Did You Know...
...that when IBM conducted a market study of Chester Carlson's invention in 1959, the company concluded that it would take only 5000 units of his new product to saturate the market? IBM therefore declined to be part of the new product introduction. Too bad for IBM. Carlson's invention was the xerography process, and his new product was the beginning of the Xerox Corporation. It is estimated that every day, worldwide, 3,000,000,000 copies are made!!
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| Number | Title | Issue Date |
| 7114693 | Stable cell platform A stable platform supports a cell, the stable platform comprises a lower mainframe, an upper mainframe, and a dampener system. The upper mainframe includes a plurality of recesses. Each recess is configured to receive a cell. The dampener system connects the lower m... | 10/03/2006 |
| 7101253 | Load cup for chemical mechanical polishing A load cup for transferring a substrate in a chemical mechanical polishing system is provided. In one embodiment, a load cup for transferring substrates in a chemical mechanical polishing system includes a substrate support having a first side adapted to support a s... | 09/05/2006 |
| 7074708 | Method of decreasing the k value in sioc layer deposited by chemical vapor deposition A method for processing a substrate including depositing a dielectric layer containing silicon, oxygen, and carbon on the substrate by chemical vapor deposition, wherein the dielectric layer has a carbon content of at least 1% by atomic weight and a dielectric const... | 07/11/2006 |
| 7070480 | Method and apparatus for polishing substrates Method and apparatus for polishing substrates. A chemical mechanical polishing article comprises a body and a patterned surface. The patterned surface comprises a plurality of slurry distribution grooves and a plurality of islands on the body. Each of the plurality ... | 07/04/2006 |
| 7060330 | Method for forming ultra low k films using electron beam The present invention generally provides a method for depositing a low dielectric constant film using an e-beam treatment. In one aspect, the method includes delivering a gas mixture comprising one or more organosilicon compounds and one or more hydrocarbon compound... | 06/13/2006 |
| 7041599 | High through-put Cu CMP with significantly reduced erosion and dishing High through-put Cu CMP is achieved with reduced erosion and dishing by a multi-step polishing technique. Deposited Cu is polished with fixed abrasive polishing pads initially at a high removal rate and subsequently at a reduced removal rate and high Cu:barrier laye... | 05/09/2006 |
| 7040964 | Polishing media stabilizer A polishing apparatus that employs a polishing media retention arrangement to prevent slippage or wrinkles in the polishing media during polishing. The polishing media is drawn against a support surface by a vacuum applied between the polishing media and the support... | 05/09/2006 |
| 7039501 | Method for determining a position of a robot Generally, a method of determining a position of a robot is provided. In one embodiment, a method of determining a position of a robot comprises acquiring a first set of positional metrics, acquiring a second set of positional metrics and resolving the position of t... | 05/02/2006 |
| 7037174 | Methods for reducing delamination during chemical mechanical polishing Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a ... | 05/02/2006 |
| 7025658 | Platen and head rotation rates for monitoring chemical mechanical polishing Methods system and apparatus, including computer program products, for monitoring polishing a substrate. A polishing pad mounted on a platen, is rotated at a first rotation rate, and a carrier head is rotated at a second rotation rate that is different from the firs... | 04/11/2006 |
| 7008554 | Dual reduced agents for barrier removal in chemical mechanical polishing Compositions and methods for removal of barrier layer materials by a chemical mechanical polishing technique are provided. In one aspect, the invention provides a composition adapted for removing a barrier layer material in a chemical mechanical polishing technique ... | 03/07/2006 |
| 6991528 | Conductive polishing article for electrochemical mechanical polishing Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted t... | 01/31/2006 |
| 6988557 | Self sealing expandable inflatable packers The present invention generally relates to a sealing apparatus for isolating a wellbore. In one aspect, the present invention provides an expandable sealing apparatus having an expandable tubular and a sealing element disposed around the tubular. A chamber for maint... | 01/24/2006 |
| D513700 | Hangtag | 01/24/2006 |
| D513578 | Cutter tool | 01/17/2006 |
| 6984579 | Ultra low k plasma CVD nanotube/spin-on dielectrics with improved properties for advanced nanoelectronic device fabrication A method for forming a conductive feature in a low k dielectric layer comprising a layer of nanotubes and a low k material between the nanotubes is provided. The low k dielectric layer may be deposited on a seed layer as a blanket layer that is patterned such that a... | 01/10/2006 |
| 6977036 | Method and apparatus for substrate polishing A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a conductive polishing pad and an electrode having a membrane disposed therebetween. The membrane is orientated relative the conduct... | 12/20/2005 |
| 6974719 | Method for manufacturing an optical module and optical module The invention relates to an optical module and to method for manufacturing an optical module comprising the steps of: providing a groove in a substrate for positioning an optical component, providing the optical component, bonding the optical component to the groove... | 12/13/2005 |
| 6974766 | In situ deposition of a low κ dielectric layer, barrier layer, etch stop, and anti-reflective coating for damascene application The present invention provides a SiC material, formed according to certain process regimes, useful as a barrier layer, etch stop, and/or an ARC, in multiple levels, including the pre-metal dielectric (PMD) level, in IC applications and provides a dielectric layer de... | 12/13/2005 |
| 6967072 | Photolithography scheme using a silicon containing resist A method for forming a patterned amorphous carbon layer in a semiconductor stack, including forming an amorphous carbon layer on a substrate and forming a silicon containing photoresist layer on top of the amorphous carbon layer. Thereafter, the method includes deve... | 11/22/2005 |
| 6962524 | Conductive polishing article for electrochemical mechanical polishing Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupl... | 11/08/2005 |
| 6960521 | Method and apparatus for polishing metal and dielectric substrates Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a ... | 11/01/2005 |
| 6961663 | Borehole compensation system and method for a resistivity logging tool System and method for borehole compensation. The method includes simultaneously transmitting at least two modulated signals from one or more transmitters; receiving the at least two modulated signals by at least one receiver; and processing the received at least two... | 11/01/2005 |
| 6958098 | Semiconductor wafer support lift-pin assembly A modular lift-pin assembly includes a lift-pin having a distal end, a connector, and an actuator pin. The connector includes an actuator end having a plurality of catch fingers disposed around the actuator end. Each of the plurality of catch fingers includes a lip ... | 10/25/2005 |
| 6955085 | Optical accelerometer or displacement device using a flexure system Disclosed herein is an accelerometer and/or displacement device that uses a mass coupled to a rhomboidal flexure to provide compression to an optical sensing element preferably having a fiber Bragg grating (FBG). The transducer includes a precompressed optical senso... | 10/18/2005 |
| 6951599 | Electropolishing of metallic interconnects Embodiments of the present invention generally relate to a method and apparatus for planarizing a substrate by electropolishing techniques. Certain embodiments of an electropolishing apparatus include a contact ring adapted to support a substrate, a cell body adapte... | 10/04/2005 |
| 6951511 | Platen with peripheral frame for supporting a web of polishing material in a chemical mechanical planarization system Generally, a method and apparatus for supporting a web of polishing material. In one embodiment, the apparatus includes a platen adapted to support the web, a frame assembly, and one or more flexures coupled between the platen and the frame assembly. The flexure all... | 10/04/2005 |
| D510374 | Camera housing with camera | 10/04/2005 |
| 6951826 | Silicon carbide deposition for use as a low dielectric constant anti-reflective coating The present invention generally provides a process for depositing silicon carbide using a silane-based material with certain process parameters that is useful for forming a suitable ARC for IC applications. Under certain process parameters, a fixed thickness of the ... | 10/04/2005 |
| 6950575 | Optical module and a method for manufacturing an optical module The invention is a method for manufacturing an optical module where on forms a groove in a substrate for positioning a component such as an optical component. The optical component is provided to be bonded into the groove by a aluminum oxide bonding process. To prep... | 09/27/2005 |
| 6946401 | Plasma treatment for copper oxide reduction The present invention provides an in situ plasma reducing process to reduce oxides or other contaminants, using a compound of nitrogen and hydrogen, typically ammonia, at relatively low temperatures prior to depositing a subsequent layer thereon. The adhesion charac... | 09/20/2005 |
| 6946033 | Heated gas distribution plate for a processing chamber An apparatus for distributing gas in a processing system. In one embodiment, the system includes a gas distribution assembly having a gas distribution plate. The gas distribution plate defines a plurality of holes through which gases are transmitted. The assembly fu... | 09/20/2005 |
| 6943127 | CVD plasma assisted lower dielectric constant SICOH film A low dielectric constant film having silicon-carbon bonds and dielectric constant of about 3.0 or less, preferably about 2.5 or less, is provided. The low dielectric constant film is deposited by reacting a cyclic organosilicon compound and an aliphatic organosilic... | 09/13/2005 |
| 6938697 | Apparatus and methods for tubular makeup interlock Apparatus and methods are provided to prevent an operator from inadvertently dropping a string into a wellbore during assembling and disassembling of tubulars. Additionally, the apparatus and methods can be used to for running in casing, running in wellbore componen... | 09/06/2005 |
| 6939210 | Slurry delivery arm A polishing fluid delivery apparatus has been provided that in one embodiment includes a support member, a dispense arm, a polishing fluid delivery tube and a variable restricting device. The dispense arm extends from an upper portion of the support member and has a... | 09/06/2005 |
| 6936551 | Methods and apparatus for E-beam treatment used to fabricate integrated circuit devices One embodiment of the present invention is a method for fabricating a low-k dielectric film that includes steps of: (a) chemical vapor depositing a lower-k dielectric film; and (b) e-beam treating the lower-k dielectric film. ... | 08/30/2005 |
| 6936309 | Hardness improvement of silicon carboxy films A method for depositing a low dielectric constant film having an improved hardness and elastic modulus is provided. In one aspect, the method comprises depositing a low dielectric constant film having silicon, carbon, and hydrogen, and then treating the deposited fi... | 08/30/2005 |
| 6935429 | Flash welding process for field joining of tubulars for expandable applications The present invention generally relates to methods of connecting two expandable tubulars. In one aspect, the method includes flash welding the ends of the expandable tubulars together. Thereafter, the connected tubulars are lowered into the wellbore for expansion. T... | 08/30/2005 |
| 6933508 | Method of surface texturizing A method and system for providing a texture to a surface of a workpiece is provided. The method comprises providing a workpiece to a texturizing chamber and scanning a beam of electromagnetic energy across the surface of the workpiece to form a plurality of features... | 08/23/2005 |
| 6932092 | Method for cleaning plasma enhanced chemical vapor deposition chamber using very high frequency energy A method for cleaning a plasma enhanced chemical vapor deposition chamber. The method includes introducing a cleaning gas into the plasma enhanced chemical vapor deposition chamber, forming a plasma using a very high frequency (VHF) power having a frequency in a ran... | 08/23/2005 |
