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Attorney: Marger Johnson & Mccollom, P.C.


Number of patents: 51
Last date: May 17, 2011

1    
NumberTitleIssue Date
7945695Smart secretary
A message-processing agent receives an object from a space in a Scalable Infrastructure System. The message-processing agent determines the destination of the object and checks a preference setting for the destination. The message-processing agent then routes the ob...
05/17/2011
7253394Image sensor and method for fabricating the same
An image sensor includes a substrate in which photoelectric elements have been formed, and an array of optical path conversion elements formed at a light so that the optical path converted light may be incident on the substrate, wherein each of the optical path conv...
08/07/2007
7542366Nonvolatile semiconductor memory device with wired-or structure blocking data transmission from defective page buffer
A nonvolatile semiconductor memory device includes a fuse, a switching enable circuit to generate a switching enable signal in response to a state of the fuse, and a switching unit to couple an internal output line of a page buffer set to a global output line in res...
06/02/2009
7542328Method of detecting bit line bridge by selectively floating even-or odd-numbered bit lines of memory device
Provided is a bit line bridge detection method for selectively floating even-numbered or odd-numbered bit lines. The bit line bridge detection method simultaneously activates even-numbered sense amplifiers and odd-numbered sense amplifiers in response to a sense amp...
06/02/2009
7540193Triaxial acceleration sensor module and method of manufacturing the same
A triaxial acceleration sensor module 100 includes: a hollow housing 30 provided with a partition plate 31 having a through-hole 32; a triaxial acceleration sensor 1 provided inside the housing 30; and a sensor driving IC
06/02/2009
6844251Method of forming a semiconductor device with a junction termination layer
A method and apparatus are provided for improving a breakdown voltage of a semiconductor device. The method includes the steps of coupling an electrode of the silicon-carbide diode to a drift layer of the semiconductor device through a charge transfer junction, said...
01/18/2005
7539826System, device, and method for improved mirror mode operation of a semiconductor memory device
By using the combination of a pre-existing command signal that is common to two memory devices and a non-shared command signal that is applied individually to each of the devices, embodiments of the invention may operate in a mirror mode, thereby preventing unwanted...
05/26/2009
7538386MOS transistor having protruded-shape channel and method of fabricating the same
A MOS transistor that has a protruding portion with a favorable vertical profile and a protruded-shape channel that requires no additional photolithography process, and a method of fabricating the same are provided. A first mask that defines an isolation region of a...
05/26/2009
7537940Method of manufacturing electronic device capable of controlling threshold voltage and ion implanter controller and system that perform the method
A method of manufacturing an electronic device, which can obtain sufficient manufacturing margins and reduce a defect rate by compensating for a threshold voltage variation caused by the variation of a critical dimension (CD) of a gate electrode. An ion implanter co...
05/26/2009
7536352Tokenless biometric electronic financial transactions via a third party identicator
A method and device enables tokenless authorization of an electronic payment between a payor and a payee using an electronic identicator and a one payor bid biometric sample. The payor registers with a registration biometric sample, and a payor financial account ide...
05/19/2009
7535514Apparatus and method for decoding SECAM chrominance signal
We describe an apparatus and method for decoding a SECAM chrominance signal. The apparatus may include a band-pass filter to separate the chrominance signal from the composite video baseband signal. A down-mixer down mixes the chrominance signal from a high to a low...
05/19/2009
7535293Preamplifier circuits and methods of calibrating an offset in the same
A preamplifier circuit includes a differential amplifying unit, an offset detection unit and a reference signal generation unit. The differential amplifying unit compares an input signal pair with a reference signal pair to generate an output signal pair. The offset...
05/19/2009
7534726Method of forming a recess channel trench pattern, and fabricating a recess channel transistor
A method of forming a recess channel trench pattern for forming a recess channel transistor is provided. A mask layer is formed on a semiconductor substrate, which is then patterned to expose an active region and a portion of an adjacent device isolating layer with ...
05/19/2009
7534709Semiconductor device and method of manufacturing the same
Embodiments of the present invention include semiconductor devices that can be made with relatively low resistance, and methods of forming the semiconductor devices. A resistance reducing layer is formed between a polysilicon layer and a metal layer. As a result, an...
05/19/2009
7534035Temperature sensor for generating sectional temperature code and sectional temperature detection method
Provided are a temperature sensor for generating a sectional temperature code and sectional temperature detection method. In one embodiment, the temperature sensor includes a plurality of serially connected fixed delay cells inputting a temperature detection signal ...
05/19/2009
7491344Method for etching an object using a plasma and an object etched by a plasma
Disclosed herein is a method for etching a face of an object and more particularly a method for etching a rear face of a silicon substrate. The object having a silicon face is positioned so as to be spaced apart from a plasma-generating member by a predetermined int...
02/17/2009
7488644Method of fabricating a semiconductor device
Bit lines having first conductive patterns and bit line mask patterns are formed on a first insulating layer between capacitor contact regions of a substrate. An oxide second insulating layer is formed on the bit lines and contact patterns are formed to open storage...
02/10/2009
7488203Electrical outlet assembly
An electrical outlet device includes an enclosure that contains one or more electrical outlets. The enclosure has a top surface, a bottom surface, and a side surface extending from the top surface to the bottom surface and forming an enclosure perimeter. The device ...
02/10/2009
7490072Providing access controls
Providing access control for an application is disclosed. An application is monitored. An application profile is generated for the application. The application profile is based at least in part on behavior of the application as observed through the monitoring of the...
02/10/2009
7489544Flash memory device having multi-level cell and reading and programming method thereof
There is provided a flash memory device with multi-level cell and a reading and programming method thereof. The flash memory device with multi-level cell includes a memory cell array, a unit for precharging bit line, a bit line voltage supply circuit for supplying a...
02/10/2009
7489035Integrated circuit chip package having a ring-shaped silicon decoupling capacitor
A semiconductor package features a ring-shaped silicon decoupling capacitor that reduces simultaneous switching noise. The decoupling capacitor is fabricated on a substrate from silicon using a wafer fabrication process and takes the form of an annular capacitive st...
02/10/2009
7482825Burn-in testing apparatus and method
An integrated circuit (IC) package testing apparatus integrates a temperature sensor, heater (or cooler), and controller within a single modular unit. The controller is a microprocessor embedded within the modular unit and in communication with the sensor and heater...
01/27/2009
7482210Method of fabricating semiconductor device having junction isolation insulating layer
A semiconductor device and a method for fabricating the same are provided. The provided semiconductor device includes a field oxide layer formed in a semiconductor substrate to define an active region; gate structures formed on the active region; source/drain juncti...
01/27/2009
7482616Semiconductor devices having phase change memory cells, electronic systems employing the same and methods of fabricating the same
In one embodiment, a phase-change memory device has an oxidation barrier layer to protect against memory cell contamination or oxidation and a method of manufacturing the same. In one embodiment, a semiconductor memory device comprises a molding layer overlying a se...
01/27/2009
7479408Stack package made of chip scale packages
A stack package of the present invention is made by stacking at least two area array type chip scale packages. Each chip scale package of an adjacent pair of chip scale packages is attached to the other in a manner that the ball land pads of the upper stacked chip s...
01/20/2009
7480012Multiplexed video digitization system and method
The invention relates to a multiplexed video digitization system and method. The system includes a plurality of analog video signals, a multiplexer to select one of the plurality of analog video signals, and an analog-to-digital converter to convert the selected ana...
01/20/2009
7479818Sense amplifier flip flop
A sense amplifier flip flop including a differential input portion, a differential amplifying portion including a first inverter and a second inverter, and a bias voltage generating portion. The bias voltage generating portion is configured to generate body voltages...
01/20/2009
7476973Method of manufacturing a semiconductor device having a silicidation blocking layer
A silicidation blocking layer (SBL) pattern is formed on a substrate including an active region and a field region. The SBL pattern covers the field region and exposes the active region. A silicide layer is formed on the active region by reacting metal with silicon ...
01/13/2009
7476962Stack semiconductor package formed by multiple molding and method of manufacturing the same
Provided are a stack semiconductor package manufactured by multiple molding that can prevent the breakage due to stress concentration at a connecting portion between separate semiconductor packages and a method of manufacturing the same. The stacked semiconductor pa...
01/13/2009
7476584Method of fabricating a semiconductor device with a bit line contact plug
In one embodiment, a semiconductor device includes a plurality of gate electrodes formed on a semiconductor substrate including a cell region, a core region, and a peripheral circuit region, along with source/drain regions. A first landing pad contacts the source/dr...
01/13/2009
7476924Semiconductor device having recessed landing pad and its method of fabrication
A semiconductor device having a recessed landing pad includes a semiconductor substrate and a lower interlayer dielectric layer disposed on the semiconductor substrate. A first landing pad is disposed through the lower interlayer dielectric layer to be in contact wi...
01/13/2009
7477548NAND flash memory device and methods of its formation and operation
A NAND flash memory device, and methods of forming and operating the same are provided. The NAND flash memory device includes first and second selection gate lines sequentially disposed at one side of a plurality of cell gate lines. A first selection transistor incl...
01/13/2009
7474564Non-volatile memory device capable of changing increment of program voltage according to mode of operation
A non-volatile memory device includes a word line voltage generator circuit for generating a word line voltage to be supplied to a selected row in response to step control signals, and a program controller for generating the step control signals so that an increment...
01/06/2009
7473590Semiconductor device having body contact through gate and method of fabricating the same
According to an embodiment of the invention, a lower transistor is formed on a semiconductor substrate, and an upper thin film transistor is formed on the lower transistor. A body contact plug is formed to penetrate an upper gate electrode of the upper thin film tra...
01/06/2009
7473954Bitline of semiconductor device having stud type capping layer and method for fabricating the same
A semiconductor device with a bitline structure has a stud type capping layer. A method of fabricating the same achieves sufficient process margins and reduces parasitic capacitance. The device may include an insulating film formed on a semiconductor substrat...
01/06/2009
D584362C-frame sign
01/06/2009
7475008Construction, manipulation, and comparison of a multi-dimensional semantic space
A directed set can be used to establish contexts for linguistic concepts: for example, to aid in answering a question, to refine a query, or even to determine what questions can be answered given certain knowledge. A directed set includes a plurality of elements and...
01/06/2009
7474587Flash memory device with rapid random access function and computing system including the same
A flash memory device includes a memory cell array, an address buffer circuit including address buffers, each address buffer configured to store an address for a random read operation, a read circuit configured to sense data from the memory cell array in response to...
01/06/2009
7473993Semiconductor stack package and memory module with improved heat dissipation
A semiconductor stack package includes lower and upper individual packages. When the upper individual package is stacked on the lower individual package, a heat-conducting layer provided under the upper package touches a heat-mediating layer provided on the lower pa...
01/06/2009
7470586Memory cell having bar-shaped storage node contact plugs and methods of fabricating same
According to embodiments of the invention, a bit line interlayer insulating layer is placed over a semiconductor substrate. A plurality of parallel bit line patterns are placed on the bit line interlayer insulating layer. Each of the bit line patterns has a bit line...
12/30/2008
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