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Safety System For Remove a Rider From a Vehicle by Deploying a Parachute
Methods and apparatus for reducing the velocity of a rider in or on an open cockpit vehicle when the rider is thrown from the vehicle.
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| Number | Title | Issue Date |
| 6117704 | Stackable layers containing encapsulated chips A method and structure are disclosed which involve the re-wafering of previously processed and tested IC chips. The chips are encapsulated in supporting non-conductive material in a neo-wafer, so that they may be further processed preparatory to dicing la... | 09/12/2000 |
| 6028352 | IC stack utilizing secondary leadframes A structure and process are disclosed in which IC chip-containing layers are stacked to create electronic density. Each layer is formed by mechanically and electrically joining an IC-containing TSOP with an external leadframe. Each leadframe contains cond... | 02/22/2000 |
| 6014316 | IC stack utilizing BGA contacts A structure and process are disclosed in which IC chip-containing layers are stacked to create electronic density. Each layer is fabricated by forming one or more flexible circuit around a TSOP. Each flexible circuit contains conductors which are disposed... | 01/11/2000 |
| 5991029 | Attenuated total reflecance probe employing large incidence angles A sample immersion probe is disclosed which has an ATR (attenuated total reflectance) element at its tip. The ATR is so shaped that radiation exiting the probe will travel in paths parallel to radiation entering the probe. The angles of incidence of radia... | 11/23/1999 |
| 5955668 | Multi-element micro gyro A micro-gyro device is disclosed combining an element which oscillates around the drive axis and an element which rocks around the output axis, so arranged that Coriolis force is transmitted from one element of the other without any substantial transfer o... | 09/21/1999 |
| 5953588 | Stackable layers containing encapsulated IC chips Neo-chips suitable for stacking in 3D multi-layer electronic modules are formed by embedding (encapsulating) IC chips in epoxy material which provides sufficient layer rigidity after curing. The encapsulated chips are formed by placing separate IC chips, ... | 09/14/1999 |
| 5773825 | Bi-layer attenuated total reflectance device providing optimized absorbance linearity A sensing apparatus for spectral analysis in which the sensing head is bi-layered. The layer contacting the sample is formed of corrosion-resistant material, e.g., diamond. It is engaged by a supporting layer formed of infrared transparent material, e.g.,... | 06/30/1998 |
| 5745631 | Self-aligning optical beam system A self-aligning optical beam system is disclosed in which optical alignment of two beam-carrying portions, such as a laser beam generated by a chip, and a light guide formed as a waveguide in a polymeric material, is precisely controlled by plug-and-socke... | 04/28/1998 |
| 5688721 | 3D stack of IC chips having leads reached by vias through passivation covering access plane A process in which a plurality of IC chips are stacked in a unitary structure having a novel method of exposing leads on the access plane of the stack. After a layer of dielectric material has been formed on the access plane, trenches (preferably trenches... | 11/18/1997 |
| 5643146 | Stationary exercise device having load-controlling braking system A stationary exercise cycle is disclosed having a drive wheel which receives both user driving force and automatically controlled friction brake resistance, i.e., it is a single-stage device. Free-wheeling is provided between a user-driven shaft and the p... | 07/01/1997 |
| 5635705 | Sensing and selecting observed events for signal processing Circuitry for sensing a relatively large number of events, and outputting to processing circuitry only those events which have two characteristics: (1) a magnitude above a preselected threshold level, and (2) a rate of change greater than a preselected ba... | 06/03/1997 |
| 5581498 | Stack of IC chips in lieu of single IC chip An electronic package is disclosed in which a plurality of stacked "same function" IC chips are designed to be used in lieu of a single IC chip, and to fit into a host computer system, in such a way that the system is "unaware" that substitution has been ... | 12/03/1996 |
| 5508836 | Infrared wireless communication between electronic system components A wireless infrared pulse-transmitting system for communication with electronic components. The receiver for such a system has radically reduced current (and power) values, which permit a battery-powered receiver to remain on while awaiting transmitter si... | 04/16/1996 |
| 5459316 | Immersion probe for infrared internal reflectance spectroscopy An immersion probe (for powder or liquid) is disclosed comprising an ATR element supported at the bottom of a radiation-confining tube. The ATR element has a sample-entering tip which is either conical (preferably) or roof-top shaped. The ATR element caus... | 10/17/1995 |
| 5432729 | Electronic module comprising a stack of IC chips each interacting with an IC chip secured to the stack An electronic module comprising a multiplicity of prestacked IC chips, such as memory chips, and an IC chip, referred to as an active substrate or active backplane, to which the stack of chips is directly secured. A multiplicity of aligned solder bumps ma... | 07/11/1995 |
| 5424920 | Non-conductive end layer for integrated stack of IC chips An integrated stack of layers incorporating a plurality of IC chip layers has an end layer which is formed of dielectric material (or covered with such material). The outer surface of the end layer provides a substantial area for the spaced location of a ... | 06/13/1995 |
| 5421194 | Liquid quality analysis system combining sparging and an infrared gas cell A sparging-infrared liquid analyzing system having a vessel in which a gas stream makes a single pass through a liquid stream containing contaminants, in order to provide vapor-to-liquid equilibrium of contaminants in the gas stream. The gas stream is the... | 06/06/1995 |
| 5418615 | Probe for liquid sample analysis by light transmission A probe for liquid sample analysis is disclosed which causes radiation to pass through the sample at a gap formed in the probe housing. A single radiation transmission is used to avoid problems of radiation back scatter and sample reliability. Windows are... | 05/23/1995 |
| 5406701 | Fabrication of dense parallel solder bump connections A method and product are disclosed in which multiple solder bumps on a first planar surface are guided into engagement with terminals on a second planar surface by means of holes formed (by a photolithographic process) in a dielectric layer, which has bee... | 04/18/1995 |
| 5347428 | Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip A computer module is disclosed in which a stack of glued together IC memory chips is structurally integrated with a microprocessor chip. The memory provided by the stack is dedicated to the microprocessor chip. The microprocessor and its memory stack may ... | 09/13/1994 |
| 5279991 | Method for fabricating stacks of IC chips by segmenting a larger stack A method for fabricating stacks of IC chips into modules providing high density electronics. A relatively large number of layers are stacked, and then integrated by curing adhesive applied between adjacent layers. A large stack is formed, various processi... | 01/18/1994 |
| 5235672 | Hardware for electronic neural network This application discloses hardware suitable for use in a neural network system. It makes use of Z-technology modules, each containing densely packaged electronic circuitry. The modules provide access planes which are electrically connected to circuitry l... | 08/10/1993 |
| 5218856 | Analysis of liquid-carried impurities by means of sparging A method for determining the concentration of individual solutes in a body of liquid, e.g., measuring contaminants in waste water. A sparging IR process is used, in which gas in the form of minute bubbles moves upwardly in a non-flowing body of liquid. Th... | 06/15/1993 |
| 5104820 | Method of fabricating electronic circuitry unit containing stacked IC layers having lead rerouting A process is disclosed which applies advanced concepts of Z-technology to the field of dense electronic packages. Starting with standard chip-containing silicon wafers, modification procedures are followed which create IC chips having second level metal c... | 04/14/1992 |
| 5089960 | Racing system for exercise machines A racing system for a group of exercise machines is disclosed. The race is entirely flexible, in that each exercise unit communicates electronically with all of the other potential racing units. Any user may offer a race, accept or reject another user's r... | 02/18/1992 |
| 5087122 | Adjustable attenuator for optical transmission system An improved variable rate attenuator (VOA) is disclosed, which is used in an optical signal transmission system for testing (and other) purposes. In an optical fiber data transmission system, the VOA can be used to determine how much attenuation of the li... | 02/11/1992 |
| 5065025 | Gas sample analysis provided by light pipe radiation structure A gas cell for use in spectrometric analysis is disclosed, in which a series of pipes provide both the gas chamber and a light guide for infrared radiation which passes through the gas to accomplish the analysis. The light pipe is designed to provide a ma... | 11/12/1991 |
| 5054920 | Internal reflectance cell having improved sample flow geometry An ATR sample cell is disclosed, of the type incorporating a circular internal reflectance crystal. A flowing liquid sample has input and output ports in the IRE housing, or cell, which are offset from the axis of the circular IRE (or rod) sufficiently to... | 10/08/1991 |
| 5054869 | Light pipe system having maximum radiation throughput A radiation guiding structure for incoherent radiation is disclosed in which a collimated beam is transmitted through a light pipe having high radition throughput. Radiation losses due to absorbance are minimized by: (1) matching the area of the beam and ... | 10/08/1991 |
| 5051551 | Immersion probe for infrared internal reflectance spectroscopy A probe is disclosed for use in internal reflection spectroscopy at locations immersed in containers. Two parallel light pipes, located inside the probe, are used to carry radiation toward and away from an internal reflectance element (IRE) located at or ... | 09/24/1991 |
| 5045685 | Analog to digital conversion on multiple channel IC chips An integrated circuit chip having a plurality of parallel channels, and a stack of such chips, are disclosed, in which the function of A/D signal conversion is accomplished in each on-chip channel. In order to satisfy the power and real estate limitations... | 09/03/1991 |
| 5015100 | Apparatus and method for normal incidence reflectance spectroscopy An external reflectance spectroscopy apparatus and method are disclosed in which maximum radiation througput is obtained by using a beamsplitter which reflects half of a collimated beam and transmits the other half. In order to obtain reliable results, th... | 05/14/1991 |
| 5011243 | Reflectance infrared microscope having high radiation throughput An infrared microscope is disclosed which provides illumination for reflectance by the sample. This illumination follows a path through the objective toward the sample, and again, after reflection, through the objective toward the detector. The reflectanc... | 04/30/1991 |
| 5002394 | Fabricating interferometers having reduced misalignment problems An interferometer structure is disclosed in which alignment problems are reduced by providing a special retaining structure for the transparent beamsplitter plates. In order to minimize distortion of the beamsplitter plates, the metal housing surfaces, ag... | 03/26/1991 |
| 4988195 | Internal reflectance apparatus and method using cylindrical elements An apparatus and method for fluid sample analysis are disclosed which use a cylindrical internal reflectance element (IRE) having conical end surfaces. The divergence of rays inside the IRE is minimized by using reflecting cones at each end of the IRE, th... | 01/29/1991 |
| 4983533 | High-density electronic modules - process and product A high-density electronic module is disclosed, which is suitable for use as a DRAM, SRAM, ROM, logic unit, arithmetic unit, etc. It is formed by stacking integrated-circuit chips, each of which carries integrated circuitry. The chips are glued together, w... | 01/08/1991 |
| 4949993 | Exercise apparatus having high durability mechanism for user energy transmission An exercising apparatus is disclosed which simulates stair-climbing. In order to reduce breakage problems in the force-transmitting structure between each pedal and a one-way rotating drive shaft, a pair of pulley wheels, each associated with a pair of ca... | 08/21/1990 |
| 4938474 | Exercise apparatus and method which simulate stair climbing An exercise apparatus is disclosed which simulates a stair climber, and which determines the amount of user exercise by the speed of rotation of a flywheel. The speed of the flywheel is controlled to maintain the desired speed of stair climbing by a frict... | 07/03/1990 |
| 4928232 | Signal averaging for optical time domain relectometers Means for digitizing and averaging the signals in an optical time domain reflectometer are disclosed in which a comparator is used to output a 1 or 0 into an arbitrarily large number of successive time-bins. In each comparator choice, the analog voltage s... | 05/22/1990 |
| 4912545 | Bonding of aligned conductive bumps on adjacent surfaces A bump bonding process and product are disclosed in which both pressure and heating are used in situations where the temperature should not exceed a predetermined amount, e.g., bonding of a photoconductor array to a module containing electronic processing... | 03/27/1990 |
