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Pizza Pie With Concentric Rings of Crust
A pizza mold for forming a plurality of concentric raised ridges of dough (i.e., crust) on the surface of a pizza pie.
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| Number | Title | Issue Date |
| 8178936 | Double-side mountable MEMS package The MEMS package has a mounting substrate on which one or more transducer chips are mounted wherein the mounting substrate has an opening. A top cover is attached to and separated from the mounting substrate by a spacer forming a housing enclosed by the top cover, t... | 05/15/2012 |
| 8139306 | Electrical current as probe for modulation at head-disk interface A system and method for measuring the modulation between a magnetic head and a magnetic storage medium, such as a disk, is disclosed. A magnetic read/write head is positioned above a magnetic storage medium at a given flying height. The magnetic read/write head read... | 03/20/2012 |
| 8081515 | Trench monos memory cell and array The MONOS vertical memory cell of the present invention allow miniaturization of the memory cell area. The two embodiments of split gate and single gate provide for efficient program and erase modes as well as preventing read disturb in the read mode. ... | 12/20/2011 |
| 8058106 | MEMS device package with vacuum cavity by two-step solder reflow method In a method of vacuum packaging a MEMS device, at least one MEMS device is attached on a substrate. A solder preform is printed on the substrate at the perimeter surrounding the substrate. A lid is attached to the solder preform wherein the lid provides a cavity enc... | 11/15/2011 |
| 8054585 | Gimbal with assymmetric dynamic stiffness In a suspension in a hard disk drive, a gimbal with asymmetric dynamic properties, in which the two halves of the gimbal may have different stiffness distribution or inertia distribution. Structural difference between the two halves, or materials with different stif... | 11/08/2011 |
| 8027127 | Method of reducing slider roll torque by balancing head gimbal assembly for improved seeking performance In a balanced head gimbal assembly for improved seeking performance, a slider having a magnetic head with a set of read elements to read data and a set of write elements to write data, an air-bearing surface, and a non-air-bearing surface is coupled to a suspension.... | 09/27/2011 |
| 8013404 | Folded lead-frame packages for MEMS devices The MEMS package comprises a first and a second pre-molded lead-frame substrate, at least one of them having a cavity formed by plastic sidewalls along its periphery. The first and second pre-molded lead-frame substrates are interconnected with metal leads. At least... | 09/06/2011 |
| 7999201 | MEMS G-switch device A Micro Electro Mechanical Systems (MEMS) G-switch includes one or more actuators formed between fixed driving stages and moveable driving stages. A proof mass is attached to the moveable driving stages and flexibly attached to a substrate through one or more spring... | 08/16/2011 |
| 7936604 | High speed operation method for twin MONOS metal bit array The present invention provides a novel operational method of twin MONOS metal bit or diffusion bit structure for high-speed application. In a first embodiment of the present invention, the alternative control gates are set at the same voltage. In a second embodiment... | 05/03/2011 |
| 7907368 | Balanced head gimbal assembly for improved seeking performance In a balanced head gimbal assembly for improved seeking performance, a slider having a magnetic head with a set of read elements to read data and a set of write elements to write data, an air-bearing surface, and a non-air-bearing surface is coupled to a suspension.... | 03/15/2011 |
| 7906844 | Multiple integrated circuit die package with thermal performance A multi-die package comprises a heat spreader disposed on a printed circuit substrate, at least one integrated circuit die disposed on a top side of the heat spreader and at least one other integrated circuit die disposed on a bottom side of the heat spreader wherei... | 03/15/2011 |
| 7885040 | Suspension with locally strengthened gimbal An apparatus with a head gimbal assembly designed to reduce movement and rotation of components of the head gimbal assembly structure is disclosed. One embodiment head gimbal assembly may comprise a flexure including a ramp limiter, a suspension assembly further com... | 02/08/2011 |
| 7877614 | Process for securing the access to the resources of an information handling system (I.H.S.) A process for securing the access to the resources of an Information Handling System (I.H.S.) in accordance with the present invention which involves the steps of: initiating a first preliminary qualification process for the purpos... | 01/25/2011 |
| 7843021 | Double-side mountable MEMS package The MEMS package has a mounting substrate on which one or more transducer chips are mounted wherein the mounting substrate has an opening. A top cover is attached to and separated from the mounting substrate by a spacer forming a housing enclosed by the top cover, t... | 11/30/2010 |
| 7760468 | Air-bearing design with particle rejection features An apparatus allowing for a slider for use in a disk drive is disclosed. An embodiment of the present invention may include a leading side, a trailing side, at least two main rails, a slider surface with an air bearing surface, and at least one trench substantially ... | 07/20/2010 |
| 7759566 | Tailoring critical properties of wood-mass, lateral and transverse stiffness, and damping-for use in musical instruments Optimized tone wood for acoustical performance and methods for optimizing tone wood are described. The longitudinal to cross-grain stiffness ratio, the acoustical mass, and damping of tone wood are adjusted to improve volume and quality of tonal output. These proper... | 07/20/2010 |
| 7692288 | MEMS packaging method for enhanced EMI immunity using flexible substrates A MEMS package and methods for its embodiment are described. The MEMS package has at least one MEMS device mounted on a flexible and foldable substrate. A metal cap structure surrounds the at least one MEMS device wherein an edge surface of the metal cap structure i... | 04/06/2010 |
| 7675711 | Measuring and neutralizing the electrical charge at the interface of a magnetic head and media A system and method for measuring and neutralizing the electrical charge at the interface of a magnetic head and a magnetic storage medium, such as a disk, is disclosed. A surface treatment material is applied to the magnetic head. The surface treatment material mat... | 03/09/2010 |
| 7660107 | HDD anti-shock and anti-vibration device A Hard Disk Drive anti-shock and anti-vibration device and a Data Storage Device consisting of a HDD and the HDD anti-shock and anti-vibration device are described. The HDD anti-shock and anti-vibration device includes a packaging paper and foam. The foam is adhered... | 02/09/2010 |
| 7617737 | Adjustment of pitch and roll static torques in a disk drive head gimbal assembly In a system and method for adjusting a static torque on a slider in a head-gimbal assembly, a substantially rigid mass is placed on an air-bearing surface (ABS) of a slider. A static attitude of the slider is measured, and an adjustment location and intensity for a ... | 11/17/2009 |
| 7592703 | RF and MMIC stackable micro-modules A new method to form shielded vias with microstrip ground plane in the manufacture of an integrated circuit device is achieved. The method comprises, first, providing a substrate. The substrate is etched through to form holes for planned shielded vias with microstri... | 09/22/2009 |
| RE40887 | Semiconductor chip with redistribution metal layer A new method is provided for the creation of Input/Output connection points to a semiconductor device package. An extension is applied to the conventional I/O connect points of a semiconductor device, allowing the original I/O point location to be relocated to a new... | 09/01/2009 |
| 7573131 | Die-up integrated circuit package with grounded stiffener A printed circuit substrate is disposed on a bottom side of a stiffener. An IC die is disposed on a top side of the stiffener. The die is electrically connected onto the printed circuit substrate by wire bonding through an open slot in the stiffener. The die is not ... | 08/11/2009 |
| 7573081 | Method to fabricate horizontal air columns underneath metal inductor A new method is provided for creating an inductor on the surface of a silicon substrate. The invention provides overlying layers of oxide fins beneath a metal inductor. The oxide fins provide the stability support for the overlying metal inductor while also allowing... | 08/11/2009 |
| 7550358 | MEMS device including a laterally movable portion with piezo-resistive sensing elements and electrostatic actuating elements on trench side walls, and methods for producing the same A method to create piezoresistive sensing elements and electrostatic actuator elements on trench sidewalls is disclosed. P-type doped regions are formed in the upper surface of an n-type substrate. A trench is formed in the substrate (e.g. by DRIE process) intersect... | 06/23/2009 |
| 7294870 | Top layers of metal for high performance IC's A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an ... | 11/13/2007 |
| 7531417 | High performance system-on-chip passive device using post passivation process A system and method for forming post passivation passive components, such as resistors and capacitors, is described. High quality electrical components, are formed on a layer of passivation, or on a thick layer of polymer over a passivation layer. ... | 05/12/2009 |
| 7517778 | Structure of high performance combo chip and processing method A method for fabricating a chip package is achieved. A seed layer is formed over a silicon wafer. A photoresist layer is formed on the seed layer, an opening in the photoresist layer exposing the seed layer. A first solder bump is formed on the seed layer exposed by... | 04/14/2009 |
| 7498196 | Structure and manufacturing method of chip scale package A Chip Scale Package (CSP) and a method of forming the same are disclosed. Single chips without the conventional ball mountings, are first attached to an adhesive-substrate (adsubstrate) composite having openings that correspond to the input/output (I/O) pads on the... | 03/03/2009 |
| 7470997 | Wirebond pad for semiconductor chip or wafer In the present invention, copper interconnection with metal caps is extended to the post-passivation interconnection process. Metal caps may be aluminum. A gold pad may be formed on the metal caps to allow wire bonding and testing applications. Various post-passivat... | 12/30/2008 |
| 7468551 | Multiple chips bonded to packaging structure with low noise and multiple selectable functions A chip package for semiconductor chips is provided by the method of forming a chip package includes the steps of forming a printed circuit board with a window therethrough; forming semiconductor chip connections of one or more primary chips which overlie the window ... | 12/23/2008 |
| 7465654 | Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structures A method for fabricating multiple metal layers includes the following steps. An electronic component is provided with multiple contact points. A first metal layer is deposited over said electronic component. A first mask layer is deposited over said first metal laye... | 12/16/2008 |
| 7465653 | Reliable metal bumps on top of I/O pads after removal of test probe marks In accordance with the objectives of the invention a new method is provided for the creation of metal bumps over surfaces of I/O pads. Contact pads are provided over the surface of a layer of dielectric. The aluminum of the I/O pads, which have been used as I/O pads... | 12/16/2008 |
| 7459790 | Post passivation interconnection schemes on top of the IC chips A new method is provided for the creation of interconnect lines. Fine line interconnects are provided in a first layer of dielectric overlying semiconductor circuits that have been created in or on the surface of a substrate. A layer of passivation is deposited over... | 12/02/2008 |
| 7459761 | High performance system-on-chip using post passivation process The present invention extends the above referenced continuation-in-part application by in addition creating high quality electrical components, such as inductors, capacitors or resistors, on a layer of passivation or on the surface of a thick layer of polymer. In ad... | 12/02/2008 |
| 7443033 | Post passivation interconnection schemes on top of the IC chips A new method is provided for the creation of interconnect lines. Fine line interconnects are provided in a first layer of dielectric overlying semiconductor circuits that have been created in or on the surface of a substrate. A layer of passivation is deposited over... | 10/28/2008 |
| 7436054 | MEMS microphone with a stacked PCB package and method of producing the same A MEMS microphone with a stacked PCB package is described. The MEMS package has at least one MEMS acoustic sensor device located on a PCB stack. A metal cap structure surrounds the at least one MEMS acoustic sensor device wherein an edge surface of the metal cap str... | 10/14/2008 |
| 7423346 | Post passivation interconnection process and structures A system and method for forming post passivation metal structures is described. Metal interconnections and high quality electrical components, such as inductors, transformers, capacitors, or resistors are formed on a layer of passivation, or on a thick layer of poly... | 09/09/2008 |
| 7422976 | Top layers of metal for high performance IC's A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an ... | 09/09/2008 |
| 7417317 | Post passivation interconnection schemes on top of the IC chips A new method is provided for the creation of interconnect lines. Fine line interconnects are provided in a first layer of dielectric overlying semiconductor circuits that have been created in or on the surface of a substrate. A layer of passivation is deposited over... | 08/26/2008 |
