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"That the automobile has practically reached the limit of its development is suggested by the fact that during the past year no improvements of a radical nature have been introduced."
Scientific American ; Jan. 2 edition, 1909
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| Number | Title | Issue Date |
| 7630601 | Connecting a component with an embedded optical fiber The invention provides an optical connection between a component on a printed circuit board (“PCB”) and an optical fiber embedded in the PCB. By optically connecting the component with the optical fiber, the component may use the optical fiber for high speed opt... | 12/08/2009 |
| 7609562 | Configurable device ID in non-volatile memory Various embodiments of the invention may use one or more programmable non-volatile registers in each memory device to provide a separate device address for that device. These registers may be programmed at various points in the manufacturing and distribution cycle, ... | 10/27/2009 |
| 7583608 | Link adaption based MMSE equalization eliminates noise power estimation Coefficients for an Minimum Mean Square Error (MMSE) equalizer may be generated without the receiver performing noise power estimation. The noise power may be inferred from knowledge of the Modulation and Coding Scheme (MCS) that is selected by the link adaptation s... | 09/01/2009 |
| 7580364 | Apparatus, system and method capable of recovering from disjoint clusters in an mesh network An embodiment of the present invention provides an apparatus, comprising a transceiver capable of recovering from disjoint clusters in a mesh network by adding an additional Extended Service Set number (ESS Number) information element (IE) in the Beacon and Probe Re... | 08/25/2009 |
| 7578966 | Solders with intermetallic phases, solder bumps made thereof, packages containing same, and methods of assembling packages therewith A solder composition includes a reflow-wetting element that is an intermetallic both pre-reflow and post-reflow. The intermetallic releases the reflow-wetting element upon heating. The solder composition includes the intermetallic first phase in a bulk-solder second... | 08/25/2009 |
| 7569869 | Transistor having tensile strained channel and system including same A transistor structure and a system including the transistor structure. The transistor structure comprises: a substrate including a first layer comprising a first crystalline material; a tensile strained channel formed on a surface of the first layer and comprising ... | 08/04/2009 |
| 7557438 | Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same A stacked die package includes a substrate (210, 310), a first die (220, 320) above the substrate, a spacer (230, 330) above the first die, a second die (240, 340) above the spacer, and a mold compound (250, 370) disposed around at... | 07/07/2009 |
| 7548113 | Apparatus, amplifier, system and method for receiver equalization In some embodiments an apparatus includes an amplifier, a first inverter having an input coupled to an output of the amplifier, and a second inverter having an input coupled to an output of the first inverter and an output, where the output of the second inverter is... | 06/16/2009 |
| 7545030 | Article having metal impregnated within carbon nanotube array A carbon nanotube (CNT) array is patterned on a substrate. The substrate can be a microelectronic die or a heat sink for a die. The patterned CNT array is patterned by using a patterned catalyst on the substrate to form the CNT array by growing. The patterned CNT ar... | 06/09/2009 |
| 7538429 | Method of enabling solder deposition on a substrate and electronic package formed thereby An electronic package includes a substrate (110, 310, 510) and a solder resist layer (120, 320, 520) over the substrate. The solder resist layer has a plurality of solder resist openings (121, 321, 521) therein. The electronic package further in... | 05/26/2009 |
| 7532476 | Flow solutions for microelectronic cooling Flow solutions for cooling one or more microelectronic device(s) are generally described. In this regard, according to one example embodiment, a cooling apparatus comprising a heat sink base coupled with a plurality of fins includes a first pathway for a fluid to fl... | 05/12/2009 |
| 7525140 | Integrated thin film capacitors with adhesion holes for the improvement of adhesion strength In an embodiment, a substrate includes a thin film capacitor embedded within. In an embodiment, a plurality of adhesion holes extend through the thin film capacitor. These adhesion holes may improve the adhesion of the capacitor to other portions of the substrate. | 04/28/2009 |
| 7522571 | Techniques to enable direct link discovery in a wireless local area network An embodiment of the present invention provides an apparatus, comprising a wireless station operable in a wireless local area network, the wireless station capable of automatic discovery of other stations in a basic service set (BSS) which are capable of supporting ... | 04/21/2009 |
| 7521949 | Test pin, method of manufacturing same, and system containing same A test pin includes a compression element (110), a first tip (120) physically coupled to a first end (111) of the compression element, a second tip (130) physically coupled to a second end (112) of the compression element, a first ... | 04/21/2009 |
| 7501330 | Methods of forming a high conductivity diamond film and structures formed thereby A method of forming a high thermal conductivity diamond film and its associated structures comprising selectively nucleating a region of a substrate, and forming a diamond film on the substrate such that the diamond film has large grains, which are at least about 20... | 03/10/2009 |
| 7471518 | Quasi-radial heatsink with rectangular form factor and uniform fin length In some embodiments, a heatsink includes a thermally conductive core and at least ten thermally conductive fins extending quasi-radially from the thermally conductive core, wherein most of the fins are of uniform length, and wherein at least a portion of the thermal... | 12/30/2008 |
| 7463607 | Apparatus, system and method capable of pre-allocating and communicating IP address information during wireless communication An embodiment of the present invention provides a method of pre-allocating and communicating IP address information during wireless communication by an access point, comprising pre-caching by said AP a predetermined number of IP addresses from a backend Dynamic Host... | 12/09/2008 |
| 7459260 | Method of reducing sensitivity of EUV photoresists to out-of-band radiation and EUV photoresists formed according to the method A modified EUV photoresist and a method of making the resist. The modified resist includes an EUV photoresist and a LAM incorporated into the EUV photoresist. ... | 12/02/2008 |
| 7435683 | Apparatus and method for selectively recessing spacers on multi-gate devices Embodiments of an apparatus and methods for fabricating a spacer on one part of a multi-gate transistor without forming a spacer on another part of the multi-gate transistor are generally described herein. Other embodiments may be described and claimed. ... | 10/14/2008 |
| 7416980 | Forming a barrier layer in interconnect joints and structures formed thereby Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a barrier layer on a substrate, wherein the barrier layer comprises molybdenum; and forming a lead free interconnect structure on the barrier layer. ... | 08/26/2008 |
| 7407085 | Apparatus and method for attaching a semiconductor die to a heat spreader Embodiments of an apparatus and method for attaching a semiconductor die to a heat spreader (or other thermal component) are disclosed. The apparatus includes a substantially flat surface to receive a number of die, and the die may be held in place on the surface by... | 08/05/2008 |
| 7401188 | Method, device, and system to avoid flushing the contents of a cache by not inserting data from large requests A method, device, and system are disclosed. In one embodiment, the method comprises setting a threshold length for data allowed in a cache, inserting data into the cache during a read or a write request if the length of the data requested is less than the threshold ... | 07/15/2008 |
| 7390709 | Method for making a semiconductor device having a high-k gate dielectric layer and a metal gate electrode A method for making a semiconductor device is described. That method comprises forming a first dielectric layer on a substrate, a trench within the first dielectric layer, and a second dielectric layer on the substrate. The second dielectric layer has a first part t... | 06/24/2008 |
| 7355247 | Silicon on diamond-like carbon devices Embodiments of the invention provide substrate with an insulator layer on the substrate. The insulator layer may include diamond-like carbon. A device, such a tri-gate transistor may be formed on the diamond-like carbon layer. ... | 04/08/2008 |
| 7353372 | Detection of support components for add-in card Embodiments of the present invention provide detection, enumeration, and software configuration of optional choice of add-in cards types through a multiplexed bus interface. The PROM allows identification of the add-in device and software configuration to adapt to s... | 04/01/2008 |
| 7353443 | Providing high availability in a PCI-Express link in the presence of lane faults A method, device, and system are disclosed. In one embodiment, the method comprises discovering a failure on a PCI Express interconnect, determining whether a failure override bit has been set to override the standard PCI Express Polling.Compliance state for the fai... | 04/01/2008 |
| 7348957 | Real-time dynamic design of liquid crystal display (LCD) panel power management through brightness control According to one embodiment of the present invention, a method of power management for a flat panel display is disclosed. The method includes: receiving image data; determining a segment mode for the received image data; selecting a portion of the received image dat... | 03/25/2008 |
| 7345914 | Use of flash memory blocks outside of the main flash memory array A method, device, and system are disclosed. In one embodiment, the device comprises an array of flash memory blocks to store information in a multiple bit per cell mode, one or more flash memory blocks external to the array to store information in a single bit per c... | 03/18/2008 |
| 7336719 | System and method for transmit diversity base upon transmission channel delay spread The present invention provides a diversity transmission system. The diversity transmission system includes a method and system of diversity transmission through a wireless channel formed between multiple transmission antennae of a transceiver and a subscriber unit. ... | 02/26/2008 |
| 7330118 | Apparatus and method capable of secure wireless configuration and provisioning An embodiment of the present invention provides an apparatus, comprising an RFID tag interfaced with the apparatus, the RFID tag enables wireless provisioning and configuration of the apparatus and may be a passive read/write RFID tag. The apparatus may be, in one e... | 02/12/2008 |
| 7329588 | Forming a reticle for extreme ultraviolet radiation and structures formed thereby Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a plurality of openings in a portion of a first side of a substrate, bonding a first silicon layer of a silicon on insulator wafer to the first side of the sub... | 02/12/2008 |
| 7328368 | Dynamic interconnect width reduction to improve interconnect availability In some embodiments an apparatus includes a transmission error detector to detect an error of a transmission of an interconnect and a transmitting agent to retry the transmission in response to the detected error. The apparatus also includes a hard failure detector ... | 02/05/2008 |
| 7317310 | Embedded PCB identification A method of tracking a printed circuit board is described. An embedded identification device is utilized. The embedded identification device is placed in a layer of the printed circuit board. An external transceiver is used to communicate with the embedded device an... | 01/08/2008 |
| 6094683 | Link bundling in a network A technique for bundling links is provided for increasing bandwidth and reducing latency. Two nodes in a network are configured to bundle two or more links connected between the two nodes. Data is transmitted between the two nodes by striping data over ea... | 07/25/2000 |
