Bizarre Patents
A gun that fires a missile, powered by gas "discharged by the operator of the toy."
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 6051503 | Method of surface treatment of semiconductor substrates This invention relates to methods for treatment of semiconductor substrates and in particular a method of etching a trench in a semiconductor substrate in a reactor chamber using alternatively reactive ion etching and depositing a passivation layer by che... | 04/18/2000 |
| 5957654 | Lead frame unloading tool having sliding blocks A lead frame unloading apparatus includes a pair of opposing plate members, one of which has a long horizontal slit. The opposing plate members define a central space where one or more sliding blocks are located, each of the sliding blocks having a vertic... | 09/28/1999 |
| 5958966 | Treatment of aberrant cellular states with biomodulators Biomodulators, which regulate cellular differentiation and proliferation, as well as methods of use thereof, e.g., for treating various conditions, e.g., cancer, senescence, immunological disorders and vascular disease; for stimulating normal tissue archi... | 09/28/1999 |
| 5956287 | Semiconductor memory The present invention provides a semiconductor memory capable of improving a write address generator which performs complained control by using many gates and capable of reducing layout area. A FIFO semiconductor memory having plural input ports is provid... | 09/21/1999 |
| 5953579 | In-line test of contact opening of semiconductor device A method for testing a contact opening of a semiconductor device includes the steps of: inspecting a wafer using an in-line scanning electron microscope, comparing a contrast difference of contact opening regions displayed on the scanning electron microsc... | 09/14/1999 |
| 5948690 | Pretreatment system for analyzing impurities contained in flat sample A pretreatment system for analyzing impurities contained in a flat sample contains a cylindrical lower case having a stepped portion on which the flat sample is seated. The stepped portion is formed in an circumferential inner surface of the cylindrical l... | 09/07/1999 |
| 5947134 | Scrubbing equipment for a semiconductor device using laser distance sensor to automatically adjust brush height above the wafer Scrubbing equipment for semiconductor devices includes an automatic brush-height adjustment device for automatically adjusting the height of a brush over a wafer surface so that eddy currents are produced in a layer of water on the wafer and minute partic... | 09/07/1999 |
| 5949797 | Microcontroller test circuit A microcontroller test circuit having a plurality of pins includes first circuit for determining whether the microcontroller is in a normal mode or a test mode by sensing the potential of an input test signal; and second circuit for selectively opening a ... | 09/07/1999 |
| 5943548 | Method of analyzing a wafer in a semiconductor device fabrication process A method of analyzing a wafer in a semiconductor device fabrication process, includes the steps of: loading a wafer into a vacuum chamber where the vacuum pressure is maintained at a predetermined level; locating coordinates of a specific portion of the w... | 08/24/1999 |
| 5938308 | Projection pointer An improved optical system is disclosed for projecting light in the form of an image to a remote target. The laser light source and a holographic optical element are mounted together in optical alignment. The optical element is created using iterative dis... | 08/17/1999 |
| 5928425 | Chemical catcher This chemical catcher is provided to collect chemical materials in the manufacturing process of the semiconductor device. In particular, this collects the remaining chemical materials for preventing the undesirable effects incurred by the remaining chemic... | 07/27/1999 |
| 5923553 | Method for controlling a semiconductor manufacturing process by failure analysis feedback A method for controlling a semiconductor manufacturing process by failure analysis feedback compares a previous failure analysis result with current real-time process conditions. The method uses the steps of: a) establishing a monitoring data base with ab... | 07/13/1999 |
| 5923957 | Process for manufacturing a lead-on-chip semiconductor device package having a discontinuous adhesive layer formed from liquid adhesive A lead-on-chip semiconductor device package is formed by attaching a lead frame to the chip with a discontinuous adhesive layer. Electrode pads of the chip are electrically connected by bonding wires and mechanically connected by the adhesive layer to the... | 07/13/1999 |
| 5920519 | Semiconductor memory with sensing stability A memory having a read function for generating a plurality of data bits on a single output pin includes a control circuit, a sense amplifier circuit, and a decoder. The control circuit generates a decoder control pulse responding to the control pulse gene... | 07/06/1999 |
| 5906807 | Method of MRI using biomodulators Biomodulators, optionally linked to imaging-active moieties, can be administered to a host to enhance images thereof, e.g., NMR-, X-ray- or radio-images, preferably by increasing aberrant tissue signal intensity. Biomodulators can also condition tissue to... | 05/25/1999 |
| 5903543 | Apparatus and method of preventing cell data loss during clock switching In a clock system having active and standby clocks for synchronizing cell data flow in a data system, and for preventing cell data loss during active to standby clock switching, a prevent circuit maintains the active clock cycle signal during the active/s... | 05/11/1999 |
| 5901716 | Wafer cleaning apparatus with rotating cleaning solution injection nozzles A wafer cleaning apparatus includes at least one nozzle fixing tube disposed in a wall of a cleaning bath. A plurality of injection nozzles are arranged on the nozzle fixing tube for spraying a compressed cleaning solution toward the wafer. A rotating dev... | 05/11/1999 |
| 5903510 | Address decoder, semiconductor memory and semiconductor device For making it more difficult to predict which signal line among second signal lines 330 to 337 is conductive in accordance with address designation signals A0 to A3. Address decoder comprises a switching device 35 which is arranged s... | 05/11/1999 |
| 5900787 | Dual-mode, crystal resonator/external clock, oscillator circuit An oscillator circuit, having an inverter with input and output terminals interconnected through a feedback resistance, operates in two modes. In a first mode, the input and output terminals are coupled to an external crystal resonator. In a second mode, ... | 05/04/1999 |
| 5899729 | Method and apparatus for the manufacture of a semiconductor integrated circuit device having discontinuous insulating regions A semiconductor wafer having an active surface separated into device regions with semiconductor chips formed thereon and scribe regions formed between the device regions. The wafer includes an insulating layer formed on the active surface in the device re... | 05/04/1999 |
| 5896674 | Dry cleaner for wafer carriers A dry cleaner easily and rapidly eliminates particles and dirt adhered to interior surfaces of the wafer carrier. The dry cleaner has a housing with a table mounted thereon, and an assembly for cleaning the wafer carriers disposed on the table. The cleani... | 04/27/1999 |
| 5897883 | Mold having projections for inhibiting the formation of air pockets A mold for encapsulating semiconductor device packages provides improved reliability by reducing air traps in the encapsulant. The mold has an upper mold die and a lower mold die which together form a cavity where the package is encapsulated by the moldin... | 04/27/1999 |
| 5894245 | Operational amplifier An operational amplifier includes a differential amplifier portion for amplifying input signals and having an amplification path defined by plural series connected first switching devices extending between a supply and a ground, each of said first switchi... | 04/13/1999 |
| 5894213 | Semiconductor integrated circuit having a plurality of flip-flops A semiconductor integrated circuit is activated to allow a plurality of FFs 1 incorporated therein to latch data therein. Thereafter, the semiconductor integrated circuit is switched to test mode connections. Upon the test mode connections, for example, F... | 04/13/1999 |
| 5893508 | Circuit board having a terminal for detecting disconnection of a bonding wire and a wire bonding apparatus using such a board A circuit board for detecting disconnection of a bonding wire, includes a circuit board body; a pattern layer having a die pad region formed on an upper surface of the circuit board body for mounting a semiconductor chip thereon, and respective conductive... | 04/13/1999 |
| 5893380 | Method for cleaning molding compound tablets A method for cleaning molding compound tablets while the molding compound tablets are transferred from a tablet container to a molding equipment for encapsulating a microelectronic device. The method includes the steps of loading the molding compound tabl... | 04/13/1999 |
| 5894107 | Chip-size package (CSP) using a multi-layer laminated lead frame A method for manufacturing a chip-size package and the chip-size package produced by the method uses first and second lead frames which are prepared by a stamping process. The first lead frame has leads with receiving parts, and the leads are integrally f... | 04/13/1999 |
| 5893050 | Method for correcting thin-film formation program of semiconductor device and thickness measuring apparatus therefor A method for correcting a thin-film formation program of semiconductor device includes the steps of measuring a thin-film thickness formed by thin-film formation equipment controlled by a thin-film formation program while cooling a wafer on which a thin-f... | 04/06/1999 |
| 5892225 | Method of preparing a plan-view sample of an integrated circuit for transmission electron microscopy, and methods of observing the sample A plan-view sample of an integrated circuit is prepared for transmission electron microscopy by marking a faulty circuit element, lapping the upper surface of the sample to a mirror finish, lapping the lower surface to reduce the thickness of the entire s... | 04/06/1999 |
| 5890502 | Apparatus and method for cleaning semiconductor devices without leaving water droplets A,method and an apparatus for cleaning semiconductor devices, in which water droplets are completely eliminated after the wafer is cleaned in the course of the semiconductor manufacturing process. In the method and apparatus, after the thin film is cleane... | 04/06/1999 |
| 5890367 | Air conditioning system for semiconductor clean room including a chemical filter downstream of a humidifier An air conditioning system for a semiconductor clean room includes a chemical filter between an air conditioner including a humidifier and a ULPA filter of the clean room, for ionizing chemical impurities using moisture supplied from the humidifier and th... | 04/06/1999 |
| 5892240 | Wafer sensing apparatus for sensing wafer insertion A wafer sensing apparatus for sensing whether a wafer is inserted in a wafer cassette. The wafer sensing apparatus includes a light emitting device for emitting light of a predetermined wavelength toward the inside of a wafer cassette, a light sensing dev... | 04/06/1999 |
| 5889533 | First-in-first-out device for graphic drawing engine A first-in-first-out (FIFO) device for a graphic drawing engine is provided. The (FIFO) device is connected to both a pipeline having a plurality of data processing devices for receiving graphic data from a graphic drawing engine and a drawing engine cont... | 03/30/1999 |
| 5889282 | Analytical method of auger electron spectroscopy for insulating sample A method of Auger Electron Spectroscopic (AES) analysis for a surface of an insulating sample. The method is characterized by performing an AES analysis after depositing a conductive layer of a designated thickness on the surface of a sample containing an... | 03/30/1999 |
| 5886405 | Semiconductor device package having inner leads with slots A semiconductor device package includes a semiconductor chip and a plurality of inner leads, each having at least one slot formed along an upper surface of the inner lead. An adhesive layer is used to attach a bottom surface of the semiconductor chip to t... | 03/23/1999 |
| 5885355 | Semiconductor fabrication apparatus with a handler A semiconductor fabrication apparatus having a process chamber and a handler which is provided for loading wafers into the process chamber or unloading wafers therefrom, comprising a plurality of switches for detecting positions of the handler and for gen... | 03/23/1999 |
| 5883540 | Electrostatic protection circuit of an input/output circuit of a semiconductor device An electrostatic protection circuit in a internal circuit isolated from a substrate bias which protects the internal circuit from static electricity with regard to any of three different sources of bias voltage. An electrostatic protection circuit is cons... | 03/16/1999 |
| 5880355 | Apparatus for measuring contamination particles during the manufacture of semiconductor devices An apparatus and a method of measuring contamination particles generated during manufacturing of semiconductor devices and an analysis method therefor are described. The apparatus for measuring contamination particles has a regulator for controlling the f... | 03/09/1999 |
| 5880514 | Protection circuit for semiconductor device A protection circuit for a semiconductor device, the protection circuit being connected an input terminal of the semiconductor device in parallel with an internal circuit proper of the semiconductor device, comprising a semiconductor substrate having one ... | 03/09/1999 |
| 5876509 | Cleaning solution for cleaning semiconductor device and cleaning method using the same A cleaning solution of a semiconductor device is composed of aqueous ammonia (NH4 OH), methanol (CH3 OH), hydrofluoric acid (HF) and deionized water (DI--H2 O), the volume ratio of NH4 OH to CH3 OH to... | 03/02/1999 |
