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Attorney: Morrison Foerster LLP


Number of patents: 12
Last date: October 07, 2008

NumberTitleIssue Date
7432097Phytases, nucleic acids encoding them and methods of making and using them
In one aspect, the invention provides a purified and modified phytase enzyme from Escherichia coli K12 appA phytase. The enzyme has phytase activity and improved thermal tolerance as compared with the wild-type enzyme. In addition, the enzyme has improved pro...
10/07/2008
7425172Customized polish pads for chemical mechanical planarization
A polishing pad for chemical mechanical planarization of a film on a substrate is customized by obtaining one or more characteristics of a structure on a substrate. For example, when the structure is a chip formed on a semiconductor wafer, the one or more characteri...
09/16/2008
7393994Transgenic mouse model for neurodegenerative diseases
Alzheimer's disease, Parkinson's disease and Lewy body disease are the most commonly found neurodegenerative disorders in the elderly. The invention is a transgenic mouse that contains two transgenes, human α-synuclein and human amyloid precursor protein, which are...
07/01/2008
7372651Introducing a noise signal into a read-back signal when data is written to a removable data storage medium
In one exemplary embodiment, a noise signal is introduced into a read-back signal when data is written to a removable data storage medium. While writing the data to the removable data storage medium, a portion of the data written to the removable data storage medium...
05/13/2008
7280229Examining a structure formed on a semiconductor wafer using machine learning systems
A structure formed on a semiconductor wafer is examined by obtaining a first diffraction signal measured from the structure using an optical metrology device. A first profile is obtained from a first machine learning system using the first diffraction signal obtaine...
10/09/2007
7169639Semiconductor device manufacturing method
The invention relates to a semiconductor device manufacturing method which can provide high reliability in electric connection between an electrode of a semiconductor chip and a substrate. Sealing resin is coated in a region of a substrate where a first electrode is...
01/30/2007
6653278Selenium-containing pro-drugs for cancer therapy
Methods for inhibiting the growth of tumor cells by combination treatment with a selenium-containing prodrug and an enzyme for which it is a substrate are described. The treatment also enhances the effect of anti-tumor agents....
11/25/2003
6636843System and method for grating profile classification
Grating profile data is classified using a cluster generator to generate a plurality of clusters of grating profile data points from a data space containing grating profile data points. The cluster generator associates profile shape data to each cluster, ...
10/21/2003
6481703Image forming apparatus with highly operable sheet discharge device
An image forming system includes a digital copy machine to form an image on a group of sheets from an image of a group of documents, and a staple sorter sorting and discharging copied sheets from the digital copy machine. According to the staple sorter, c...
11/19/2002
6307140Music apparatus with pitch shift of input voice dependently on timbre change
A music apparatus is constructed for receiving an input signal composed of either of a voice signal and a tone signal and for processing the input signal based on a timbre change command signal to generate at least one channel of an output signal. In the ...
10/23/2001
6046257Composition for prepreg comprising epoxy resin, polyamide block copolymer and curing agent
A composition is useful as a prepreg containing reinforcing fibers comprises an epoxy resin, a thermoplastic elastomer of a polyamide and/or polyester block copolymer, a curing agent such as dicyandiamide, and optionally a thermoplastic resin such as a po...
04/04/2000
6017610Conductive laminate
A conductive laminate comprising an inorganic or organic substrate and a conductive layer formed on at least a part of a surface of said substrate, the conductive layer having a surface resistance at 25° C., under 15% RH atmosphere of 106 -10
01/25/2000
 
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