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| Number | Title | Issue Date |
| 7587487 | Method and apparatus for load balancing based on XML content in a packet A technique to load balance network packet traffic using content switching is provided. Packets are routed to a particular server or otherwise processed based on the XML-related content identified in a header or body of the packet. Rules can be defined that specify ... | 09/08/2009 |
| 7356030 | Network switch cross point A switching fabric having cross points that process multiple stripes of serial data. Each cross point includes a plurality of port slices and ports. Each port includes a plurality of FIFOs, a FIFO read arbitrator, a multiplexer, a dispatcher, and an accumulator. In ... | 04/08/2008 |
| 7313714 | System and method for managing groups of modular power supplies for powering subcomponents of a computer system A system and method for dynamically managing a plurality of power supplies for a computer system has a plurality of first circuits, each of the first circuits responsive to an electrical condition of each of the plurality of power sources. A second circuit is couple... | 12/25/2007 |
| 7238104 | System and method for venting air from a computer casing A vent for a computer enclosure is envisioned. The vent system has a fan, operable to draw a flow of air from within the enclosure and direct it out through an outlet vent disposed in a wall of the enclosure. The outlet vent is made of an outlet path. The outlet pat... | 07/03/2007 |
| 7236490 | Backplane interface adapter A backplane interface adapter for a high-performance network switch. The backplane interface adapter receives narrow input cells carrying packets of data and outputs wide striped cells to a switching fabric. One traffic processing path through the backplane interfac... | 06/26/2007 |
| 7206283 | High-performance network switch The present invention provides a high-performance network switch. A digital switch has a plurality of blades coupled to a switching fabric via serial pipes. Serial link technology is used in the switching fabric. Each blade outputs serial data streams with in-band c... | 04/17/2007 |
| 7035101 | Power supply architecture A power supply is contained substantially within an enclosure of length, L. A first end of the enclosure has a first end wall containing an air intake port, with a second end of the enclosure having a second end wall containing an air exhaust port. An exterior wall ... | 04/25/2006 |
| 7009283 | Nonexposed heat sink for semiconductor package A semiconductor package having a fully encapsulated heat sink is disclosed, along with leadframes for making the package. A semiconductor chip is mounted on a surface of the heat sink. The heat sink is in an electrically insulative, thermally conductive connection w... | 03/07/2006 |
| 6938268 | Video stream sharing A method and apparatus to allow multiple users to share a common stream of video information while providing each user the ability to have video-motion-control without interrupting the video program material viewed by the remaining users sharing the stream of video ... | 08/30/2005 |
| 6881524 | Photolithography method including a double exposure/double bake A photoresist exposure process is disclosed which produces features which are substantially smaller than the aperture dimension of the mask used to make the feature. The smaller feature size results from a double exposure of the photoresist, combined with a double b... | 04/19/2005 |
| 6830955 | Semiconductor package and method for manufacturing the same A semiconductor package and method for manufacturing the same is disclosed. The semiconductor package comprises a semiconductor chip, a circuit board, an electrical connection means, an encapsulation material and a plurality of conductive balls. The semiconductor ch... | 12/14/2004 |
| 6815353 | Multi-layer film stack polish stop A method for improved dielectric polish control adjacent to device areas is described. This is particularly important for bipolar structures, although the method may be used for MOS structures as well. The method includes using highly selective methods for removing ... | 11/09/2004 |
| 6806558 | Integrated segmented and interdigitated broadside- and edge-coupled transmission lines A combination edge- and broadside-coupled transmission line element formed in an integrated circuit chip, using semiconductor processes, in a stack of metal layers separated by dielectric layers. Each of the metal layers includes a number of transmission lines. Inte... | 10/19/2004 |
| 6803254 | Wire bonding method for a semiconductor package A wire bonding method for electrically interconnecting stacked semiconductor chips is disclosed. A substrate (e.g., printed circuit board or metal leadframe) is provided. Metal circuit patterns are provided outside of a chip mounting region of the substrate, and met... | 10/12/2004 |
| 6798049 | Semiconductor package and method for fabricating the same A semiconductor package and method for fabricating the same is disclosed. In one embodiment, the semiconductor package includes a circuit board, at least two semiconductor chips, electric connection means, an encapsulant, and a plurality of conductive balls. The cir... | 09/28/2004 |
| 6791166 | Stackable lead frame package using exposed internal lead traces A die package is formed, which allows additional electrical connections to the die by using internal leads or traces from a lead frame. The internal leads are exposed through an upper or lower surface of the package, thereby allowing an additional die package to be ... | 09/14/2004 |
| 6787826 | Heterostructure field effect transistor A high electron mobility transistor is constructed with a substrate, a lattice-matching buffer layer formed on the substrate, and a heavily doped p-type barrier layer formed on the buffer layer. A spacer layer is formed on the barrier layer, and a channel layer is f... | 09/07/2004 |
| 6785191 | Robust power-on meter and method using a limited-write memory A data word is used to represent the total amount of time duration or predefined events a device has experienced during its lifetime. The data word is incremented count by count while the device is powered on and each updated data word is backed up to a non-volatile... | 08/31/2004 |
| D494999 | Credit card with accessible rotatable storage member | 08/24/2004 |
| 6778681 | Analysis and presentation of internal features of logs Systems and methods for non-intrusive analysis and display of internal features of wooden objects are provided. In embodiments of the system, a log is passed through a CT scanner in one continuous motion. One or more x-ray sources revolve around the log generating x... | 08/17/2004 |
| 6771053 | Buffered configurable nonvolatile programmable digital potentiometer A digital potentiometer, configurable and programmable using nonvolatile memory is disclosed. A unity-gain configured, rail-to-rail operational amplifier, used as voltage follower of buffer, can be inserted, by programming, between an internal wiper terminal and an ... | 08/03/2004 |
| 6762647 | Active protection circuit for load mismatched power amplifier A peak detector detects an amplifier output overvoltage condition if the amplifier drives a mismatched load impedance. In response to the detected overvoltage condition, a clamping transistor lowers a reference DC bias voltage supplied by a bias circuit to the ampli... | 07/13/2004 |
| 6762078 | Semiconductor package having semiconductor chip within central aperture of substrate Semiconductor packages having a thin structure capable of easily discharging heat from a semiconductor chip included therein, and methods for fabricating such semiconductor packages, are disclosed. An embodiment of a semiconductor package includes a semiconductor ch... | 07/13/2004 |
| 6757354 | Multi-view x-ray imaging of logs A method and apparatus is disclosed for mapping the relevant material properties of a log, such as knot location and extent. The outer shape of the log under bark is also revealed using this method, and the boundary between the heartwood and sapwood is accurately ma... | 06/29/2004 |
| 6737750 | Structures for improving heat dissipation in stacked semiconductor packages Semiconductor packages including at least two semiconductor dies are disclosed. A first die is mounted on a substrate, which may be a metallized laminate or a leadframe. A rigid support structure is mounted on the substrate over the first die. The support structure ... | 05/18/2004 |
| 6727761 | Resonant bypassed base ballast circuit Base ballast resistors used to control thermal runaway are each bypassed with a series-resonant inductor and capacitor pair. In some embodiments each inductor and capacitor pair is unique. In other embodiments a common inductor is used for each inductor and capacito... | 04/27/2004 |
| 6723582 | Method of making a semiconductor package having exposed metal strap Semiconductor devices and methods of forming such devices are disclosed. The devices include a package allowing for increased thermal dissipation. In one embodiment, the device includes a power MOSFET die that is electrically connected to a portion of the substrate ... | 04/20/2004 |
| 6717248 | Semiconductor package and method for fabricating the same There is provided a semiconductor package and method for fabricating the same. An embodiment of the semiconductor package includes: a semiconductor chip having a first face and a second face, the first face having a plurality of input/output pads formed thereon; a c... | 04/06/2004 |
| 6710583 | Low dropout voltage regulator with non-miller frequency compensation A low dropout voltage regulator circuit with non-Miller frequency compensation is provided. The circuit includes an input voltage terminal; an output voltage terminal; an error amplifier having a first input coupled to a reference voltage; a voltage follower coupled... | 03/23/2004 |
| 6711046 | Programmable optical array Programmable semiconductor elements, such as zener diodes, are used in an optical array. In one embodiment, an array of zener diodes is formed on a substrate surface and selectively zapped (programmed) to create a reflective filament between anode and cathode contac... | 03/23/2004 |
| 6707138 | Semiconductor device including metal strap electrically coupled between semiconductor die and metal leadframe A semiconductor device is disclosed that includes a semiconductor die, a metal leadframe, and a metal strap. A bottom surface of the semiconductor device is on and electrically coupled to a first portion of the leadframe. A first end portion of the metal strap is on... | 03/16/2004 |
| 6707168 | Shielded semiconductor package with single-sided substrate and method for making the same A semiconductor chip package is disclosed. The package includes a substrate, a metallization layer formed on one side of the substrate and a semiconductor die mounted on the substrate. The semiconductor die is electrically connected to a portion of the metallization... | 03/16/2004 |
| 6699765 | Method of fabricating a bipolar transistor using selective epitaxially grown SiGe base layer Embodiments of a bipolar transistor are disclosed, along with methods for making the transistor. An exemplary transistor includes a collector region in a semiconductor substrate, a base layer overlying the collector region and bound by a field oxide layer... | 03/02/2004 |
| 6697412 | Long wavelength laser diodes on metamorphic buffer modified gallium arsenide wafers A light-emitting device includes a GaAs substrate, a light-emitting structure disposed above the substrate and capable of emitting light having a wavelength of about 1.3 microns to about 1.55 microns, and a buffer layer disposed between the substrate and ... | 02/24/2004 |
| 6695120 | Assembly for transporting material A controlled material transport system (MTS) for carrying materials to and from workstations, test equipment, and processing and assembly tools in a common facility. The present invention includes a rigid robot vehicle mountable to a passive track system,... | 02/24/2004 |
| 6672773 | Optical fiber having tapered end and optical connector with reciprocal opening A method and apparatus for connecting optical fibers to waveguides and other optical elements are disclosed. In one embodiment, an optical fiber is modified so as to have opposing orthogonal tapered sidewalls that taper toward a tip of the fiber. An optic... | 01/06/2004 |
| 6667544 | Stackable package having clips for fastening package and tool for opening clips Embodiments of stackable packages for an electronic device, such as an integrated circuit chip or a micro-machine, are disclosed. The packages may be stacked and electrically interconnected without soldering. The package includes a molded plastic body. St... | 12/23/2003 |
| 6662003 | Radio receiver in CMOS integrated circuit A single chip superhetrodyne AM receiver is disclosed herein. To compensate for process variations in the implementation of the IC, bias currents setting the operating conditions for various amplifiers and other components in the system are adjusted based... | 12/09/2003 |
| 6660559 | Method of making a chip carrier package using laser ablation A chip carrier package is made by using a laser-ablatable solder mask to cover areas of conductive traces on the surface of a substrate that were left uncovered during conventional processes using photoresist. These areas of the conductive traces are unco... | 12/09/2003 |
| 6658239 | Fully integrated ALL-CMOS AM transmitter with automatic antenna tuning A monolithic AM transmitter is disclosed. An external antenna forms part of a resonance network so that the antenna resonance point is automatically tuned to the transmit frequency. This provides flexibility with no added cost to the transmitter. Addition... | 12/02/2003 |
