Bizarre Patents
Combination Beverage Container and Spittoon
A combination beverage container and spittoon includes a bottom portion including outer wall and a first inner wall defining a spittoon space.
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| Number | Title | Issue Date |
| 6593644 | System of a package fabricated on a semiconductor or dielectric wafer with wiring on one face, vias extending through the wafer, and external connections on the opposing face A semiconductor or dielectric wafer with conducting vias is used as a substrate in an integrated circuit packaging structure, where high density inter and intra chip contacts and wiring are positioned on the substrate face on which the integrated circuitr... | 07/15/2003 |
| 6587151 | Video camera integration on a portable computer On a portable computer, a video camera is integrated as a feature by mounting the camera as an assembly made up of a lens and associated pixel electronics in a camera base that is positioned on the perphery of the display in the cover of the portable comp... | 07/01/2003 |
| 6573606 | Chip to wiring interface with single metal alloy layer applied to surface of copper interconnect In the invention an electrically isolated copper interconnect structural interface is provided involving a single, about 50-300 A thick, alloy capping layer, that controls diffusion and electromigration of the interconnection components and reduces the ov... | 06/03/2003 |
| 6518794 | AC drive cross point adjust method and apparatus The invention teaches a technique for A C equilibration of the signaling levels and time of 1-->h and h-->1 transitions of CMOS drivers as received at CMOS receivers, so as to improve the rate at which data can be communicated between two CMOS devices. It... | 02/11/2003 |
| 6496360 | Laptop portable computer desk A portable computer laptop desk is provided when attached to a structure that in turn is supported on web strapping that passes over the upper legs of the operator when in the seated position. The strapping is attached to foldable and telescopable side an... | 12/17/2002 |
| 6295128 | Optical alignment of superpositioned objects In alignment of superpositioned objects on opposing substrates accuracy and simplicity is achieved through relative movement of the substrates responsive to an image of one object reflected from the surface of the opposite substrate. Alignment of mating f... | 09/25/2001 |
| 6217185 | Efficient backlighting for a portable display Efficiency in light transfer between a light source and a viewing screen is attained in the invention by positioning a small diameter source of light at a position of highest light transfer intensity within an essentially semicircular reflector interfacin... | 04/17/2001 |
| 6207472 | Low temperature thin film transistor fabrication The invention broadens the range of materials and processes that are available for Thin Film Transistor (TFT) devices by providing in the device structure an organic semiconductor layer that is in contact with an inorganic mixed oxide gate insulator invol... | 03/27/2001 |
| 6192100 | X-ray mask pellicles and their attachment in semiconductor manufacturing In the invention a pellicle mounting structural principle is provided whereby a membrane for protection of an X-ray mask is interchangeably positioned with proper spacing between the X-ray mask and the resist on the wafer in which the pattern produced by ... | 02/20/2001 |
| 6180292 | Structure and manufacture of X-ray mask pellicle with washer-shaped member A precise thickness bulk etchable wafer material, that is responsive to protection with an oxide that inhibits insertion of an etch responsiveness altering material, is assembled with a membrane material that is susceptible to deposition processes. A bulk... | 01/30/2001 |
| 6180296 | Focused particle beam processing for use in electronic apparatus manufacturing A lithographically patterned three dimensional stencil type mask is formed on a substrate over a specific area that is to undergo processing. The three dimensional mask functionally provides an energy beam stencil at a precise height over the specific are... | 01/30/2001 |
| 6181554 | Portable computer riser for enhanced cooling Passive cooling of a portable personal computer is enhanced by providing a capability for raising one side of a computer with respect to another thus exposing the bottom surface of the computer base to the ambient air with the heat being dissipated provid... | 01/30/2001 |
| 6147730 | Color filters formed sequentially with intervening protective films for flat panel displays Three component color sub-pixel element areas of red,green and blue, are serially formed in an overall pixel area, on a transparent substrate, and after each individual color sub pixel element formation, a layer of protective transparent material is appli... | 11/14/2000 |
| 6109039 | Heat transfer in electronic apparatus An electronic apparatus heat extraction packaging feature wherein in the transfer of locally generated heat at a component of an electronic apparatus, the heat is stored in a buffering reservoir in the apparatus housing with a Peltier effect transfer cont... | 08/29/2000 |
| 6105852 | Etched glass solder bump transfer for flip chip integrated circuit devices A precise volume, precisely registerable carrier is provided for use with injection molding for producing integrated circuit bump contacts in the "flip chip" technology. A hemispherical cavity is produced by etching through and undercutting a registered o... | 08/22/2000 |
| 6097596 | Portable computer rotational heat pipe heat transfer Heat transfer through a heat pipe from a heat source on one side of a hinge to a heat dissipation capability on the other side of the hinge is achieved by providing a rotatable coupler with a thermal transfer body mounted on the side of the hinge away fro... | 08/01/2000 |
| 6078499 | Spring loaded heat pipe connector for hinged apparatus package An improved primary to secondary heat pipe thermal transfer connector for a hinged electronic apparatus package is achieved through the use of a thermal transfer block with a sleeve positioned on the hinge centerline of a hinged apparatus package and in a... | 06/20/2000 |
| 6029881 | Micro-scale part positioning by surface interlocking A principle of surface interlocking wherein the imperfections of two parallel surfaces deform and interlock under pressure. The surface interlocking enables the combination of a bridging element and a bonding tip of a diffusion bonding apparatus to pick u... | 02/29/2000 |
| 6009247 | Portable computer network A portable or notebook type computer communication interface that permits portable computers to be reliably used in a data processing network. The interface involves communication circuitry, special device inputs and power monitoring and charging. A flexi... | 12/28/1999 |
| 5987890 | Electronic component cooling using a heat transfer buffering capability Heat transfer out of a housing for a locallized source of heat such as that produced by a semiconductor chip of electronic apparatus is provided by a low thermal impedance heat transfer member such as a heat pipe, a thermal reservoir or heat transfer buff... | 11/23/1999 |
| 5991150 | Self deploying magnifier for a portable computer display screen The invention makes the size of the apparent image of the display screen of the display screen larger than the real size. A flat optical magnifier such as a lens of the fresnel type is positioned in an optically enhancing location between the operator and... | 11/23/1999 |
| 5948286 | Diffusion bonding of lead interconnections using precise laser-thermosonic energy Thin film diffusion bonding of lead assemblies under severly limited spacing, thermal and pressure conditions is achieved through application of precisely controlled energy at the bond interface. The precisely controlled energy is a laser thermosonic ener... | 09/07/1999 |
| 5847926 | Lightweight packaging The invention provides lightweight packaging of portable electronic apparatus by using the combined structural properties of an enclosure, that houses the interwired heat producing electronic signal devices of the apparatus, to provide coolant movement an... | 12/08/1998 |
| 5771559 | Removable heat sink assembly process for a chip package The process of the invention employs a post type fastening member that provides, at one end, an insertion friction connection to the circuit card and at the other end, extending through the heat sink, a compression spring means that urges the heat sink to... | 06/30/1998 |
| 5734196 | Electronic packaging shaped beam lead fabrication An electronic packaging interface between conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different ... | 03/31/1998 |
| 5689246 | Intraoral communication system An intraoral interactive communication system wherein through a mouthpiece tongue pressure coded electrical signals are delivered to a processor. The mouthpiece is constructed to conform to the shape of the roof of the mouth, and is positioned behind the ... | 11/18/1997 |
| 5688147 | Interchangeable key card edge connecting A system of using a rotatable key in the insertion of a conductor bearing card edge into a slotted supporting connector to accommodate a large number of different cards. A rotatable key opening in the slot face of the slotted supporting connector together... | 11/18/1997 |
| 5687078 | Fine pitch bonding In a bonding station, a tooling principle is provided wherein first and second tool parts respectively hold first and second apparatus parts, each apparatus part having fine conductor periodicity edge bonding regions, in superpositioned registration with ... | 11/11/1997 |
| 5675884 | Apparatus for multilayer conductor chip packaging Apparatus for shaping conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the ca... | 10/14/1997 |
| 5641114 | Controlled temperature bonding In a bonding station the parts of the apparatus to be bonded are retained at a thermal bias temperature at a permitted level and a thermal check valve interface is provided between the bonding location and the part of the station that would serve as a con... | 06/24/1997 |
| 5586005 | Removable heat sink assembly for a chip package The invention employs a post type fastening member that provides, at one end, an insertion friction connection to the circuit card and at the other end, extending through the heat sink, a compression spring means that urges the heat sink toward the circui... | 12/17/1996 |
| 5558523 | Pad on pad type contact interconnection technology for electronic apparatus A pad on pad type contact, and technology therefor, for electronic apparatus wherein a spring member, that by its shape and material in the motion when the contact comes together wipes the mating pad surfaces across each other and then retains them under ... | 09/24/1996 |
| 5559670 | Convertible display computer The invention is a convertible display computer structure in which the display is centrally pivoted in a frame that in turn is hinged on one side on the keyboard so that the display can be positioned to face toward the user when the frame is positioned to... | 09/24/1996 |
| 5536921 | System for applying microware energy in processing sheet like materials A microwave processing system is provided wherein the material to be processed is in the form of a web type quantity configuration with a thickness that is small in relation to the wavelength of a particular microwave frequency. The material is passed thr... | 07/16/1996 |
| 5537504 | Molded plastic optical fiber-optoelectronic converter subassembly An optical subassembly for transferring light between an optoelectronic converter and an optical fiber where the housing and the lens are of plastic in which the housing is made to dimensions within the precision of molded plastic and the lens imparts foc... | 07/16/1996 |
| 5511140 | Molded plastic optical fiber-optoelectronic converter subassembly An optical subassembly for transferring light between an optoelectronic converter and an optical fiber where the housing and the lens are of plastic in which the housing is made to dimensions within the precision of molded plastic and the lens imparts foc... | 04/23/1996 |
| 5480841 | Process of multilayer conductor chip packaging A process of providing an external wiring and connecting package for a semiconductor chip wherein the chip is a major contributor to the strength of the package. External contacts and wiring are provided by a multilayer wiring member that may include a me... | 01/02/1996 |
| 5461455 | Optical system for the projection of patterned light onto the surfaces of three dimensional objects An image projection system for all surfaces of a three dimensional object such as a polyhedron in which direct and angle reflected image patterns are projected from superpositioned non-overlapping mask patterns mounted on different levels where the separa... | 10/24/1995 |
| 5399902 | Semiconductor chip packaging structure including a ground plane A semiconductor chip package wherein the chip is a major contributor to the strength of the package. External contacts and wiring are provided by a multilayer wiring member that has a mesh ground plane with embedded power bus layer over a conductor layer ... | 03/21/1995 |
| 5337218 | Circuit card interconnecting structure An interconnecting structure in which circuit and componentry bearing cards are retained in contact with an intermediate card that has component and circuitry areas, and socket insertion contacts.... | 08/09/1994 |
