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| Number | Title | Issue Date |
| 7563383 | CMP composition with a polymer additive for polishing noble metals The invention provides a method of polishing a substrate comprising contacting a substrate comprising a noble metal on a surface of the substrate with a chemical-mechanical polishing system comprising (a) a polishing component selected from the group consisting of a... | 07/21/2009 |
| 7557566 | Method and apparatus for measurement of magnetic permeability of a material A system for determining the magnetic permeability of a material is provided. Two electrical inductors formed as primary and secondary concentric coils share a common magnetic core space. An AC voltage applied to the primary coil creates a magnetic flux in the core ... | 07/07/2009 |
| 7311862 | Method for manufacturing microporous CMP materials having controlled pore size A method of manufacturing a chemical-mechanical polishing (CMP) pad comprises the steps of (a) forming a layer of a polymer resin liquid solution (i.e., a polymer resin dissolved in a solvent); (b) inducing a phase separation in the layer of polymer solution to prod... | 12/25/2007 |
| 7311856 | Polymeric inhibitors for enhanced planarization The invention provides a chemical-mechanical polishing system comprising a polishing component, a surfactant, and a liquid carrier. The invention further provides a method of chemically-mechanically polishing a substrate with the polishing system. ... | 12/25/2007 |
| 7306637 | Anionic abrasive particles treated with positively charged polyelectrolytes for CMP The invention provides chemical-mechanical polishing systems, and methods of polishing a substrate using the polishing systems, comprising (a) an abrasive, (b) a liquid carrier, and (c) a positively charged polyelectrolyte with a molecular weight of about 15,000 or ... | 12/11/2007 |
| 7288021 | Chemical-mechanical polishing of metals in an oxidized form The invention provides a method for polishing a substrate comprising a metal in an oxidized form, the method comprising the steps of: (a) providing a substrate comprising a metal in an oxidized form, (b) contacting a portion of the substrate with a chemical-mechanic... | 10/30/2007 |
| 7277314 | Mobile ion memory An improved high-density digital storage device uses placement of mobile ions within a memory layer to record digital data. In an embodiment of the invention, the mobile ions comprise sodium ions or other alkali metal ions implanted in a silicon oxide memory layer. ... | 10/02/2007 |
| 7274772 | X-ray source with nonparallel geometry An improved x-ray generation system produces a converging or diverging radiation pattern particularly suited for substantially cylindrical or spherical treatment devices. In an embodiment, the system comprises a closed or concave outer wall about a closed or concave... | 09/25/2007 |
| 7265055 | CMP of copper/ruthenium substrates The invention provides a method of chemically-mechanically polishing a substrate. A substrate comprising ruthenium and copper is contacted with a chemical-mechanical polishing system comprising a polishing component, hydrogen peroxide, an organic acid, at least one ... | 09/04/2007 |
| 7264641 | Polishing pad comprising biodegradable polymer The invention is directed to a polishing pad for use in chemical-mechanical polishing comprising a biodegradable polymer. The biodegradable polymer comprises a repeat unit selected from the group consisting of glycolic acid, lactic acid, hydroxyalkanoic acids, hydro... | 09/04/2007 |
| 7261616 | Magnetorheological polishing devices and methods A method of polishing an object is disclosed. In one embodiment, the method comprises the steps of creating a polishing zone within a magnetorheological fluid; determining the characteristics of the contact between the object and the polishing zone necessary to poli... | 08/28/2007 |
| 7255810 | Polishing system comprising a highly branched polymer The invention provides a polishing system and method of its use comprising (a) a liquid carrier, (b) a polymer having a degree of branching of about 50% or greater, and (c) a polishing pad, an abrasive, or a combination thereof. ... | 08/14/2007 |
| 7247567 | Method of polishing a tungsten-containing substrate The invention provides a method of chemically-mechanically polishing a substrate comprising tungsten through use of a composition comprising a tungsten etchant, an inhibitor of tungsten etching, and water, wherein the inhibitor of tungsten polishing is a polymer, co... | 07/24/2007 |
| 7238618 | System for the preferential removal of silicon oxide A system, composition, and a method for planarizing or polishing a composite substrate are provided. The planarizing or polishing system comprises (i) a polishing composition comprising (a) about 0.5 wt. % or more of fluoride 5 ions, (b) about 1 wt. % or more of an ... | 07/03/2007 |
| 7204742 | Polishing pad comprising hydrophobic region and endpoint detection port The invention provides a chemical-mechanical polishing pad comprising a polishing layer comprising a hydrophobic region, a hydrophilic region, and an endpoint detection port. The hydrophobic region is substantially adjacent to the endpoint detection port. The hydrop... | 04/17/2007 |
| 7198549 | Continuous contour polishing of a multi-material surface A chemical-mechanical polishing pad, and method of polishing a substrate using a polishing pad, comprising (a) a resilient subpad, and (b) a polymeric polishing film substantially coextensive with the resilient subpad, wherein the polymeric polishing film comprises ... | 04/03/2007 |
| 7196337 | Particle processing apparatus and methods This invention relates to an apparatus for processing particles. The apparatus comprises a particle source having an exist aperture; an extraction electrode located at the exist aperture; an acceleration electrode adjacent to the extraction electrode; a processing c... | 03/27/2007 |
| 7195544 | CMP porous pad with component-filled pores The invention provides a polishing pad comprising a polymeric material having pores and a component that is disposed within the pores, as well as a method of polishing a workpiece with the aforesaid polishing pad, and a method for producing the aforesaid polishing p... | 03/27/2007 |
| 7161247 | Polishing composition for noble metals The invention provides a polishing composition and a method of chemically-mechanically polishing a substrate comprising a noble metal, the polishing composition comprising (a) an oxidizing agent that oxidizes a noble metal, (b) an anion selected from the group consi... | 01/09/2007 |
| 7160807 | CMP of noble metals The invention provides a method of polishing a substrate comprising (i) contacting a substrate comprising a noble metal layer with a chemical-mechanical polishing system comprising (a) a polishing component, (b) an oxidizing agent, and (c) a liquid carrier, and (ii)... | 01/09/2007 |
