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| Number | Title | Issue Date |
| 5824389 | Micromachined microscopic particle selecting apparatus Various forms of micromachined electrostatic microconveyors and useful devices based thereon are described. In one embodiment, a tube shaped conveyor is formed by disposing conductors circumferentially about the exterior surface of the tube. The tube is f... | 10/20/1998 |
| 5818102 | System having integrated circuit package with lead frame having internal power and ground busses An electronic system utilizing at least one integrated circuit including a semiconductor integrated circuit chip housed in a package providing external electrical connections for the circuit chip. The system package has only a limited number of external c... | 10/06/1998 |
| 5801432 | Electronic system using multi-layer tab tape semiconductor device having distinct signal, power and ground planes Electronic systems using separate and distinct conductive layers for power and ground are insulated from one another and a patterned signal conductive layer to form a flexible substrate for mounting a semiconductor die in a semiconductor device assembly o... | 09/01/1998 |
| 5793104 | Apparatus for forming electrical connections between a semiconductor die and a semiconductor package A semiconductor device package containing a semiconductor die uses a platform mounted on an active face of the die. The platform electrically connects to at least one bond pad on the die. A package lid electrically connects to the platform on the die and ... | 08/11/1998 |
| 5791849 | Anti-cross threading fastener A self-aligning, anti-cross threading fastener having first and/or second members with lead threads having a curved surface feature from the minor diameter to the major diameter which allows the surface of the lead threads to cam over the mating threads o... | 08/11/1998 |
| 5780928 | Electronic system having fluid-filled and gas-filled thermal cooling of its semiconductor devices An electronic system having improved thermal transfer from a semiconductor die in a semiconductor device assembly (package) by at least partially filling a cavity in the package with a thermally conductive fluid, immersing a heat collecting portion of a h... | 07/14/1998 |
| 5773886 | System having stackable heat sink structures Electronic systems utilizing a plurality of integrated circuit packages having a stackable heat sink assembly is formed by press-fit assembly of two or more identical fin layers. Each fin layer is formed using powdered metallurgy and has a button-like pro... | 06/30/1998 |
| 5770889 | Systems having advanced pre-formed planar structures An electronic system utilizing at least one semiconductor die having raised conductive bumps on its surface for connecting to other devices or systems is disposed on a face of a preformed planar structure (interposer) having through holes. Solder joints w... | 06/23/1998 |
| 5767580 | Systems having shaped, self-aligning micro-bump structures A digital system utilizing at least one semiconductor integrated circuit die having positive mechanical alignment is provided between substrates using micro-bump contacts by forming "detented" conductive bump contacts on one substrate having a concave end... | 06/16/1998 |
| 5767570 | Semiconductor packages for high I/O semiconductor dies Techniques for providing semiconductor packages capable of forming connections to "high I/O" semiconductor dies is described, wherein there are at least two distinct pluralities of conductive lines. Leadframe-type packages and substrate-based package embo... | 06/16/1998 |
| 5757873 | Differential delay buffer A differential delay buffer includes a variable delay buffer unit, the variable delay buffer unit having a differential stage followed by a variable hysteresis stage. A plurality of variable delay buffer units can be cascaded together, in each variable de... | 05/26/1998 |
| 5753970 | System having semiconductor die mounted in die-receiving area having different shape than die Electronic systems utilizing a plurality of integrated circuit packages having at least some large gaps between edges of a semiconductor die and the inner ends of package conductors defining a die-receiving area, one or more bond wire support structure ar... | 05/19/1998 |
| 5744858 | Semiconductor packaging technique yielding increased inner lead count for a given die-receiving area A greater lead count for a given die area can be achieved with "certain non-square" geometries formed by the inner ends of conductive lines. These include various triangular configurations, as well as "greatly elongated" rectangular, parallelogram and tra... | 04/28/1998 |
| 5744856 | Non-square die for integrated circuits and systems containing the same Electronic systems using certain non-square dies, such as triangular dies, greatly elongated rectangular dies, parallelogram dies, trapezoidal, and the like, are able to be laid out in the area of a circular semiconductor wafer more "efficiently" than squ... | 04/28/1998 |
| 5744171 | System for fabricating conductive epoxy grid array semiconductor packages System for producing a plurality of semiconductor device assemblies utilizing a grid array of conductive epoxy for connecting them to an electronic system. Conductive epoxy is screen printed in a desired pattern onto a printed wire board of the semiconduc... | 04/28/1998 |
| 5744084 | Method of improving molding of an overmolded package body on a substrate Substrates having a wide range of thickness, and intended to be overmolded with a plastic package body, are accommodated in a common mold. The top surface of the substrate is provided with a dam structure, which may be formed as an additional layer on the... | 04/28/1998 |
| 5741726 | Semiconductor device assembly with minimized bond finger connections A semiconductor device assembly having external connections, including power supply connections such as to a power source or ground, is made without resort to bond fingers. Rather, external connections are directly made from a semiconductor die to a condu... | 04/21/1998 |
| 5737187 | Apparatus, method and system for thermal management of an unpackaged semiconductor device A thermal management structure to provide mechanical isolation and heat removal for a unpackaged semiconductor die mounted directly on a printed circuit board substrate. The thermal management structure sandwiches the unpackaged semiconductor die and subs... | 04/07/1998 |
| 5734155 | Photo-sensitive semiconductor integrated circuit substrate and systems containing the same An electronic system having optical elements in association with photosensitive elements is described. In some of the arrangements, the optical elements are formed integrally with a substrate containing the photosensitive elements. In other arrangements, ... | 03/31/1998 |
| 5729894 | Method of assembling ball bump grid array semiconductor packages A ball bump grid array package includes dies on one surface of a printed wiring board (PWB) and an array of ball bumps on the other surface of the PWB. The die is interconnected with the ball bumps by bond wires, traces on the one surface of the PWB, vias... | 03/24/1998 |
| 5728599 | Printable superconductive leadframes for semiconductor device assembly Process for manufacturing a high interconnection density, fine-line, superconductive printed leadframes using thick-film screen-printing techniques, or other printing techniques. Generally, a superconductive leadframe pattern is printed on a backing subst... | 03/17/1998 |
| 5725903 | Sedimentary deposition of photoresist on semiconductor wafer A conformal, substantially uniform thickness layer of photoresist is deposited on a semiconductor wafer by causing photoresist solids to "sediment" out of solution or suspension. Generally, the more conformal the layer, the more uniform the reflectance of... | 03/10/1998 |
| 5721150 | Use of silicon for integrated circuit device interconnection by direct writing of patterns therein An apparatus and method wherein conductive patterns are written in amorphous silicon or polysilicon deposited on an integrated circuit and used for interconnecting circuit elements contained therein. The substantially pure amorphous silicon or polysilicon... | 02/24/1998 |
| 5709091 | Refrigerant recovery and recycling method and apparatus A portable refrigerant recovery and recycling system for removing and recycling chloroflourocarbon (CFC), hydroflourocarbon (HFC) and hydrochloroflourocarbon (HCFC) refrigerants from refrigeration systems. Closed loop interconnection prevents release of r... | 01/20/1998 |
| 5701331 | Differential signal receiver A differential signal receiver circuit includes a first differential stage receiving input differential signals, a second differential stage receiving shifted differential signals and summing stage summing outputs of the first and second differential stag... | 12/23/1997 |
| 5700715 | Process for mounting a semiconductor device to a circuit substrate A process for mounting one or more dies a substrate, such as by ball-bumps. In one embodiment, a thin layer of heat-reflective material, such as gold, is disposed over the surface of the die facing the substrate, to shield the substrate from heat generate... | 12/23/1997 |
| 5696403 | System having input-output drive reduction An electronic system utilizing at least one integrated circuit that has reduced drive requirements for the input and output pads of the integrated circuit die. The integrated circuit of the system has an intermediate structure added between the output con... | 12/09/1997 |
| 5692296 | Method for encapsulating an integrated circuit package The present invention provides a method for fabricating an integrated circuit package, as well the resulting integrated circuit package, which retains a heatsink in close communication with a mold cavity. This precludes any encapsulant from flowing betwee... | 12/02/1997 |
| 5675260 | Electrostatic discharge test structure system and method System and method for optimizing the structure of a transistor to withstand electrostatic discharge by quantitatively evaluating the amount of electrostatic discharge that integrated circuit field effect transistors may endure before material damage resul... | 10/07/1997 |
| 5666289 | Flexible design system A system for designing an integrated circuit with multiple functions is disclosed. The system creates a set of files defining a structure for a plurality of functions existing within one integrated circuit. Floorplanning modifications are then permissible... | 09/09/1997 |
| 5663967 | Defect isolation using scan-path testing and electron beam probing in multi-level high density asics A method and apparatus for isolating faults in an integrated circuit reduces time and effort to precisely locate such faults. A fault dictionary is developed, which is a record of the errors a circuit's modeled faults are expected to cause. The fault dict... | 09/02/1997 |
| 5655496 | Compact internal combustion engine An engine which employs a cam follower mechanism to reduce wear and reduce the size of an assembled engine. The cam follower mechanism utilizes guide rails located to reduce side thrust on the valve stem. The engine employs a high speed quill shaft to syn... | 08/12/1997 |
| 5644143 | Method for protecting a semiconductor device with a superconductive line Various techniques for forming superconductive lines are described whereby superconductive lines can be formed by stamping, etching, polishing, or by rendering selected areas of a superconductive film (layer) non-superconductive. The superconductive mater... | 07/01/1997 |
| 5644102 | Integrated circuit packages with distinctive coloration A technique is described for providing body coloration and colored indicia for indicating one or more characteristics of an integrated circuit device. Package body coloration is one source of information about device characteristics. Other indications rel... | 07/01/1997 |
| 5643835 | Process for manufacturing and mounting a semiconductor device leadframe having alignment tabs A process of mounting a semiconductor device and leadframe to a printed circuit board are described. The device has a body, and a plurality of leads extending from the body. One or more alignment features are formed on the exterior of the package body, fo... | 07/01/1997 |
| 5643830 | Process for manufacturing off-axis power branches for interior bond pad arrangements A technique for improving power distribution to an semiconductor die while simultaneously reducing thermally-induced mechanical stresses on bond pads in semiconductor device assemblies is accomplished by providing the signal-carrying bond pads in a collin... | 07/01/1997 |
| 5636868 | Apparatus for holding reading material binder A holder apparatus acts in frictional cooperation with books, notebooks, folders, and other hand held rigid or semi-rigid binders containing reading material. The bolder allows one-handed manipulation of the book, notebook, folder, or binder free of accid... | 06/10/1997 |
| 5635424 | High-density bond pad layout arrangements for semiconductor dies, and connecting to the bond pads Composite bond pad structure and geometry increases bond pad density and reduces lift-off problems. Bond pad density is increased by laying out certain non-square bond pads which are shaped, sized and oriented such that each bond pad closely conforms to t... | 06/03/1997 |
| 5626715 | Methods of polishing semiconductor substrates Methods of polishing, particularly chem-mech polishing a semiconductor substrate to planarize a layer, to remove excess material from atop a layer, and to strip back a defective layer are disclosed. Aluminum oxide particles having a small, well controlled... | 05/06/1997 |
| 5625563 | Method and system for reducing the number of connections between a plurality of semiconductor devices Serial high speed interconnect devices are integrated with semiconductor devices to reduce the number of input-output pins required for communications and control between a plurality of semiconductor devices. The serial high speed interconnect devices tra... | 04/29/1997 |
