Millers; David T. - US Patent Attorneys and Agents

Attorney: Millers; David T.

Number of patents: 78
Last date: January 24, 2012

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Number	Title	Issue Date
8103870	Hive-based peer-to-peer network A collaborative data transferring process can combine segments from all known servers and peer-to-peer (P2P) sources simultaneously, regardless of their native protocols. The process uses variable data block size that can be dynamically selected according to sizes p...	01/24/2012
8100650	Cyclical wave energy converter Systems and methods use cyclical propellers with dynamic blade angle control to extract power from waves. A control system for such implementations can adapt pitching schedules for the blades of the cyclical propellers for efficient energy extraction and/or to contr...	01/24/2012
8068743	System and method for precise, accurate and stable optical timing information definition An optoelectronic timing system includes an adaptive frequency generator system in which optical pulses are developed by a semiconductor laser. The pulses are directed into a number of time-quantifiable optical paths. Time quantification for a pulse is based upon th...	11/29/2011
8021021	Authoring, recording, and replication of lighting Systems and methods permit use of efficient solid state emitters for broad spectrum continuous spectrum lighting defined by illumination data. The illumination data, which can be sold as a commercial product, can be recorded or authored and include spectral, tempora...	09/20/2011
7979300	Business ratings determined from non-rating information Address books, activity logs, or similar data that are normally prepared by people for purposes other than rating businesses can be parsed and processed to rate businesses without requiring users to complete reviews. As a result, a large amount of rating data is ava...	07/12/2011
7876087	Probe card repair using coupons with spring contacts and separate atachment points Probecard architectures partition the spring compliance required for IC testing between several different components. Such architectures can provide shorter springs, better impedance control, improved power/ground distribution and more direct paths to tester electro...	01/25/2011
7869477	System and method for developing high output power nanosecond range pulses from continuous wave semiconductor laser systems Continuous wave laser diodes are able to be operated so as to achieve a high power pulsed output by operationally exercising them using a subnanosecond input pulse having an IV (power) amplitude characteristic at or exceeding a particular derived power (IV) threshol...	01/11/2011
7762776	Vortex shedding cyclical propeller A propeller having one or more blades eccentrically mounted to a shaft dynamically changes the blade pitch to produce free vortices in a fluid. For extracting energy from a moving fluid, the fluid flow acting on the blades rotates the propeller, while the pitch chan...	07/27/2010
7592603	Combined radiation dosimeter and rate meter A radiation detector can perform both rate and dose measurements for personal safety and also to provide measurements that are sufficiently sensitive for security applications. In one embodiment, a radiation detector has a first measurement channel and a second meas...	09/22/2009
7592228	Recessed clamping diode fabrication in trench devices In a trench-gated MOSFET including an epitaxial layer over a substrate of like conductivity and trenches containing thick bottom oxide, sidewall gate oxide, and conductive gates, body regions of the complementary conductivity are shallower than the gates, and clamp ...	09/22/2009
7484738	Multi-edge snowboard A multi-edge snowboard includes multiple boards with attached bindings. A pivot mechanism that connects the bindings to the boards rotates each board, so that each board can provide an active edge that engages the snow during turning or stopping. The increase in the...	02/03/2009
7432555	Testable electrostatic discharge protection circuits A semiconductor die has a bonding pad for a MOSFET such as a power MOSFET and a separate bonding pad for ESD protection circuitry. Connecting the bonding pads together makes the ESD protection circuitry functional to protect the MOSFET. Before connecting the bonding...	10/07/2008
7419878	Planarized and silicided trench contact Power MOSFETs and fabrication processes for power MOSFETs use a continuous conductive gate structure within trenches to avoid problems arising from device topology caused when a gate bus extends above a substrate surface. The gate bus trench and/or gate structures i...	09/02/2008
7405581	Probing system uses a probe device including probe tips on a surface of a semiconductor die A probing system for electrical testing of a semiconductor device uses a probe device including probe tips on a surface of a semiconductor die. The probe tips can be fabricated as metal bumps on contact pads having a pattern that is the same as the pattern of contac...	07/29/2008
7329551	Manufacturing and testing of electrostatic discharge protection circuits A semiconductor die has a bonding pad for a MOSFET such as a power MOSFET and a separate bonding pad for ESD protection circuitry. Connecting the bonding pads together makes the ESD protection circuitry functional to protect the MOSFET. Before connecting the bonding...	02/12/2008
7258773	Solid polymer electrolyte oxygen sensor An oxygen sensor includes a solid polymer electrolyte, e.g., on an acid treated Nafion membrane and uses a diffusion-limited fuel cell type reactions. The sensor avoids electrolyte leakage and avoids consumption of electrodes. In different configurations, a counter ...	08/21/2007
7171367	Digital audio with parameters for real-time time scaling Preprocessing audio data to generate parameters associated with time scaling reduces the processing power required for real-time time scaling of the audio data. An augmented audio data structure includes the audio data and the parameters. The parameters for a frame ...	01/30/2007
7170306	Connecting a probe card and an interposer using a compliant connector One embodiment of the present invention is a method for fabricating a structure useful for testing circuits that includes steps of: (a) aligning a first side of a connector-holder comprised of electrical connectors having retractable ends that are extendable out of ...	01/30/2007
7144759	Technology partitioning for advanced flip-chip packaging Packaging processes and structures provide thin-film interconnects for high performance signal transmission of high frequency signals. The thin-film interconnects can be formed on a carrier that is at least partly removed for formation of terminals such as a BGA con...	12/05/2006
7094009	Gear-forming cutter A gear-forming cutter for forming a gear tooth on a non-metallic blank includes a spindle and a blade portion. The blade portion extends from the spindle along an axis of the spindle, and includes a blade surface and a surrounding surface. The blade surface has fron...	08/22/2006
7084456	Trench MOSFET with recessed clamping diode using graded doping In a trench-gated MOSFET including an epitaxial layer over a substrate of like conductivity and trenches containing thick bottom oxide, sidewall gate oxide, and conductive gates, body regions of the complementary conductivity are shallower than the gates, and clamp ...	08/01/2006
7079905	Time scaling of stereo audio A time scaling process for a multi-channel (e.g., stereo) audio signal uses a common time offsets for all channels and thereby avoids fluctuation in the apparent location of a sound source. In the time scaling process, common time offsets correspond to respective ti...	07/18/2006
7075145	Poly-sealed silicide trench gate Power MOSFETs and fabrication processes for power MOSFETs use a continuous conductive gate structure within trenches to avoid problems arising from device topology caused when a gate bus extends above a substrate surface. The gate bus trench and/or gate structures i...	07/11/2006
7052963	Method of forming trench transistor with chained implanted body including a plurality of implantation with different energies A “chained implant” technique forms a body region in a trench gated transistor. In one embodiment, a succession of “chained” implants can be performed at the same dose but different energies. In other embodiments different doses and energies can be used, and...	05/30/2006
7054897	Transposable register file A register file structure efficiently handles matrix and image processing. The register file contains an array of data elements and has modes for accessing of multiple data values that are aligned horizontally or vertically in a data array and for accessing data hav...	05/30/2006
7054482	Smart masking tool for image processing Smart selection and paste operations for image processing use a wide edge area for selection and masking of an object from a source image. The wide edge area, which can be designated with a brush tool, allows a user to select all of a desired object without requirin...	05/30/2006
7047201	Real-time control of playback rates in presentations Media encoding, transmission, and playback processes and structures employ a multi-channel architecture with different audio channels corresponding to different playback rates for a presentation to be transmitted over a network. Audio frames in the various audio cha...	05/16/2006
7046840	3-D reconstruction engine Systems and methods for generating three-dimensional models of an object use images having unmeasured camera parameters. Camera calibration determines the perspective of the camera from the content of the images. A background having a pattern with a known marks in e...	05/16/2006
6998864	Structures for testing circuits and methods for fabricating the structures One embodiment of the present invention is a structure useful for testing circuits that includes: (a) a flexible substrate having contactors on a first side and pads on a second side; (b) a rigid substrate having vias aligned with the pads on the second side of the ...	02/14/2006
6984996	Wafer probing that conditions devices for flip-chip bonding A probing system or process for electrical testing of a device fabricated on a wafer also conditions terminals such as solder balls on the device to improve uniformity of the heights of the terminals and improve the reliability of connections to an interconnect subs...	01/10/2006
6975127	Planarizing and testing of BGA packages The planarity of external terminals or a ball grid array on a device package can be improved through use of test probes that flatten the electrical terminals while forming the electrical contacts for package testing. After testing, the package has external terminals...	12/13/2005
6969888	Planarized and silicided trench contact Power MOSFETs and fabrication processes for power MOSFETs use a continuous conductive gate structure within trenches to avoid problems arising from device topology caused when a gate bus extends above a substrate surface. The gate bus trench and/or gate structures i...	11/29/2005
6967485	Automatic drive adjustment of ultraviolet lamps in photo-ionization detectors A photo-ionization detector having an adjustable drive power for a UV lamp implements a calibration operation that determines measurement signals for a series of drive power levels and based on the resulting measurement signals selects one or more drive power levels...	11/22/2005
6966239	Driving shaft for a ratchet spanner A driving shaft for a ratchet spanner includes a shaft body and a sleeve-retaining member. The shaft body includes a polygonal driving end that is adapted to be received fittingly within a wrench sleeve and that has an end surface with a polygonal screwdriver-engagi...	11/22/2005
6951212	Shock pad for paintball pod A paintball carrying and loading device or pod includes a cushion to avoid rattling, impact, and breaking of paintballs when the device is carried on a field of play. The device generally includes a tube, a lid, and the cushion. The cushion can be removable or attac...	10/04/2005
6946859	Probe structures using clamped substrates with compliant interconnectors One embodiment of the present invention is a structure useful for testing circuits that includes: (a) a substrate having contactors on a first side and pads on a second side; (b) a card having pads on a first side; and (c) interconnectors that electrically connect t...	09/20/2005
6940182	Flip-chip package with underfill dam for stress control A dam or barrier around the periphery of a die in a flip-chip package changes the shape of the underfill to reduce stress resulting from edge effects. The dam can include a treated region of a substrate having an affinity to an underfill material. The treated region...	09/06/2005
6924654	Structures for testing circuits and methods for fabricating the structures One embodiment of the present invention is a structure useful for testing circuits that includes: (a) a flexible substrate having contactors on a first side and pads on a second side; (b) a rigid substrate having vias aligned with the pads on the second side of the ...	08/02/2005
6924198	Self-aligned trench transistor using etched contact A trench-gated MOSFET formed using a super self aligned (SSA) process employs an insulating layer such as a glass layer and a contact mask to define contact openings for electrical connections to source regions of the MOSFET. Use a contact mask and an intervening gl...	08/02/2005
6914820	Erasing storage nodes in a bi-directional nonvolatile memory cell A memory transistor having a pair of separate floating gates overlying end regions of a channel and a control gate that overlies the floating gates and a central region of the channel effectively operates as a pair of floating gate transistors with an intervening se...	07/05/2005

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Attorney: Millers; David T.