using electrolytic plating, are described. One method includes providing a core comprising a metal, and forming a dielectric material on the core. The method also includes forming vias in the ... | 03/06/2012 |
| 8081489 | Two piece wire bale independent load mechanism Electronic assemblies are described. One embodiment includes a circuit board, a socket coupled to the circuit board, and a device positioned in the socket. The embodiment also includes a load mechanism including first and second components, the first component pivot... | 12/20/2011 |
| 8064728 | Traceability marks The formation of marks on devices is described. In one embodiment, a method for marking a device includes forming a plurality of unique marks sequentially on a device. The method includes defining a virtual array having a plurality of cells extending in an x-directi... | 11/22/2011 |
| 8044497 | Stacked die package The formation of electronic assemblies is described. One embodiment includes first and second semiconductor die structures each including a front side and a backside, the front side including an active region and the backside including metal regions and non-metal re... | 10/25/2011 |
| 8013444 | Solder joints with enhanced electromigration resistance Electronic assemblies and solders used in electronic assemblies are described. One embodiment includes a die and a substrate, with a solder material positioned between the die and the substrate, the solder comprising at least 91 weight percent Sn, 0.4 to 1.0 weight ... | 09/06/2011 |
| 8009442 | Directing the flow of underfill materials using magnetic particles Electronic devices and methods for fabricating electronic devices are described. One method includes providing a substrate and a die, and coupling the die to the substrate, wherein a gap remains between the die and the substrate. The method also includes placing an ... | 08/30/2011 |
| 7911052 | Nanotube based vapor chamber for die level cooling The formation of electronic assemblies is described. In one embodiment, an electronic assembly includes a semiconductor die and a plurality of spaced apart nanotube structures on the semiconductor die. The electronic assembly also includes a fluid positioned between... | 03/22/2011 |
| 7882628 | Multi-chip packaging using an interposer such as a silicon based interposer with through-silicon-vias The formation of electronic assemblies is described. One embodiment includes providing a body and forming a first metal pad layer on a first surface thereof. A second metal pad layer is formed in contact with the first metal pad layer, the second metal pad layer hav... | 02/08/2011 |
| 7875503 | Reducing underfill keep out zone on substrate used in electronic device processing Electronic devices and methods for fabricating electronic devices are described. One method includes providing a substrate with a die attach area, and forming a layer on the substrate outside of the die attach area. The layer may be formed from a fluoropolymer mater... | 01/25/2011 |
| 7867003 | Wire bale independent load mechanism Electronic assemblies are described. One embodiment includes a circuit board and a socket coupled to the circuit board. The assembly also includes a load mechanism including a first lever arm and a second lever arm. The load mechanism also includes a first axis port... | 01/11/2011 |
| 7851342 | In-situ formation of conductive filling material in through-silicon via The formation of electronic assemblies including a die having through vias is described. In one embodiment, a method includes providing Si die including a first surface and a second surface opposite the first surface, and forming a via extending through the Si die f... | 12/14/2010 |
| 7841080 | Multi-chip packaging using an interposer with through-vias One embodiment relates to forming a plurality of vias extending partially through a body, the vias including sidewalls defined by the body. An insulating layer is formed on the sidewalls and on an upper surface of the body. An electrically conductive layer is formed... | 11/30/2010 |
| 7829195 | Fluorination pre-treatment of heat spreader attachment indium thermal interface material The formation of electronic assemblies including a heat spreader coupled to a die through a thermal interface material formed from an indium preform, is described. One embodiment relates to a method including providing a preform comprising indium, the preform includ... | 11/09/2010 |
| 7829069 | Hair treatment systems and methods A method for treating hair includes applying a first composition to the hair in a foam form and applying a second composition to the hair in foam form. The compositions are mixed on the hair. The first composition may include an oxidative dye. The second composition... | 11/09/2010 |
| 7767025 | Nozzle array configuration to facilitate deflux process improvement in chip attach process Systems and methods for treating workpieces are described. One embodiment relates to a deflux system including at least one array of nozzles, the nozzles adapted to transmit a fluid outward therefrom. The nozzles are moveable relative to one another, so that a dista... | 08/03/2010 |
| 7724542 | Reworkable RF shield Certain embodiments relate to electronic devices and methods for forming electronic devices having a component shielded by a reworkable RF shield. The RF shield may be positioned to surround one or more components on a substrate. The RF shield may include a pluralit... | 05/25/2010 |
| 7713839 | Diamond substrate formation for electronic assemblies Electronic assemblies and methods for forming assemblies including a diamond substrate are described. One embodiment includes providing a diamond support and forming a porous layer of SiO2 on the diamond support. A diamond layer is formed by chemical vapo... | 05/11/2010 |
| 7710709 | Carbon nanotube coated capacitor electrodes Devices and methods for their formation, including electronic devices containing capacitors, are described. In one embodiment, a device includes a substrate and a capacitor is formed on the substrate. The capacitor includes first and second electrodes and a capacito... | 05/04/2010 |
| 7682876 | Electronic assemblies having a low processing temperature Embodiments relate to electronic assemblies and methods for forming electronic assemblies. One method includes providing a die and a copper heat spreader that are to be coupled to one another through a thermal interface material. A layer of tin is formed on the copp... | 03/23/2010 |
| 7651021 | Microball attachment using self-assembly for substrate bumping Electronic devices and methods for fabricating electronic devices are described. One method includes providing a substrate with a plurality of bonding pads thereon, and providing a plurality of solder microballs, the microballs including a coating thereon. The metho... | 01/26/2010 |
| 7651020 | Amphiphilic block copolymers for improved flux application Embodiments include materials which may be used during electronic device fabrication, including a flux material. The flux material comprises a solution including a plurality of micellar structures in a solvent, the micellar structures each including a plurality of a... | 01/26/2010 |
| 7579686 | Thermal interface material with hotspot heat remover The formation of electronic assemblies including a heat spreader coupled to a die through a thermal interface material is described. In one embodiment, the heat spreader includes a surface having a structure extending a distance outward therefrom. The thermal interf... | 08/25/2009 |
| 7542794 | Method of extracting and evaluating paced heart beats using max-min transform analysis Methods for identifying and extracting heart depolarization and repolarization in a paced heart. Certain methods also include identifying and analyzing particular features of at least one pacing spike and QRS waveform for heart beat characterization. These features ... | 06/02/2009 |
| 7477197 | Package level integration of antenna and RF front-end module Electronic devices and methods for their formation are described. One device relates to an electronic assembly including a substrate having a first surface and a second surface opposite the first surface. The electronic assembly also includes at least one RF front-e... | 01/13/2009 |
| 7362580 | Electronic assembly having an indium wetting layer on a thermally conductive body Embodiments include electronic packages and methods for forming electronic packages. One method includes providing a die and a thermal interface material on the die. A metal body is adapted to fit over the die. A wetting layer of a material comprising indium is form... | 04/22/2008 |
| 7340823 | Methods for forming head suspension assemblies Embodiments include a method for forming a head suspension assembly. A spacer layer is formed in or on a silicon wafer. A transfer film including an opening defining the shape of a slider support membrane is provided, and the opening is filled with a resin material.... | 03/11/2008 |
| 7319048 | Electronic assemblies having a low processing temperature Embodiments relate to electronic assemblies and methods for forming electronic assemblies. One method includes providing a die and a copper heat spreader that are to be coupled to one another through a thermal interface material. A layer of tin is formed on the copp... | 01/15/2008 |
| 7299088 | Apparatus and methods for brain rhythm analysis Embodiments include methods and apparatus for determining whether a neurological event has occurred in a subject. An apparatus includes at least one sensor adapted to sense electroencephalogram signals from the subject. The apparatus also includes an electroencephal... | 11/20/2007 |
| 7285863 | Pad structures including insulating layers having a tapered surface Embodiments include a semiconductor device comprising: a pad formed on an insulating layer and having an electric connection region with external components; and a protective insulating layer which has an aperture for exposing the electric connection region. The pro... | 10/23/2007 |
| 7277745 | Implantable myocardial ischemia detection, indication and action technology One embodiment enables detection of MI/I and emerging infarction in an implantable system. A plurality of devices may be used to gather and interpret data from within the heart, from the heart surface, and/or from the thoracic cavity. The apparatus may further alert... | 10/02/2007 |
| 7243833 | Electrically-isolated interconnects and seal rings in packages using a solder preform Embodiments include electronic assemblies and methods for forming electronic assemblies. One embodiment includes a method of forming a MEMS device assembly, including forming an active MEMS region on a substrate. A plurality of bonding pads electrically coupled to t... | 07/17/2007 |
| 7200918 | Method for forming an air bearing surface on a slider Embodiments include a slider having a silicon body and at least one carbide pad structure embedded therein. At least one head structure for reading and/or writing data is located on the silicon body. The silicon body includes an air bearing surface on which the head... | 04/10/2007 |
| 7196923 | Bitcell layout Bitcell layouts for use in electronic devices and systems are described. One embodiment relates to a memory including at least one bitcell, the bitcell including a storage cell region and a read channel region. The storage cell region is substantially L-shaped and i... | 03/27/2007 |
| 7170715 | Microsuspension assemblies for direct access storage devices Embodiments include a method for forming a head suspension assembly. A spacer layer is formed in or on a silicon wafer. A transfer film including an opening defining the shape of a slider support membrane is provided, and the opening is filled with a resin material.... | 01/30/2007 |
| 7163861 | Semiconductor devices, methods of manufacturing semiconductor devices, circuit substrates and electronic devices Certain embodiments include a semiconductor device capable of preventing a retardation of signal transmission between the smallest units, a method for the manufacture thereof, a circuit substrate and an electronic device. Embodiments also include a manufacturing met... | 01/16/2007 |
| 7160757 | Gap control between interposer and substrate in electronic assemblies Electronic assemblies and methods for forming assemblies are described. One embodiment includes a method of forming an electronic assembly, including forming a plurality of first solder bumps on one of a substrate and an interposer. The substrate and interposer are ... | 01/09/2007 |
| 7158348 | Integrated lead suspension for use in a disk drive using a tri-metal laminate and method for fabrication An example of a multi-layer structure which may be used for supporting a transducer includes a support layer and an etch stop layer formed from a refractory metal on the support layer. A first electrically conducting layer of copper may be positioned on the etch sto... | 01/02/2007 |
| 7133257 | Control of twist, crown and camber for sliders using location sensitive scribing Embodiments include a method for adjusting the twist, crown and camber of an air bearing surface a slider to substantially match final target values for twist, crown and camber, the slider having a back surface opposite the air bearing surface. The method includes t... | 11/07/2006 |
| 7129148 | Methods for manufacturing semiconductor devices and semiconductor devices having trench isolation regions A semiconductor device having trench isolation regions in which leaks are suppressed may be formed using the following steps. (a) Forming a trench 32 in a semiconductor layer 12; (b) forming a dielectric layer 40 that fills the trench 32;... | 10/31/2006 |
