Bizarre Patents
Mountable Printable Placard With Headband
A resilient headband in a shape for being mounted on the head of the user. The headband is equipped with a longitudinal slotted member for holding a placard.
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| Number | Title | Issue Date |
| 8179530 | Methods and systems for determining a critical dimension and overlay of a specimen Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. ... | 05/15/2012 |
| 8175831 | Methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers Various methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers are provided. One method for creating a dynamic sampling scheme for a process during which measurements are performed on ... | 05/08/2012 |
| 8151220 | Methods for simulating reticle layout data, inspecting reticle layout data, and generating a process for inspecting reticle layout data Various computer-implemented methods are provided. One method for generating a process for inspecting reticle layout data includes identifying a first region in the reticle layout data. A printability of the first region is more sensitive to changes in process param... | 04/03/2012 |
| 8148900 | Methods and systems for providing illumination of a specimen for inspection Methods and systems for providing illumination of a specimen for inspection are provided. One embodiment relates to a system configured to provide illumination of a specimen for inspection. The system includes an electrodeless lamp configured to generate light. The ... | 04/03/2012 |
| 8139844 | Methods and systems for determining a defect criticality index for defects on wafers Various methods and systems for determining a defect criticality index (DCI) for defects on wafers are provided. One computer-implemented method includes determining critical area information for a portion of a design for a wafer surrounding a defect detected on the... | 03/20/2012 |
| 8139843 | Methods and systems for utilizing design data in combination with inspection data Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design da... | 03/20/2012 |
| 8126255 | Systems and methods for creating persistent data for a wafer and for using persistent data for inspection-related functions Various systems and methods for creating persistent data for a wafer and using persistent data for inspection-related functions are provided. One system includes a set of processor nodes coupled to a detector of an inspection system. Each of the processor nodes is c... | 02/28/2012 |
| 8112241 | Methods and systems for generating an inspection process for a wafer Methods and systems for generating an inspection process for a wafer are provided. One computer-implemented method includes separately determining a value of a local attribute for different locations within a design for a wafer based on a defect that can cause at le... | 02/07/2012 |
| 8111900 | Computer-implemented methods for detecting and/or sorting defects in a design pattern of a reticle Various computer-implemented methods are provided. One method for sorting defects in a design pattern of a reticle includes searching for defects of interest in inspection data using priority information associated with individual defects in combination with one or ... | 02/07/2012 |
| 8102408 | Computer-implemented methods and systems for determining different process windows for a wafer printing process for different reticle designs Computer-implemented methods and systems for determining different process windows for a wafer printing process for different reticle designs are provided. One method includes generating simulated images illustrating how each of the different reticle designs will be... | 01/24/2012 |
| 8073240 | Computer-implemented methods, computer-readable media, and systems for identifying one or more optical modes of an inspection system as candidates for use in inspection of a layer of a wafer Computer-implemented methods, computer-readable media, and systems for identifying one or more optical modes of an inspection system as candidates for use in inspection of a layer of a wafer are provided. One method includes determining one or more characteristics o... | 12/06/2011 |
| 8049877 | Computer-implemented methods, carrier media, and systems for selecting polarization settings for an inspection system Computer-implemented methods, carrier media, and systems for selecting polarization settings for an inspection system for inspection of a layer of a wafer are provided. One method includes detecting a population of defects on the layer of the wafer using results of ... | 11/01/2011 |
| 8045145 | Systems and methods for acquiring information about a defect on a specimen Systems and methods for acquiring information about a defect on a specimen are provided. One system includes an optical subsystem configured to acquire topography information about the defect. The system also includes an electron beam subsystem configured to acquire... | 10/25/2011 |
| 8041106 | Methods and systems for detecting defects on a reticle Methods and systems for detecting defects on a reticle are provided. One method includes printing a single die reticle in first areas of a wafer using different values of a parameter of a lithography process and at least one second area using a nominal value of the ... | 10/18/2011 |
| 8041103 | Methods and systems for determining a position of inspection data in design data space Various methods and systems for determining a position of inspection data in design data space are provided. One computer-implemented method includes determining a centroid of an alignment target formed on a wafer using an image of the alignment target acquired by i... | 10/18/2011 |
| 8010222 | Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a ... | 08/30/2011 |
| 8000922 | Methods and systems for generating information to be used for selecting values for one or more parameters of a detection algorithm Methods and systems for generating information to be used for selecting values for parameter(s) of a detection algorithm are provided. One method includes without user intervention performing a scan of an area of a wafer using an inspection system and default values... | 08/16/2011 |
| 7975245 | Computer-implemented methods for determining if actual defects are potentially systematic defects or potentially random defects Various computer-implemented methods for determining if actual defects are potentially systematic defects or potentially random defects are provided. One computer-implemented method for determining if actual defects are potentially systematic defects or potentially ... | 07/05/2011 |
| 7968354 | Methods for correlating backside and frontside defects detected on a specimen and classification of backside defects Computer-implemented methods that include correlating a backside defect with a frontside defect detected on a specimen are provided. The defects are correlated if a portion of the backside defect on the backside of the specimen is opposite to a portion of the fronts... | 06/28/2011 |
| 7962863 | Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer are provided. One method includes generating simulated images of the reticle features printed on the wafer using dif... | 06/14/2011 |
| 7940384 | Systems and methods for blocking specular reflection and suppressing modulation from periodic features on a specimen Systems and methods for blocking specular reflection and suppressing modulation from periodic features on a specimen are provided. One inspection system configured to block specular reflection and suppress modulation in an image of a specimen includes an illuminatio... | 05/10/2011 |
| 7925486 | Computer-implemented methods, carrier media, and systems for creating a metrology target structure design for a reticle layout Computer-implemented methods, carrier media, and systems for creating a metrology target structure design for a reticle layout are provided. One computer-implemented method for creating a metrology target structure design for a reticle layout includes simulating how... | 04/12/2011 |
| 7925072 | Methods for identifying array areas in dies formed on a wafer and methods for setting up such methods Methods for identifying array areas in dies formed on a wafer and methods for setting up such methods are provided. One method for identifying array areas in dies formed on a wafer includes comparing an array pattern in a template image acquired in one of the array ... | 04/12/2011 |
| 7924434 | Systems configured to generate output corresponding to defects on a specimen Systems configured to generate output corresponding to defects on a specimen and systems configured to generate phase information about defects on a specimen are provided. One system includes an optical subsystem that is configured to create interference between a t... | 04/12/2011 |
| 7912658 | Systems and methods for determining two or more characteristics of a wafer Systems and methods for determining two or more characteristics of a wafer are provided. The two or more characteristics include a characteristic of the wafer that is spatially localized in at least one dimension and a characteristic of the wafer that is not spatial... | 03/22/2011 |
| 7904845 | Determining locations on a wafer to be reviewed during defect review Various methods, designs, defect review tools, and systems for determining locations on a wafer to be reviewed during defect review are provided. One computer-implemented method includes acquiring coordinates of defects detected by two or more inspection systems. Th... | 03/08/2011 |
| 7894659 | Methods for accurate identification of an edge of a care area for an array area formed on a wafer and methods for binning defects detected in an array area formed on a wafer Methods for identifying an edge of a care area for an array area formed on a wafer and/or for binning defects detected in the array area are provided. One method for identifying an edge of a care area for an array area formed on a wafer includes determining a value ... | 02/22/2011 |
| 7893703 | Systems and methods for controlling deposition of a charge on a wafer for measurement of one or more electrical properties of the wafer Systems and methods for controlling deposition of a charge on a wafer for measurement of one or more electrical properties of the wafer are provided. One system includes a corona source configured to deposit the charge on the wafer and a sensor configured to measure... | 02/22/2011 |
| 7877722 | Systems and methods for creating inspection recipes Systems and methods for creating inspection recipes are provided. One computer-implemented method for creating an inspection recipe includes acquiring a first design and one or more characteristics of output of an inspection system for a wafer on which the first des... | 01/25/2011 |
| 7873504 | Computer-implemented methods, carrier media, and systems for creating a metrology target structure design for a reticle layout Computer-implemented methods, carrier media, and systems for creating a metrology target structure design for a reticle layout are provided. One computer-implemented method for creating a metrology target structure design for a reticle layout includes simulating how... | 01/18/2011 |
| 7869040 | Measurement systems configured to perform measurements of a specimen and illumination subsystems configured to provide illumination for a measurement system An illumination subsystem configured to provide illumination for a measurement system includes first and second light sources configured to generate light for measurements in different wavelength regimes. The illumination subsystem also includes a TIR prism configur... | 01/11/2011 |
| 7869020 | Fourier filters, inspection systems, and systems for fabricating fourier filters Fourier filters, inspection systems, and systems for fabricating Fourier filters are provided. One Fourier filter configured for use in an inspection system includes a substrate that is substantially transparent to light from a specimen illuminated by the inspection... | 01/11/2011 |
| 7867693 | Methods for forming device structures on a wafer Methods for forming device structures on a wafer are provided. One method includes transferring approximately an inverse of patterned features formed in a positive resist layer on the wafer to a device material on the wafer to form the device structures in the devic... | 01/11/2011 |
| 7796804 | Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer are provided. One computer-implemented method for generating a standard reference die for use in a die to standard reference die ... | 09/14/2010 |
| 7788629 | Systems configured to perform a non-contact method for determining a property of a specimen Systems configured to perform a non-contact method for determining a property of a specimen are provided. One system configured to perform a non-contact method for determining a property of a specimen includes a focused biasing device configured to provide a stimulu... | 08/31/2010 |
| 7787114 | Systems and methods for inspecting a specimen with light at varying power levels Systems and methods for inspecting a specimen with light at varying power levels are provided. One system configured to inspect a specimen includes a light source configured to generate light. The system also includes a power attenuator subsystem configured to alter... | 08/31/2010 |
| 7777875 | Systems, circuits and methods for extending the detection range of an inspection system by avoiding detector saturation Inspection systems, circuits and methods are provided to enhance defect detection by addressing anode saturation as a limiting factor of the measurement detection range of a photomultiplier tube (PMT) detector. In accordance with one embodiment of the invention, a m... | 08/17/2010 |
| 7774153 | Computer-implemented methods, carrier media, and systems for stabilizing output acquired by an inspection system Various computer-implemented methods, carrier media, and systems for stabilizing output acquired by an inspection system are provided. One computer-implemented method includes determining a characteristic of output acquired for a wafer by an inspection system using ... | 08/10/2010 |
| 7769225 | Methods and systems for detecting defects in a reticle design pattern Computer-implemented methods and systems for detecting defects in a reticle design pattern are provided. One computer-implemented method includes acquiring images of a field in the reticle design pattern. The images illustrate how the field will be printed on a wafe... | 08/03/2010 |
| 7767956 | Methods and systems for lithography process control Methods and systems for evaluating and controlling a lithography process are provided. For example, a method for reducing within wafer variation of a critical metric of a lithography process may include measuring at least one property of a resist disposed upon a waf... | 08/03/2010 |
