Bizarre Patents
A new toilet tank assembly aquarium for housing aquatic creatures.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8183675 | Integrated circuit package-on-package system with anti-mold flash feature An integrated circuit package-on-package system includes: mounting an integrated circuit package system having a mountable substrate over a package substrate with the mountable substrate having a mold structure; forming a package encapsulation having a recess over t... | 05/22/2012 |
| 8183089 | Method for manufacturing package system incorporating flip-chip assembly A method for manufacturing a package system includes: providing a first semiconductor die; mounting a second semiconductor die on the first semiconductor die using an inter-die interconnect to form a flip-chip assembly; and attaching the flip-chip assembly on a pack... | 05/22/2012 |
| 8179259 | Radio frequency identification system A radio frequency identification system includes: supplying a radio frequency identification tag including providing a radio frequency identification transponder and writing transponder content to the radio frequency identification transponder; and feeding the radio... | 05/15/2012 |
| 8178982 | Dual molded multi-chip package system A dual molded multi-chip package system is provided including forming an embedded integrated circuit package system having a first encapsulation partially covering a first integrated circuit die and a lead connected thereto, mounting a semiconductor device over the ... | 05/15/2012 |
| 8178956 | Integrated circuit package system for shielding electromagnetic interference An integrated circuit package system includes: providing a substrate; coupling an integrated circuit to the substrate; mounting a shielding element around the integrated circuit; applying a conductive shielding layer on the shielding element; and coupling a system i... | 05/15/2012 |
| 8178394 | Quad flat pack in quad flat pack integrated circuit package system and method for manufacturing thereof A method for manufacturing an integrated circuit package system includes: providing a base package having a first integrated circuit with an inner lead on a periphery thereof and connected thereto with interconnects, and the inner lead partially encapsulated by an i... | 05/15/2012 |
| 8178392 | Electronic system with expansion feature An electronic system is provided including forming a substrate having a radiating patterned pad, mounting an electrical device having an external interconnect over the radiating patterned pad with the external interconnect offset from the radiating patterned pad, an... | 05/15/2012 |
| 8176093 | Customizable information management system A method for managing information includes: forming a meta data structure containing first information; forming an application data structure containing second information; establishing an association between the meta data structure and the application data structur... | 05/08/2012 |
| 8174127 | Integrated circuit package system employing device stacking A method of manufacturing an integrated circuit packaging system includes: providing an inner lead and an outer lead, the inner lead having an inner peripheral side with a non-linear contour; forming a bump contact, having a groove in and a mesa from the inner lead ... | 05/08/2012 |
| 8174120 | Integrated circuit package system with leadframe substrate An integrated circuit package system is provided. A dual-type leadframe having first and second rows of leads is formed. A first row of bumps is formed on an integrated circuit chip. Solder paste is placed on the first row of leads, and the first row of bumps is pre... | 05/08/2012 |
| 8169064 | Nested integrated circuit package on package system A package on package system is provided including providing a first substrate having a first integrated circuit thereon and a second substrate having a second integrated circuit thereon, the second substrate having a recess provided therein. The first and second sub... | 05/01/2012 |
| 8164182 | Hyper thermally enhanced semiconductor package system comprising heat slugs on opposite surfaces of a semiconductor chip A semiconductor package system is provided including mounting a semiconductor chip to a substrate having a substrate opening. A first heat slug is attached to a first surface of the semiconductor chip at least partially encapsulating the semiconductor chip. A second... | 04/24/2012 |
| 8164172 | Integrated circuit package in package system An integrated circuit package in package system includes: a base integrated circuit package with a base lead substantially coplanar with a base die paddle and having a portion with a substantially planar base surface; an extended-lead integrated circuit package with... | 04/24/2012 |
| 8163604 | Integrated circuit package system using etched leadframe An integrated circuit package system includes a conductive substrate. A heat sink and a plurality of leads are etched in the substrate to define a conductive film connecting the heat sink and the plurality of leads to maintain their spatial relationship. A die is at... | 04/24/2012 |
| 8163600 | Bridge stack integrated circuit package-on-package system A bridge stack integrated circuit package-on-package system is provided including forming a first integrated circuit package system having a first substrate, forming a second integrated circuit package system having a second substrate, and mounting a bridge integrat... | 04/24/2012 |
| 8160606 | Mobile location sharing system A mobile location sharing system comprising: enabling a sender wireless device to send a payload including a location descriptor and a list of target identifiers to a group of targets; identifying a preferred communication mode for each in the group of targets; sele... | 04/17/2012 |
| 8158513 | Integrated circuit system employing backside energy source for electrical contact formation A method for manufacturing an integrated circuit system includes: providing a first material; forming a second material over a first side of the first material; and exposing a second side of the first material to an energy source to form an electrical contact at an ... | 04/17/2012 |
| 8148825 | Integrated circuit package system with leadfinger An integrated circuit package system includes: providing a lead terminal; forming a dummy lead near the lead terminal; positioning a base integrated circuit adjacent the lead terminal and the dummy lead; connecting a die connector to the base integrated circuit and ... | 04/03/2012 |
| 8148208 | Integrated circuit package system with leaded package and method for manufacturing thereof A method for manufacturing an integrated circuit package system includes: providing a frame; attaching a leaded package having leads adjacent the frame wherein the leads extend towards a side opposite the frame; and applying a package encapsulant over the leaded pac... | 04/03/2012 |
| 8143711 | Integrated circuit package system with offset stacking and anti-flash structure An integrated circuit package system includes: a carrier; a device structure in an offset location over the carrier with the device structure having a bond pad and a contact pad; an electrical interconnect between the bond pad and the carrier; an anti-flash structur... | 03/27/2012 |
| 8143107 | Integrated circuit packaging system substrates and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes: forming a substrate including: patterning a bonding pad on the substrate, patterning a first signal trace coupled to the bonding pad, patterning a second signal trace on the substrate, and c... | 03/27/2012 |
| 8143104 | Method for manufacturing ball grid array package stacking system A method for manufacturing a ball grid array package stacking system includes: providing a base substrate; coupling an integrated circuit to the base substrate; coupling a stacking substrate over the base substrate; mounting a heat spreader, having an access port, a... | 03/27/2012 |
| 8143103 | Package stacking system with mold contamination prevention and method for manufacturing thereof A method for manufacturing a package stacking system includes: providing a package substrate; mounting an integrated circuit over the package substrate; forming a step-down interposer over the integrated circuit; and molding a stack package body, having a step profi... | 03/27/2012 |
| 8143102 | Integrated circuit package system including die having relieved active region An integrated circuit package system includes: providing a substrate; attaching a base die to the substrate, the base die having a relief region with a shaped cross-section; and connecting a bond wire between an active base surface of the base die and the substrate,... | 03/27/2012 |
| 8143098 | Integrated circuit packaging system with interposer and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes: providing an interposer having device contacts, interconnect contacts, and test pads including the interconnect contacts along an interconnect perimeter region of the interposer, the device ... | 03/27/2012 |
| 8143096 | Integrated circuit package system flip chip An integrated circuit package system includes: providing a substrate having a top side with a trace conductor connected to a bottom side with a system interconnect; forming a bump ring on the substrate, the bump ring having an inner cavity area over the trace conduc... | 03/27/2012 |
| 8141247 | Method of a package on package packaging A method of manufacture of an integrated circuit package-on-package system includes providing a base package and providing solder caps on the top of the base package configured to protrude above subsequent resin bleed, the resin bleed extending to an edge of the bas... | 03/27/2012 |
| 8138595 | Integrated circuit packaging system with an intermediate pad and method of manufacture thereof A method of manufacture of an integrated circuit packaging system includes: forming an elevated contact above and between a lead and a die pad that is coplanar with the lead; connecting an integrated circuit and the lead; attaching a jumper interconnect between the ... | 03/20/2012 |
| 8138591 | Integrated circuit package system with stacked die An integrated circuit package system comprising forming a trace frame including: fabricating a sacrificial substrate; forming a first series of bonding pads along a length of the sacrificial substrate; forming a second series of the bonding pads along a width of the... | 03/20/2012 |
| 8138590 | Integrated circuit package system with wire-in-film encapsulation An integrated circuit package system includes: connecting a carrier and an integrated circuit mounted thereover; preforming a wire-in-film encapsulation having a cavity; pressing the wire-in-film encapsulation over the carrier and the integrated circuit with the cav... | 03/20/2012 |
| 8138586 | Integrated circuit package system with multi-planar paddle An integrated circuit package system includes a multi-planar paddle having an uplift rim and an attached integrated circuit over the uplift rim of the multi-planar paddle. ... | 03/20/2012 |
| 8138080 | Integrated circuit package system having interconnect stack and external interconnect An integrated circuit package system is provided forming an integrated circuit die having a first bond pad provided thereon, forming an interconnect stack on a first external interconnect, and connecting the interconnect stack to the first bond pad. ... | 03/20/2012 |
| 8138051 | Integrated circuit system with high voltage transistor and method of manufacture thereof A method of manufacture of an integrated circuit system includes: providing a semiconductor substrate having an active region, implanted with impurities of a first type at a first concentration; forming an isolation region around the active region; forming a parasit... | 03/20/2012 |
| 8138024 | Package system for shielding semiconductor dies from electromagnetic interference A method of manufacturing a package system includes: providing a semiconductor die with a contact pad and a ground pad, mounting the semiconductor die on a package substrate using and adhesive layer, forming a vertical conductive structure on top of the ground pad i... | 03/20/2012 |
| 8138017 | Integrated circuit package system with through semiconductor vias and method of manufacture thereof A method of manufacture of an integrated circuit package system includes: providing a package substrate; mounting a first integrated circuit die, having through silicon vias, on the package substrate; coupling cylindrical studs to the package substrate adjacent to t... | 03/20/2012 |
| 8134242 | Integrated circuit package system with concave terminal An integrated circuit package system includes: connecting a concave terminal and an integrated circuit; and forming an encapsulation, having a bottom side, over the integrated circuit and the concave terminal with the concave terminal within the encapsulation. ... | 03/13/2012 |
| 8134227 | Stacked integrated circuit package system with conductive spacer A stacked integrated circuit package system is provided including providing a first device and a second device with the first device, the second device, or a combination thereof having an integrated circuit die; forming a conductive spacer structure over the first d... | 03/13/2012 |
| 8134211 | Triggered silicon controlled rectifier for RF ESD protection An ESD protection circuit has a polysilicon bounded SCR connected between a signal input/output interface contact of the integrated circuit and a power supply connection of the integrated circuit and a biasing circuit. The biasing circuit is connected to the polysil... | 03/13/2012 |
| 8134196 | Integrated circuit system with metal-insulator-metal circuit element An integrated circuit system is provided including forming a substrate, forming a first contact having multiple conductive layers over the substrate and a layer of the multiple conductive layers on other layers of the multiple conductive layers, forming a dielectric... | 03/13/2012 |
| 8130512 | Integrated circuit package system and method of package stacking A method of manufacturing an integrated circuit package system including: providing a circuit board having an interconnect thereon; mounting a first device offset on the circuit board; and applying a first encapsulant of a first thickness over the first device, the ... | 03/06/2012 |
