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Attorney: Nguyen; Tue


Number of patents: 39
Last date: May 22, 2012

NumberTitleIssue Date
8183802Composite electromechanical machines with controller
Embodiments of the present invention include a composite electromechanical machine which can operate as a motor, a generator (including dynamo or alternator), or any combination thereof. In an aspect, the present composite electromechanical machine comprises at leas...
05/22/2012
8182198Redundantable robot assembly for workpiece transfer
A redundantable robotic mechanism is disclosed for improving reliability of tranport equipment. The redundantable robot assembly typically comprises independent robots with separate controls, motors, linkage arms, or power, thus providing the capability of operation...
05/22/2012
8156313Chained operation of functional units in integrated circuit by writing DONE/complete value and by reading as GO/start value from same memory location
In an embodiment, the present invention discloses a flexible and reconfigurable architecture with efficient memory data management, together with efficient data transfer and relieving data transfer congestion in an integrated circuit. In an embodiment, the output of...
04/10/2012
8153517Processes and structures for IC fabrication
The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete com...
04/10/2012
8124452Processes and structures for IC fabrication
The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete com...
02/28/2012
8103855Linking functional blocks for sequential operation by DONE and GO components of respective blocks pointing to same memory location to store completion indicator read as start indicator
The present disclosure provides a methodology for reducing congestion of a processing unit, preferably by configuring a plurality of functional blocks to run in parallel or in series without the influence or input from the processing unit. In an embodiment, the pres...
01/24/2012
8070410Scalable stocker with automatic handling buffer
Scalable storage can be achieved with linear array storage of wafers, comprising two linear arrays of storage compartments on opposite walls, with a middle transfer mechanism. Together with a buffer station for automatic material handling system, a scalable bare waf...
12/06/2011
8031217Processes and structures for IC fabrication
The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete com...
10/04/2011
8020290Processes for IC fabrication
The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete com...
09/20/2011
7976263Integrated wafer transfer mechanism
An integrated high speed robotic mechanism is disclosed for improving transport equipment, integrating an object movement with other functionalities such as alignment or identification. The disclosed integrated robot assembly typically comprises an end effector for ...
07/12/2011
7969364Radio frequency device and method of manufacture
A radio frequency device comprises a radio frequency transponder having a radio frequency circuit and a radio frequency antenna, and a sensor conductively connected to the radio frequency antenna so that a measurement can be retrieved from the sensor by communicatin...
06/28/2011
7968248Liquid-liquid fuel cell systems having flow-through anodes and flow-by cathodes
The invention disclosed herein relates to fuel cell electrode pair assemblies, not having interposing proton exchange membranes, configured to receive and react with liquid anolyte and liquid catholyte microfluidic flowstreams. In one embodiment, the present inventi...
06/28/2011
7964964Method of packaging and interconnection of integrated circuits
A semiconductor chip packaging on a flexible substrate is disclosed. The chip and the flexible substrate are provided with corresponding raised and indented micron-scale contact pads with the indented contact pads partially filled with a liquid amalgam. After low te...
06/21/2011
7956504Composite electromechanical machines with gear mechanism
Embodiments of the present invention include a composite electromechanical machine which can operate as a motor or a generator (including dynamo or alternator). In an aspect, the present composite electromechanical machine consists of at least two rotating elements ...
06/07/2011
7926481Solar water vapor ejector
A water vapor ejector comprises a desiccant disposed in a communication path to a green house enclosure. In the day time and under sunlight exposure, the green house enclosure heats up, which dries the desiccant and generates a flow to the outside ambient through a ...
04/19/2011
7896602Workpiece stocker with circular configuration
An improved stocker configuration for storing workpieces in a fabrication facility is disclosed, employing workpiece compartments arranged stationarily around a robot handling assembly. The robot handler can be designed with three degrees of freedom, to improve spee...
03/01/2011
7870366Chained operation of functional components with DONE and GO registers storing memory address for writing and reading linking signal value
The present disclosure provides an architecture that enables massive parallel processing on an IC while alleviating control congestion, memory access congestion and wiring congestion, together with high flexibility where the processing units are soft-arranged to per...
01/11/2011
7863762Method of packaging and interconnection of integrated circuits
A method is disclosed for packaging semiconductor chips on a flexible substrate employing thin film transfer. The semiconductor chips are placed on a temporary adhesive substrate, then covered by a permanent flexible substrate with a casting layer for planarizingly ...
01/04/2011
7822897System and methods for connecting multiple functional components
The present invention relates to a flexible and reconfigurable bus fabric for microelectronic processing units, which can offer efficient memory data management, together with efficient data transfer and relieving data transfer congestion in an integrated circuit. I...
10/26/2010
7751919Method for operating equipment using buffer station having emergency access
A buffer station provides potential improvement for the operation of a facility. By storing to-be-accessed workpieces in the buffer stations of an equipment, the operation of the facility is not interrupted when the equipment is down. The workpieces can be retrieved...
07/06/2010
7618844Method of packaging and interconnection of integrated circuits
A semiconductor chip packaging on a flexible substrate is disclosed. The chip and the flexible substrate are provided with corresponding raised and indented micron-scale contact pads with the indented contact pads partially filled with a liquid amalgam. After low te...
11/17/2009
7602164Adaptive DC to DC converter system
The present invention discloses an integrated voltage regulator comprising a switching regulation and an additional regulation mechanism. The additional regulation mechanism permits better control of the voltage regulator to enable improved performance. The present ...
10/13/2009
7557552Adaptive DC to DC converter system using a combination of duty cycle and slew rate modulations
The present invention discloses an integrated voltage regulator comprising a switching regulation and an additional regulation mechanism. The additional regulation mechanism permits better control of the voltage regulator to enable improved performance. The present ...
07/07/2009
7501804Adaptive DC to DC converter system
The present invention discloses an integrated voltage regulator comprising a switching regulation and an additional regulation mechanism. The additional regulation mechanism permits better control of the voltage regulator to enable improved performance. The present ...
03/10/2009
7335551Method to fabricate a thin film non volatile memory device scalable to small sizes
A thin film non volatile memory scalable to small sizes and its fabrication process are disclosed. The thin film memory comprises a thin film transistor control circuitry fabricated on a flexible substrate, together with an optoelectronic cross bar memory comprising...
02/26/2008
7334737Thin film non volatile memory device scalable to small sizes
A thin film non volatile memory scalable to small sizes and its fabrication process are disclosed. The thin film memory includes a thin film transistor control circuitry fabricated on a flexible substrate, together with an optoelectronic cross bar memory employing a...
02/26/2008
7300824Method of packaging and interconnection of integrated circuits
A method is disclosed for packaging semiconductor chips on a flexible substrate employing thin film transfer. The semiconductor chips are placed on a temporary adhesive substrate, then covered by a permanent flexible substrate with a casting layer for planarizingly ...
11/27/2007
7228645Multi-zone shower head for drying single semiconductor substrate
A shower head processes a wafer with a plate having a plurality of nozzles positioned thereon, each of the nozzles assigned to one of a plurality of processing zones for the wafer; and a manifold assembly coupled to each of the nozzles to control one or more of the ...
06/12/2007
7141348Lamination and delamination technique for thin film processing
This invention discloses a releasable adhesion layer having good adhesion during high temperature fabrication process in the absence of light, and delaminating at a lower temperature in the presence of light. One embodiment of this invention is a film of polymer who...
11/28/2006
6946178Lamination and delamination technique for thin film processing
This invention discloses a releasable adhesion layer having good adhesion during high temperature fabrication process in the absence of light, and delaminating at a lower temperature in the presence of light. One embodiment of this invention is a film of polymer who...
09/20/2005
6777331Multilayered copper structure for improving adhesion property
A multilayered copper structure has been provided for improving the adhesion of copper to a diffusion barrier material, such as TiN, in an integrated circuit substrate. The multilayered copper structure comprises a thin high-resistive copper layer to provide improve...
08/17/2004
6705816Wafer transport mechanism
A wafer transfer apparatus provides a rotational and translational motions using only one stationary motor drive. The apparatus includes a drive assembly and a transport arm assembly. The transport arm assembly includes a transport arm rotatably attached to a linkin...
03/16/2004
6689220Plasma enhanced pulsed layer deposition
A process system and a deposition method for depositing a highly controlled layered film on a workpiece is disclosed. The basic component of the present invention apparatus is a pulsing plasma source capable of either exciting or not-exciting a first prec...
02/10/2004
6670266Multilayered diffusion barrier structure for improving adhesion property
A method has been provided for improving the adhesion of copper to a nitrided metal diffusion barrier material, such as TiN, in an integrated circuit substrate. The method provided a multilayered diffusion barrier structure, comprising a conducting diffus...
12/30/2003
6641672Replaceable shielding apparatus
A replaceable shielding apparatus provides a cost effective way of shielding a portion of a workpiece during processing. The apparatus includes a replaceable shield, made of comparable weight as the workpiece for allowing replacement of the shield in the ...
11/04/2003
6610169Semiconductor processing system and method
Systems and methods are disclosed to perform semiconductor processing with a process chamber; a flash lamp adapted to be repetitively triggered; and a controller coupled to the control input of the flash lamp to trigger the flash lamp. The system can depl...
08/26/2003
6609632Removable lid and floating pivot
A semiconductor processing system includes a chamber adapted to process a wafer, the chamber having an opening to facilitate access to the interior of the chamber. The system has a lid coupled to the chamber opening, the lid having an open position and a ...
08/26/2003
6572706Integrated precursor delivery system
An integrated precursor delivery system which integrates a precursor delivery system with a processing chamber is provided for improving the precursor delivery lines to the processing chamber, and for keeping the delivery lines intact during servicing the...
06/03/2003
6565661High flow conductance and high thermal conductance showerhead system and method
A vapor supply apparatus, for use in a semiconductor device manufacturing process, provides high flow conductance and high thermal conductance showerhead plate for supplying various precursors to a reaction chamber. The high flow conductance and high ther...
05/20/2003
 
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