Did You Know...
...Chester Carlson was a patent agent who tired of having to make multiple copies of patent applications using the only duplication method available at the time: carbon paper. In 1959 he came up with a new copying system and took it to IBM for evaluation. The "experts" at IBM determined potential sales to be only 5,000 units because people wouldn't want to use a bulky machine when they had carbon paper. Carlson's invention was the xerography process, the company founded on the system is Xerox.
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| Number | Title | Issue Date |
| 6340894 | Semiconductor testing apparatus including substrate with contact members and conductive polymer interconnect A die contacting substrate establishes ohmic contact with the die by means of raised portions on contact members. The raised portions are dimensioned so that a compression force applied to the die against the substrate results in a limited penetration of ... | 01/22/2002 |
| 5539324 | Universal wafer carrier for wafer level die burn-in A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication bet... | 07/23/1996 |
| 5483175 | Method for circuits connection for wafer level burning and testing of individual dies on semiconductor wafer Integrated circuit devices on a wafer are tested by the use of test circuit on the integrated circuit devices which is connected by means of a grid. The grid is used to enable the test circuitry, and provides an ability to test the devices while still on ... | 01/09/1996 |
| 5457400 | Semiconductor array having built-in test circuit for wafer level testing A test circuit is provided for an integrated circuit device, whereby an oscillator is provided on-chip and is activated by a test circuit. The test circuit provides an ability to test the devices while still on the wafer and facilitates burning in the waf... | 10/10/1995 |
| 5408190 | Testing apparatus having substrate interconnect for discrete die burn-in for nonpackaged die A reusable burn-in/test fixture for discrete die consists of two halves. The first half of the test fixture contains cavity in which die is inserted. Electrical contact with bondpads or bumps on the die is established through an intermediate substrate. Wh... | 04/18/1995 |
