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| Number | Title | Issue Date |
| 5486272 | Electroplating method and apparatus A method of removing metal from a feedstock solution containing dissolved metal ions which comprises passing the feedstock through an annular gap, the inner surface of which is cathodic to the metal ion and the outer surface of which is anodic in such a w... | 01/23/1996 |
| 5192461 | Aqueous degreasing solution having high free alkalinity A low solids, solvent free liquid aqueous degreasing concentrate composition having high free alkalinity which includes from about 20% to about 40% by weight of an alkali builder constituent; from about 15% to about 25% by weight of a wetting agent mixtur... | 03/09/1993 |
| 5178690 | Process for sealing chromate conversion coatings on electrodeposited zinc A process for forming improved chromate conversion coatings on zinc surfaces by treating the zinc surface with an aqueous acidic chromating solution which contains hexavalent chromium and a soluble inorganic salt which has an cation which will form an ins... | 01/12/1993 |
| 5169514 | Plating compositions and processes A gold or gold alloy plating composition comprises: a source of gold ions such as potassium gold (I) cyanide; optionally a source of alloying metal (e.g. nickel or cobalt) ions, for example as a sulphate; optionally a complexing agent for the alloying met... | 12/08/1992 |
| 5165971 | Activating composition for plating of electrically insulative substrates and method for plating of such substrates using said composition The invention relates to an activating composition for the electroless plating of non-conductive surfaces, in particular electronic printed circuit boards. The composition contains a metal complex in which the ligand consists of a quaternary nitrogen comp... | 11/24/1992 |
| 5049286 | Process for purification of nickel plating baths An improved process for purifying a nickel plating bath including a pyridine composition as an additive and which bath contains a breakdown product of the pyridine composition. The process has the following steps: a. adjusting the pH of the nickel plating bath... | 09/17/1991 |
| 4983262 | Conversion composition and process The production of uniformly blackened nickel deposits for decorative or functional purposes can be achieved by depositing nickel from an electroless nickel plate composition or electrolytically followed by forming a conversion coating on the electroless n... | 01/08/1991 |
| 4964920 | Method of removing deposits of tin, lead or tin/lead alloys from copper substrates and compositions for use therein A composition for removing a layer of tin, lead or tin/lead alloy from a copper substrate such as a printed circuit board comprises an aqueous solution of nitric acid and ferric acid and also contains anthranilic acid to inhibit the degree of attack on th... | 10/23/1990 |
| 4933051 | Cyanide-free copper plating process A process for electroplating copper from an aqueous alkaline non-cyanide bath has improved resistance to degradation. At least a portion of the plating bath is subjected to electrolysis by an insoluble anode to which the current is controlled independentl... | 06/12/1990 |
| 4898652 | Polyoxalkylated polyhydroxy compounds as additives in zinc alloy electrolytes An improved aqueous acidic electrolyte suitable for electrodepositing zinc alloys comprising a combination of zinc and at least one metal selected from the group consisting of nickel, cobalt, iron, and mixtures thereof incorporating an effective amount of... | 02/06/1990 |
| 4873122 | Treating laminates with a wetting/reducing solution after desmearing with permanganate An aqueous composition is provided for treating a laminate in the manufacture of a printed circuit board, the composition comprising a wetting agent, which has a positively charged quaternary nitrogen atom, and a reducing agent which is compatible with th... | 10/10/1989 |
| 4814205 | Process for rejuvenation electroless nickel solution An aqueous initiator solution and process for rejuvenating such initiator solutions and for prolonging the useful operating life thereof by which copper and copper alloy substrates are treated therein to render them receptive to a subsequent electroless n... | 03/21/1989 |
| 4776898 | Passivation A method of passivating a zinc-cobalt alloy, which alloy has a cobalt content of 0.1-2%, by contacting the alloy with an aqueous composition which has a pH of 0.5-2.5 and contains hexavalent chromium, hydrogen ions to provide the pH, chloride ions and sul... | 10/11/1988 |
| 4773983 | Electrolytic apparatus and process An improved electrolytic apparatus and process particularly applicable for high-speed electrodeposition of a metallic plating on a substrate such as on a printed wiring board of the type employed in the electronic industry. The apparatus employs a manifol... | 09/27/1988 |
| 4772362 | Zinc alloy electrolyte and process An improved aqueous acidic electrolyte suitable for electrodepositing zinc alloys comprising a combination of zinc and at least one metal selected from the group consisting of nickel, cobalt, iron, and mixtures thereof incorporating an effective amount of... | 09/20/1988 |
| 4717458 | Zinc and zinc alloy electrolyte and process An aqueous bath suitable for electrodepositing zinc and alloys of zinc including zinc-nickel, zinc-cobalt, zinc-nickel-cobalt, zinc-iron, zinc-iron-nickel, zinc-iron-cobalt, and zinc-nickel-cobalt-iron containing a brightening amount of an AABB-type polya... | 01/05/1988 |
| 4715935 | Palladium and palladium alloy plating The difficulties associated with electroplating palladium metal or alloy deposits from palladium diammino dichloride, palladium diamino dinitrite and palladium triammino sulphite baths can be avoided by plating from palladium baths containing oxalate. The... | 12/29/1987 |
| 4699696 | Zinc-nickel alloy electrolyte and process An aqueous acidic electrolyte of the chloride, sulfate and mixed chloride-sulfate types suitable for electrodepositing a zinc-nickel alloy on a conductive substrate comprising an aqueous solution containing zinc ions and nickel ions, and an additive agent... | 10/13/1987 |
| 4687554 | Electrolytic apparatus and process An improved electrolytic apparatus and process particularly applicable for high-speed electrodeposition of a metallic plating on a substrate such as on a printed wiring board of the type employed in the electronic industry. The apparatus employs a manifol... | 08/18/1987 |
| 4617205 | Formaldehyde-free autocatalytic electroless copper plating Copper may be deposited non-electrolytically from a composition comprising copper ions, a complexor to keep the copper ions in solution, and glyoxylate ions as a reducing agent. The use of formaldehyde is therefore avoided.... | 10/14/1986 |
| 4617095 | Electrolytic post treatment of chromium substrates An improved process and aqueous electrolyte for imparting improved corrosion resistance to chromium substrates, and particularly nickel-plated substrates having a chromium plating thereover deposited from a trivalent chromium electrolyte. The post-treatin... | 10/14/1986 |
| 4615774 | Gold alloy plating bath and process A citrate-free electroplating bath for the high speed deposition of gold alloy plates on substrates comprises a source of gold (for example gold (I) potassium cyanide), a source of alloying metal (for example, nickel sulfate), oxalic acid and formic acid.... | 10/07/1986 |
| 4597838 | Additive agent for zinc alloy electrolyte and process An improved aqueous acidic electrolyte suitable for electrodepositing zinc alloys comprising a combination of zinc and at least one metal selected from the group consisting of nickel, cobalt, iron, and mixtures thereof incorporating an effective amount of... | 07/01/1986 |
| 4591416 | Chromate composition and process for treating zinc-nickel alloys The present invention includes an aqueous acidic chromate solution, suitable for forming colored chromate coatings on zinc-nickel alloy electrodeposits containing up to about 15% by weight nickel, which solutions have a pH within the range of about 1.3 to... | 05/27/1986 |
| 4578122 | Non-peroxide trivalent chromium passivate composition and process An aqueous acidic peroxide-free solution and process for treating receptive metal surfaces to impart a chromium passivate film thereon containing chromium ions substantially all of which are present in the trivalent state, hydrogen ions to provide a pH of... | 03/25/1986 |
| 4555315 | High speed copper electroplating process and bath therefor An improved electrolyte composition and process for electrodepositing bright, level and ductile copper deposits on a substrate enabling use of conventional electroplating equipment for high-speed copper plating employing average cathode current densities ... | 11/26/1985 |
| 4549942 | Process for electrodepositing composite nickel layers An improved process for producing a composite nickel-containing electroplate on a substrate including an inner nickel-containing layer, of an average sulfur content of less than about 0.03 percent by weight, an intermediate nickel-containing layer of an a... | 10/29/1985 |
| 4545869 | Bath and process for high speed electroplating of palladium A palladium electroplating bath capable of plating highly ductile palladium metal. The bath comprises a palladium amine complex salt as a source of the palladium metal, ammonium sulfate, an ammonium halide, an alkali metal pyrophosphate, a stress reducing... | 10/08/1985 |
| 4543166 | Zinc-alloy electrolyte and process An aqueous acidic electrolyte and process for electrodepositing zinc alloys comprising zinc-nickel, zinc-cobalt and zinc-nickel-cobalt on a conductive substrate incorporating a brightener system including a ductilizing agent present in an amount sufficien... | 09/24/1985 |
| 4541906 | Zinc electroplating and baths therefore containing carrier brighteners An improved aqueous acidic zinc electrolyte and process for electrodepositing zinc on a conductive substrate in which the electrolyte contains a brightening amount of a bath soluble anionic sulfated polyoxyalkylene surfactant derived from the sulfation of... | 09/17/1985 |
| 4521282 | Cyanide-free copper electrolyte and process An improved aqueous cyanide-free electrolyte and process for depositing ductile, fine-grained adherent copper deposits on conductive substrates in which the electrolyte contains copper ions in an amount sufficient to electrodeposit copper, a complexing ag... | 06/04/1985 |
| 4515663 | Acid zinc and zinc alloy electroplating solution and process An aqueous acid electroplating solution and process for electrodepositing an adherent, ductile zinc, zinc-cobalt, zinc-nickel, zinc-cobalt-nickel alloy deposit on a conductive substrate which contains a comparatively low concentration of boric acid to inh... | 05/07/1985 |
| 4514267 | Zinc electroplating additive concentrate An aqueous concentrate adapted for dilution with water for use in the make-up and replenishment of zinc or zinc alloy electroplating baths of the chloride and the mixed chloride types comprising an aqueous solution containing zinc chloride in an amount of... | 04/30/1985 |
| 4493758 | Anode structure for a plating cell A plating cell for plating edge connector tabs of printed circuit boards comprises a pair of anode structures 119, each of which has a pair of elongate anodic platinized titanium plates 131 spaced apart by an anode divider 150. Castellations in the anode ... | 01/15/1985 |
| 4488942 | Zinc and zinc alloy electroplating bath and process An aqueous bath suitable for electrodepositing zinc and alloys of zinc including zinc-nickel, zinc-cobalt, zinc-nickel-cobalt, zinc-iron, zinc-iron-nickel, and zinc-iron-cobalt containing a brightening amount of an AB-type polyamide brightener in an amoun... | 12/18/1984 |
| 4487159 | Plating barrel A plating barrel is constructed of a perforated cylindrical side section clamped between a pair of end plates. The end plates are provided with positioning grooves that receive edge portions of the side section. Each end plate includes a plurality of conc... | 12/11/1984 |
| 4487665 | Electroplating bath and process for white palladium Particular electroplating baths suitable for obtaining white deposits of palladium metal. The bath comprises (a) palladosamine chloride; (b) an ammonium salt such as ammonium sulfate or ammonium chloride; (c) chloride ions; and (d) a brightener selected f... | 12/11/1984 |
| 4483739 | Compositions and method for stripping gold from copper substrates An improved composition for selectively stripping gold from a metal substrate, especially copper metal, wherein the gold deposit is rapidly and effectively stripped without an attendant attack on the metal substrate. A minor amount of an organo mercapto c... | 11/20/1984 |
| 4483711 | Aqueous electroless nickel plating bath and process An improved aqueous electroless nickel plating bath and process for chemically depositing nickel on a substrate comprising an aqueous solution containing nickel ions, hypophosphite ions, a complexing agent, preferably a buffering agent and a wetting agent... | 11/20/1984 |
| 4477318 | Trivalent chromium electrolyte and process employing metal ion reducing agents An aqueous acidic trivalent chromium electrolyte and process for electrodepositing chromium platings comprising an electrolyte containing trivalent chromium ions, a complexing agent, halide ions, ammonium ions and a reducing agent comprising a metal ion s... | 10/16/1984 |
