Celebrity Inventors
Actor Marlon Brando has four patents, all named "Drumhead tensioning device and method."
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| Number | Title | Issue Date |
| 8162060 | Gas-lift valve and method of use A gas-lift valve comprising an elongated vertically orientated tubular body with inlet ports positioned for communication with the inlet ports of a gas-lift valve mandrel, a valve seat and valve port at the upper end of the valve body, a movable gas charged dome pos... | 04/24/2012 |
| 8137440 | Dryer having structure for enhanced drying and method of use A dryer and a drying apparatus attachable to a dryer are disclosed. A wheel having desiccant material is located in line and in close proximity with a heating element. The wheel includes a first portion positioned in an inlet air path and a second portion positioned... | 03/20/2012 |
| D654191 | Flexible landscape edging | 02/14/2012 |
| D649268 | Flexible landscape edging | 11/22/2011 |
| 7894438 | Device and method for communicating with a legacy device, network or application A translation device allows communication between two entities that are not compatible. The two entities can include a legacy entity that uses an address format not compatible with a newer entity. The translation device receives a packet for the legacy entity and co... | 02/22/2011 |
| 7785398 | Dryer and drying apparatus with enhanced moisture removal A dryer and a drying apparatus attachable to a dryer are disclosed. A wheel having desiccant material is located in line and in close proximity with a heating element. The wheel includes a first portion positioned in an inlet air path and a second portion positioned... | 08/31/2010 |
| 7554658 | Cuvette and cuvette cap The invention provides a cuvette apparatus having two cavities that are in fluid communication with each other. The first cavity is larger than the second cavity an receives a fluid to be studied. The second cavity holds the fluid for analysis and is bounded by at l... | 06/30/2009 |
| 7417299 | Direct connection multi-chip semiconductor element structure A direct connection multi-chip semiconductor element structure is proposed. A plurality of semiconductor chips are mounted and supported on a metal heat sink, such that heat generated by the chips during operation can be dissipated via the heat sink. A circuit struc... | 08/26/2008 |
| 7396700 | Method for fabricating thermally enhanced semiconductor device A method for fabricating a thermally enhanced semiconductor device. A support plate having at least one opening is mounted on a heat sink. At least one chip is mounted on the heat sink and received in the opening. An insulating layer is formed over the chip and the ... | 07/08/2008 |
| 7365272 | Circuit board with identifiable information and method for fabricating the same A circuit board with identifiable information and a method for fabricating the same are proposed. At least one insulating layer within the circuit board has a non-circuit area free of a circuit layout. A plurality of openings are formed in the non-circuit area of th... | 04/29/2008 |
| 7341934 | Method for fabricating conductive bump of circuit board A method for fabricating conductive bumps of a circuit board is proposed. First of all, a circuit board having a first surface and a corresponding second surface is provided. A circuit structure having a plurality of conductive pads is formed on each of the first su... | 03/11/2008 |
| 7340829 | Method for fabricating electrical connection structure of circuit board A method for fabricating an electrical connection structure of a circuit board is proposed. The circuit board is provided with a plurality of pads on a surface thereof and with a plurality of conductive structures therein for electrically connecting the pad. A plura... | 03/11/2008 |
| 7323762 | Semiconductor package substrate with embedded resistors and method for fabricating the same A semiconductor package substrate with embedded resistors and a method for fabricating the same are proposed. Firstly, an inner circuit board having a first circuit layer thereon is provided, and a plurality of resistor electrodes are formed in the fist circuit laye... | 01/29/2008 |
| 7274099 | Method of embedding semiconductor chip in support plate A method of embedding a semiconductor chip in a support plate and an embedded structure thereof are proposed. A first dielectric layer having a reinforced filling material is provided, and a semiconductor chip is mounted on the first dielectric layer. A support plat... | 09/25/2007 |
| 7216424 | Method for fabricating electrical connections of circuit board A method for fabricating electrical connections of a circuit board is provided. The circuit board has a plurality of electrical connection pads thereon. A protective layer is applied on the circuit board and has a plurality of openings for exposing the electrical co... | 05/15/2007 |
| 7174630 | Method for fabricating connection terminal of circuit board A method for fabricating connection terminals of a circuit board is proposed. The method involves providing a circuit board with connection pads thereon, forming an insulating layer with first openings over the circuit board to expose the connection pads, forming a ... | 02/13/2007 |
| 7174631 | Method of fabricating electrical connection terminal of embedded chip An electrical connection terminal of an embedded chip and a method for fabricating the same are disclosed. An insulating layer is provided on a circuit board integrated with a chip and has a plurality of first openings for exposing a conductive pad of the chip. A fi... | 02/13/2007 |
| 7135377 | Semiconductor package substrate with embedded resistors and method for fabricating same A semiconductor package substrate with embedded resistors and a method for fabricating the same are proposed. Firstly, an inner circuit board having a first circuit layer thereon is provided, and a plurality of resistor electrodes are formed in the fist circuit laye... | 11/14/2006 |
| 7129117 | Method of embedding semiconductor chip in support plate and embedded structure thereof A method of embedding a semiconductor chip in a support plate and an embedded structure thereof are proposed. A first dielectric layer having a reinforced filling material is provided, and a semiconductor chip is mounted on the first dielectric layer. A support plat... | 10/31/2006 |
| 7122407 | Method for fabricating window ball grid array semiconductor package A method for fabricating a window ball grid array (WBGA) semiconductor package is provided. A substrate is prepared having a through opening and ball pads on a lower surface thereof. A chip is mounted over the opening of the substrate via an adhesive, with gaps not ... | 10/17/2006 |
| 7089660 | Method of fabricating a circuit board A circuit board with an asymmetrical structure and a method for fabricating the same are proposed. A core circuit board is provided, with a build-up structure being formed on a side of the core circuit board, and a laminated structure being formed on an opposite sid... | 08/15/2006 |
| 7041591 | Method for fabricating semiconductor package substrate with plated metal layer over conductive pad A method for fabricating a semiconductor package substrate having a plated metal layer on a conductive pad is proposed. First of all, a first resist layer is formed on a semiconductor package substrate having a plurality of traces and conductive pads on a surface th... | 05/09/2006 |
| 7033862 | Method of embedding semiconductor element in carrier and embedded structure thereof A method of embedding a semiconductor element in a carrier and an embedded structure thereof are proposed. First, a carrier having a hole is provided and an auxiliary material is attached to a side of the carrier. A semiconductor element is placed in the hole of the... | 04/25/2006 |
| 7012019 | Circuit barrier structure of semiconductor packaging substrate and method for fabricating the same A circuit barrier structure of a semiconductor packaging substrate and a method for fabricating the same, forming a metal conductive layer on an insulating layer of the substrate and a patterned resist layer on the metal conductive layer. The patterned resist layer ... | 03/14/2006 |
| D511164 | Wireless mouse | 11/01/2005 |
