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Actor Marlon Brando has four patents, all named "Drumhead tensioning device and method."
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| Number | Title | Issue Date |
| 8304922 | Semiconductor package system with thermal die bonding A semiconductor package system includes providing a substrate having a plurality of thermal vias extending through the substrate. A solder mask is positioned over the plurality of thermal vias. A plurality of thermally conductive bumps is formed on at least some of ... | 11/06/2012 |
| 8304921 | Integrated circuit packaging system with interconnect and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes: providing a planar support structure having a cavity; forming a terminal within the cavity with the terminal coplanar with the planar support structure; forming a conductive pathway on the t... | 11/06/2012 |
| 8304919 | Integrated circuit system with stress redistribution layer and method of manufacture thereof A method of manufacture of an integrated circuit system includes: providing a substrate having a transistor and a metallization layer; forming a metal pad in direct contact with the metallization layer of the substrate; forming a passivation layer in direct contact ... | 11/06/2012 |
| 8304900 | Integrated circuit packaging system with stacked lead and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching an integrated circuit device to the substrate; forming a stud interconnect having stacked studs, the stud interconnect on the substrate and having a contact ... | 11/06/2012 |
| 8304898 | Integrated circuit package system with overhang film An integrated circuit package system includes: connecting a first interconnect between a carrier and a bottom integrated circuit thereover; forming a film, having an overhang portion, over the bottom integrated circuit with the overhang portion over the first interc... | 11/06/2012 |
| 8304880 | Integrated circuit packaging system with package-on-package and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes: providing a bottom substrate; mounting a bottom integrated circuit over the bottom substrate; mounting a top substrate over a side of the bottom integrated circuit opposite the bottom substr... | 11/06/2012 |
| 8304874 | Stackable integrated circuit package system A stacked integrated circuit package-in-package system is provided including forming a first external interconnect; mounting a first integrated circuit die below the first external interconnect; stacking a second integrated circuit die over the first integrated circ... | 11/06/2012 |
| 8304869 | Fan-in interposer on lead frame for an integrated circuit package on package system An integrated circuit package on package system includes: providing a lead having a wire-bonded die with a bond wire connected thereto; mounting a fan-in interposer over the wire-bonded die and the bond wire; connecting the fan-in interposer to the lead with the bon... | 11/06/2012 |
| 8304834 | Semiconductor local interconnect and contact An integrated circuit is provided. A gate dielectric and a gate are provided respectively on and over a semiconductor substrate. A junction is formed adjacent the gate dielectric and a shaped spacer is formed around the gate. A spacer is formed under the shaped spac... | 11/06/2012 |
| 8304337 | Integrated circuit packaging system with bond wire pads and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes: forming a device over a substrate including a bond wire pad row located between a perimeter of the substrate and the device; configuring the bond wire pad row to include three sided bond wir... | 11/06/2012 |
| 8304296 | Semiconductor packaging system with multipart conductive pillars and method of manufacture thereof A method of manufacture of a semiconductor packaging system includes: providing a substrate; mounting a semiconductor chip to the substrate; mounting a pillar ball having a ball height electrically connected to the substrate; mounting an interposer above the semicon... | 11/06/2012 |
| 8304286 | Integrated circuit packaging system with shielded package and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes: providing a substrate assembly having a connection path; mounting a base device over the substrate assembly with a mount layer; mounting a stack device over the base device and having a stac... | 11/06/2012 |
| 8303410 | Navigation system having preference region adjustment mechanism and method of operation thereof A method of operation of a navigation system includes: receiving a game search preference; locating a compliant opponent location conformant to the game search preference; identifying a first preference region encompassing the compliant opponent location; locating a... | 11/06/2012 |
| 8299596 | Integrated circuit packaging system with bump conductors and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes: providing a base substrate having a component side; mounting a base device having a base circuit connector directly on the component side; attaching conformal interconnects, having the same ... | 10/30/2012 |
| 8299595 | Integrated circuit package system with package stacking and method of manufacture thereof A method of manufacture of an integrated circuit package system includes: forming a base package including: fabricating a base package substrate having a component side and a system side, coupling a first integrated circuit die to the component side, and coupling st... | 10/30/2012 |
| 8293584 | Integrated circuit package system with filled wafer recess An integrated circuit package system is provided including forming a wafer having a back side and an active side, forming a recess in the wafer from the back side, forming a cover in the recess, and singulating the wafer at the recess filled with the cover. ... | 10/23/2012 |
| 8293546 | Integrated circuit system with sub-geometry removal and method of manufacture thereof A method of manufacture of an integrated circuit system includes: forming reticle data; detecting a sub-geometry, a singularity, or a combination thereof in the reticle data; applying a unit cell, a patch cell, or a combination thereof for removing the sub-geometry,... | 10/23/2012 |
| 8288860 | Memory device system with stacked packages An integrated circuit package system includes: providing a base package of an elongated rectangular-box shape containing first electrical circuitry and including: forming a rectangular contact strip on and adjacent to a first end of the base package; and forming a b... | 10/16/2012 |
| 8288844 | Integrated circuit packaging system with package stacking and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes forming a lead frame including providing a tie bar plate, forming conductive columns on the tie bar plate, forming a dielectric layer on the conductive columns, applying a conductive shield l... | 10/16/2012 |
| 8288205 | Package in package system incorporating an internal stiffener component The present invention is a method of manufacture of a package-in-package system, comprising: providing a bottom internal stacking module incorporating a semiconductor die and a package substrate, attaching an internal stiffening module, with a die receptacle, on the... | 10/16/2012 |
| 8283193 | Integrated circuit system with sealring and method of manufacture thereof A method of manufacture an integrated circuit system includes: forming an insulation region in a base layer; filling an insulator in the insulation region around a perimeter of a main chip region; forming a contact directly on and within planar extents of the insula... | 10/09/2012 |
| 8278141 | Integrated circuit package system with internal stacking module An integrated circuit package system includes: fabricating an integrated circuit substrate; forming an internal stacking module coupled to the integrated circuit substrate including: forming a flexible substrate, coupling a stacking module integrated circuit to the ... | 10/02/2012 |
| 8274145 | Semiconductor package system with patterned mask over thermal relief A semiconductor package system including: providing a substrate having a thermal relief thereon; depositing a mask on the substrate and the thermal relief, the mask deposited on the thermal relief and having a regular pattern to partially cover the thermal relief; a... | 09/25/2012 |
| 8273607 | Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes: providing a package carrier having a dispense port; attaching an integrated circuit to the package carrier and over the dispense port; placing a mold chase over the integrated circuit and on... | 09/25/2012 |
| 8273602 | Integrated circuit package system with integration port An integrated circuit package system comprising: fabricating a package base including: forming a lead frame, coupling a first integrated circuit device under the lead frame, coupling a second integrated circuit device over the first integrated circuit device, and mo... | 09/25/2012 |
| 8270176 | Exposed interconnect for a package on package system An integrated circuit package system includes: providing a substrate; mounting an integrated circuit above the substrate; connecting an interposer to the integrated circuit with a wire-in-film adhesive; connecting an exposed interconnect having an upper surface to t... | 09/18/2012 |
| 8269356 | Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates A semiconductor package has a semiconductor die disposed on a substrate. A bond wire is connected between a first bonding site on the semiconductor die and a second bonding site on the substrate. The first bonding site is a die bond pad; the second bonding site is a... | 09/18/2012 |
| 8269324 | Integrated circuit package system with chip on lead An integrated circuit package system includes: providing a lead having a lead connection surface for connectivity to a next level system; attaching an integrated circuit over the lead having the lead connection surface substantially within a region below a perimeter... | 09/18/2012 |
| 8269320 | Integrated circuit package system for electromagnetic isolation and method for manufacturing thereof A method for manufacturing an integrated circuit package system includes: providing a lead frame; forming an integrated circuit package including the lead frame; providing a selectively exposed area on the lead frame; and coating a conductive shielding layer on the ... | 09/18/2012 |
| 8265421 | Video system with blocking artifact two-dimensional cross filtering A video system includes: analyzing video data, having a block; performing a transition change detection for determining a spatial intensity transition within the block; performing a block-wise similarity measurement on the block in the video data for identifying a b... | 09/11/2012 |
| 8264091 | Integrated circuit packaging system with encapsulated via and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit over the substrate; attaching a buffer interconnect to and over the substrate; forming an encapsulation over the substrate covering the ... | 09/11/2012 |
| 8258614 | Integrated circuit package system with package integration An integrated circuit package system comprising: providing a substrate having a cavity; sealing a package over the cavity of the substrate; and forming an encapsulant over the package and a portion of the substrate substantially preventing the encapsulant from formi... | 09/04/2012 |
| 8258612 | Encapsulant interposer system with integrated passive devices and manufacturing method therefor A method of manufacturing a semiconductor package system includes: forming a leadframe having a passive device; encapsulating the passive device to form an encapsulant interposer; attaching a first die to the encapsulant interposer; forming a substrate interposer ha... | 09/04/2012 |
| 8258609 | Integrated circuit package system with lead support An integrated circuit package system is provided including forming a paddle having an integrated circuit die thereover, an outer lead, and an inner lead between the paddle and the outer lead. The integrated circuit package system is also provided including placing a... | 09/04/2012 |
| 8258015 | Integrated circuit package system with penetrable film adhesive An integrated circuit package system including: providing a wire bonded die with an active side and a bond wire connected thereto; forming a penetrable film adhesive on the active side and partially encapsulating the bond wire; mounting an interposer, having a first... | 09/04/2012 |
| 8258008 | Package-on-package system with via z-interconnections and method for manufacturing thereof A method for manufacturing a package-on-package system includes: providing an interposer substrate; mounting a base substrate under the interposer substrate and having a first integrated circuit die connected thereto; forming an encapsulant between the interposer su... | 09/04/2012 |
| 8256660 | Semiconductor package system with fine pitch lead fingers and method of manufacturing thereof A semiconductor package system, and method of manufacturing thereof, includes: a die having a contact pad; a lead finger having a substantially trapezoidal cross-section; a bump clamped on a top and a side of the lead finger, the bump connected to the contact pad; a... | 09/04/2012 |
| 8252634 | Integrated circuit packaging system with a leadframe having radial-segments and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes: providing inwardly converging leadfingers having continuously decreasing widths along lengths thereof to inward ends thereof; electrically connecting an integrated circuit device on the lead... | 08/28/2012 |
| 8252615 | Integrated circuit package system employing mold flash prevention technology An integrated circuit package system that includes: providing a support structure including an integrated circuit and an electrical contact adjacent thereto; providing a first mold having a first cavity with a projection and a recess for collecting flash; engaging t... | 08/28/2012 |
| 8247894 | Integrated circuit package system with step mold recess An integrated circuit package system includes: providing a stackable integrated circuit package system having a base encapsulation and a recess therein; stacking a top integrated circuit package system, having a top encapsulation with a protruding portion, with the ... | 08/21/2012 |
