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| Number | Title | Issue Date |
| 5788352 | Multiplexed multi-image source display writing system A projection system wherein two or more separate display sources, such as high brightness sources, or active matrix liquid crystal display (AMLCD) or other flat panel displays are used to write information directly onto a display screen, or onto a photoac... | 08/04/1998 |
| 5760433 | In situ reactive layers for protection of ferroelectric integrated circuits A layer of sacrificial, chemically reactive material is formed as part of the fabrication process of an integrated circuit, and covers active circuitry to protect it from reaction with hydrogen. Integrated circuits and fabrication methods are provided by ... | 06/02/1998 |
| 5731708 | Unpackaged semiconductor testing using an improved probe and precision X-Y table A portable integrated circuit die testing system that offers a cost-effective solution for electrically testing bare, unpackaged, integrated circuit chips or die. The system provides for direct electrical interconnection of die of various sizes and thickn... | 03/24/1998 |
| 5721009 | Controlled carbon content MOD precursor materials using organic acid anhydride Metal organic acid salt solutions for use as precursor materials for forming layered ferroelectric thin films are synthesized using an organic acid anhydride as the exchange reagent. The reaction is much faster than previous techniques, allows exact contr... | 02/24/1998 |
| 5708570 | Shrinkage-matched circuit package utilizing low temperature co-fired ceramic structures A glass-ceramic substrate for encapsulating an electronic component, with at least two shrinkage control layers restricting shrinkage of the substrate during a co-firing process. The shrinkage control layers are chosen so that they have substantially the ... | 01/13/1998 |
| 5708283 | Flip chip high power monolithic integrated circuit thermal bumps A high power, flip-chip microwave monolithic integrated circuit (MMIC) assembly (30) has a high power microwave monolithic integrated circuit (MMIC) having a surface with an active area (72) in which heat is generated. The assembly also has a host substra... | 01/13/1998 |
| 5705432 | Process for providing clean lift-off of sputtered thin film layers A unique photoresist process is provided which achieves clean and complete lift-off of a thin film layer such as a sputtered thin film formed on a photoresist which is formed above a semiconductor substrate. The process of the present invention relies on ... | 01/06/1998 |
| 5704792 | Spring loaded rotary connector A rotary connector comprising first and second printed wiring boards that rotate relative to each other and that are electrically interconnected using spring loaded pogo-stick type contacts. The spring-loaded contacts are used to transfer electrical signa... | 01/06/1998 |
| 5702654 | Method of making thermal shock resistant sapphire for IR windows and domes Single crystal sapphire is conventionally employed for mid-wave IR windows and domes exposed to high aerodynamic heating environments. Single crystal sapphire, however, suffers a loss of compressive strength in the c-axis of 95% on heating from ambient to... | 12/30/1997 |
| 5702532 | MOCVD reactor system for indium antimonide epitaxial material Multiple solid precursor bubblers are used to alleviate channeling effects caused by high carrying gas flow rates to provide for deposition of indium-based epitaxial materials in high-capacity MOCVD reactor systems. Precracking of precursor materials that... | 12/30/1997 |
| 5693153 | Non-chromated surface preparation materials and methods for corrosion protection of aluminum and its alloys Surface preparation methods and materials that provide corrosion protection for aluminum and its alloys without the use of chromate and that protects aluminum surfaces against corrosion nearly as well as a chromate conversion coating. In accordance with t... | 12/02/1997 |
| 5691245 | Methods of forming two-sided HDMI interconnect structures Methods of forming two-sided high density multilayer interconnect (HDMI) structures on a relatively large carrier and subsequently releasing and removing one or more structures to provide useable flexible interconnects or decals. In general, a carrier is ... | 11/25/1997 |
| 5690498 | Spring loaded rotary connector Spring loaded rotary connectors that comprise a first wiring board having one or more sets of electrically conductive concentric circuits or rings formed thereon, that has one or more raised contacts, or looped-shaped dimples, for every ring. In a first e... | 11/25/1997 |
| 5686330 | Method of making a self-aligned static induction transistor A method of fabricating self-aligned static induction transistors is disclosed. The method comprises fabricating a silicon substrate having an active area. A guard ring is formed around the active area. Source and gate regions are formed, and a self-align... | 11/11/1997 |
| 5684396 | Localizing magnetic dipoles using spatial and temporal processing of magnetometer data Processing methods and apparatus that process magnetometer data derived from an array of magnetometer sensors and outputs both the position and velocity of a magnetic dipole. In the method and apparatus, (a) a set of actual magnetic field measurements of ... | 11/04/1997 |
| 5669251 | Liquid carbon dioxide dry cleaning system having a hydraulically powered basket A liquid carbon dioxide dry cleaning system that employs a rotating basket inside a dry cleaning vessel that is powered by hydraulic flow. The present invention is particularly useful as a dry cleaning system that uses liquid carbon dioxide as the cleanin... | 09/23/1997 |
| 5667621 | Non-aqueous, adhesive-free method of bonding expanded polymeric parts Bonding of expanded polymeric parts together to produce lost foam molds suitable for casting metallic details is accomplished by applying a non-aqueous, adhesive-free coating comprising a polar, highly dielectric component contained in a liquid vehicle to... | 09/16/1997 |
| 5666130 | Point addressable display assembly, method of operating same, and method of fabricating same A method of operating a liquid crystal display, and a liquid crystal display constructed to operate in accordance with the method. The liquid crystal display has a plurality of display pixels, and the method comprises the steps of (a) operating a first sw... | 09/09/1997 |
| 5652448 | Nonvolatile memory device The gate structure for a nonvolatile memory device comprising an EEPROM and a latch transistor is fabricated on a substrate by patterning the EEPROM's floating gate in a first polysilicon layer, patterning the EEPROM's control gate over the floating gate ... | 07/29/1997 |
| 5651495 | Thermoelectric cooler assisted soldering An improved method for soldering a thermoelectric cooler between an electronic device and a heatsink. Thermoelectric coolers are assembled by soldering parts together using a first solder. The bottom surface of the thermoelectric cooler is first soldered ... | 07/29/1997 |
| 5651276 | Dry-cleaning of garments using gas-jet agitation Substantial amounts of particulate soils in garments can be removed by agitation in gas-jet in a solvent-free, low-pressure environment. The ability of the present gas-jet agitation system to remove particulate soils from garments and fabrics rivals that ... | 07/29/1997 |
| 5651180 | Green ceramic via metallization technique The present invention provides a method and apparatus for metallizing vias in co-fired ceramic green tape. A vacuum operated pick and place anvil comprising a porous block is used to pick up conductor balls from a bed. Air pressure is used to create a vac... | 07/29/1997 |
| 5643815 | Super self-align process for fabricating submicron CMOS using micron design rule fabrication equipment Submicron channel length FET is fabricated using larger (e.g., 1 micron) design rule fabrication equipment. A polysilicon layer (34) is first formed over an active device region (28). The following transistor elements are then sequentially formed using a ... | 07/01/1997 |
| 5643505 | Method for making low cost infrared windows Low cost broadband infrared windows are fabricated using a near net shape process which greatly reduces the cost of machining and grinding window materials. The fabrication of zinc sulfide (ZnS) IR windows uses ceramic powder processing to avoid the expen... | 07/01/1997 |
| 5641546 | Passivation of electronic modules using high density plasmas Passivating coatings are formed on populated electronic boards, such as a sealed chip on board electronic module, or the like, using a high density plasma deposition method that employs an electron cyclotron resonance (ECR) reactor. A populated electronic... | 06/24/1997 |
| 5637027 | CO2 jet spray system employing a thermal CO2 snow plume sensor CO2 jet spray cleaning apparatus that monitors CO2 snow plume characteristics. The present invention is a CO2 jet spray cleaning system that comprises a holding tank for containing liquid CO2, a spray nozzle cou... | 06/10/1997 |
| 5632881 | Measuring magnesium concentrations in molten metal alloys A simple robust sensor probe for determining the magnesium concentration in molten metal alloys in real-time. The probe provides needed process control information in molten metal technologies and has particular application to processes for removing magne... | 05/27/1997 |
| 5611491 | Modular CO2 jet spray device A modular jet spray device for use in cleaning submicron sized particles and molecular films using CO2 spray. The modular jet spray device comprises a valve body having first and second ends and an gas input for receiving a CO2 clean... | 03/18/1997 |
| 5602421 | Microwave monolithic integrated circuit package with improved RF ports A mounting and protective package for a monolithic microwave integrated circuit die (16) operable in the Ka -band is formed of two high temperature co-fired ceramic layers sandwiched by two metal layers (10,12,20,26) that minimize hermetic seal... | 02/11/1997 |
| 5601932 | Copper composites directly bonded to ceramics A ceramic member (52) is direct-bonded to a copper composite substrate by heating to diffuse copper to the surface of the copper composite substrate (56), oxidizing the copper composite substrate following heating, placing a ceramic member in contact with... | 02/11/1997 |
| 5600541 | Vertical IC chip stack with discrete chip carriers formed from dielectric tape A 3-D integrated circuit (IC) chip stack employs a plurality of discrete chip carriers that are formed from dielectric tape layers such as fused low temperature cofired ceramic (LTCC) tape. The chips are lodged in cavities within the tape layers, and are ... | 02/04/1997 |
| 5600480 | Ultra-low acoustic resonance electro-optic modulator An improved electro-optic modulator having reduced amplitude of acoustic resonances is provided. Acoustic energy is efficiently removed from the electro-optic crystal and channeled into electrode and side dielectric bars where it is dissipated by material... | 02/04/1997 |
| 5588843 | Rotary electrical connector A rotary electrical connector has two planar connector members. Each of the planar connector members is positioned perpendicular to an axis of rotation and is supported in rotational facing relation to the other connector member. One of the connector memb... | 12/31/1996 |
| 5578515 | Method for fabricating gate structure for nonvolatile memory device comprising an EEPROM and a latch transistor The gate structure for a nonvolatile memory device comprising an EEPROM and a latch transistor is fabricated on a substrate by patterning the EEPROM's floating gate in a first polysilicon layer, patterning the EEPROM's control gate over the floating gate ... | 11/26/1996 |
| 5575959 | Process for making low cost infrared windows Low cost broadband infrared windows are fabricated using a near net shape process which greatly reduces the cost of machining and grinding window materials. The fabrication of zinc sulfide (ZnS) IR windows uses ceramic powder processing to avoid the expen... | 11/19/1996 |
| 5575956 | Room-temperature stable, one-component, electrically-conductive, flexible epoxy adhesives A flexible electrically-conductive epoxy-based adhesive composition and method for making the same are provided. The present adhesive composition comprises: (a) a polymer mixture comprising at least one polyepoxide resin having a hardness not exceeding a ... | 11/19/1996 |
| 5575664 | Ball contact rotary connector A rotary connector employing rolling conductive members. Two or more electrically isolated assemblies comprising pairs of primed wiring boards or flexprint circuits are disposed in a housing. The printed wiring boards have conductors disposed on adjacent ... | 11/19/1996 |
| 5572407 | Apparatus for interconnecting an integrated circuit device to a multilayer printed wiring board Apparatus for interconnecting an integrated circuit device, such as an infrared device, having a plurality of leads to a multilayer printed wiring board having a plurality of interconnects. The apparatus comprises a flexprint circuit having a plurality of... | 11/05/1996 |
| 5572049 | Multi-layer collector heterojunction transistor A multi-layer collector heterojunction transistor (10) provides for high power, high efficiency transistor amplifier operation, especially in the RF (radio frequency) range of operation. A larger band gap first collector layer (12), approximately 15% of t... | 11/05/1996 |
| 5563573 | Pseudo-random switched resistor A pseudo-random switched resistor for emulating a relatively high input impedance. The switched resistor comprises a relatively low value resistor, a semiconductor switch coupled to the resistor, and a pseudo-random pulse generator coupled to the switch f... | 10/08/1996 |
