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| Number | Title | Issue Date |
| 7754671 | Liquid laundry detergent containing an ethoxylated anionic/nonionic surfactant mixture and fabric conditioner This invention relates to a aqueous liquid laundry composition which both cleans and conditions fabrics. The composition includes certain alcohol ethoxylates as a nonionic surfactant component, certain alkyl ether sulfates as an anionic component and a quaternary am... | 07/13/2010 |
| D556056 | Dual-chambered bottle | 11/27/2007 |
| D548319 | Air purifier | 08/07/2007 |
| D545681 | Bottle | 07/03/2007 |
| D543855 | Dual-opening bottle with handle | 06/05/2007 |
| D544085 | Air freshener housing | 06/05/2007 |
| 7099498 | Minutiae matching system and method A system and a method for minutiae record matching is claimed that includes the processing a first plurality of ordered minutiae match values with weighting values corresponding to a function of at least the number of minutiae in the corresponding latent print and t... | 08/29/2006 |
| 7072496 | Slap print segmentation system and method A system and a method for segmenting slap fingerprints is described. The method includes providing a print image, optionally pre-processing the print image, detecting at least a plurality of image components of the print image, determining at least one segmentation ... | 07/04/2006 |
| 6805820 | Multicolored soap bars This invention relates to an apparatus end method for introducing various additives in solid form into a soap mass for the ultimate manufacture of soap bars. Specifically, the invention is directed to producing soap bars having a multicolored or marbleized appearanc... | 10/19/2004 |
| 6541989 | Testing device for semiconductor components and a method of using the device A testing device for semiconductor components and a method of making the device is described. The testing device includes a support structure having an outer edge, and an adhesive film disposed on the support structure to hold a semiconductor wafer in pos... | 04/01/2003 |
| 6368929 | Method of manufacturing a semiconductor component and semiconductor component thereof A method of manufacturing a semiconductor component and the component thereof includes forming a dielectric layer (620) over a portion of a passivation ledge (640) in an emitter layer (280) and overlapping a base contact (660) onto the dielectric layer (6... | 04/09/2002 |
| 6309908 | Package for an electronic component and a method of making it An electrical 100 and a method of making the package is disclosed. Specifically the package 100 contains a lid 101 with at least one opening 105 through the lid 101 into a cavity 180 surrounding the die 120 between the lid 101 and the substrate 130 of the... | 10/30/2001 |
| 6309918 | Manufacturable GaAs VFET process A manufacturable GaAs VFET process includes providing a doped GaAs substrate with a lightly doped first epitaxial layer thereon and a heavily doped second epitaxial layer positioned on the first epitaxial layer. A temperature tolerant conductive layer is ... | 10/30/2001 |
| 6307452 | Folded spring based micro electromechanical (MEM) RF switch A micro electromechanical switch is formed on a substrate using a microplatform structure suspended on a spring suspension. The spring suspension is attached on one end to an anchor structure and extends in a substantially octagonal direction over a signa... | 10/23/2001 |
| 6228275 | Method of manufacturing a sensor A sensor has a support substrate (200), an electrode (110, 510, 710) movable relative to a surface (201) of the support substrate (200) and comprised of a first material, a structure (160, 460, 560, 760) over a portion of the electrode (110, 510, 710) to ... | 05/08/2001 |
| 6221686 | Method of making a semiconductor image sensor An image sensor (10) has an image sensing element that includes an N-type conducting region (26) and a P-type pinned layer (37). The two regions form two P-N junctions at different depths that increase the efficiency of charge carrier collection at differ... | 04/24/2001 |
| 6177354 | Method of etching a substrate A etcher (10) has an inner chamber (22) that is in communication with a collection chamber (17). A cover (33) is made from a substrate (11) and an outer housing (34). The cover (33) is attached to the etcher (10) so that the substrate (11) is suspended ov... | 01/23/2001 |
| 6172420 | Silicon delta-doped gallium arsenide/indium arsenide heterojunction OHMIC contact An ohmic contact including a gallium arsenide substrate having an epitaxially grown crystalline layer of indium arsenide on the substrate. The crystalline material and the substrate define an interface, layers are n-doped with silicon close to the interfa... | 01/09/2001 |
| 6163063 | Semiconductor device A semiconductor device (10) is formed to have multiple external connection pads (17, 18) for an active element (12). The multiple external connection pads (17, 18) are electrically connected together with a electrical link (19). After testing, the electri... | 12/19/2000 |
| 6156611 | Method of fabricating vertical FET with sidewall gate electrode A vertical FET is fabricated by etching through a contact layer into a drift layer on a compound semiconductor substrate to form a plurality of mesas, each mesa having an upper surface and each adjacent pair of mesas defining therebetween a trench with si... | 12/05/2000 |
| 6153905 | Semiconductor component including MOSFET with asymmetric gate electrode where the drain electrode over portions of the lightly doped diffusion region without a gate dielectric A semiconductor component includes an asymmetric transistor having two lightly doped drain regions (1300, 1701), a channel region (1702), a source region (1916) located within the channel region (1702), a drain region located outside the channel region (1... | 11/28/2000 |
| 6150917 | Piezoresistive sensor bridge having overlapping diffused regions to accommodate mask misalignment and method A piezoresistive pressure sensor (30) has four resistive diffused regions (32) coupled into a bridge configuration (33) with four junctions (36) and four inside corners (40). Each of the diffused regions has a first end connected to one of the four juncti... | 11/21/2000 |
| 6148673 | Differential pressure sensor and method thereof A differential pressure sensor (10) has a sensor die (30) eutectically attached to a mounting flag (14). The mounting flag has a similar coefficient of thermal expansion to the sensor die. The eutectic attachment provides a hermetic seal between the mount... | 11/21/2000 |
| 6149508 | Chemical mechanical planarization system A chemical mechanical planarization tool that reduces a volume of polishing chemistry used in a wafer polishing process includes a rinse bar (87) for removing polishing chemistry and particulates from a polishing media and a slurry measurement system (84)... | 11/21/2000 |
| 6140212 | Semiconductor device and method therefor A semiconductor device (10) is formed to have multiple external connection pads (17, 18) for an active element (12). The multiple external connection pads (17, 18) are electrically connected together with a electrical link (19). After testing, the electri... | 10/31/2000 |
| 6134941 | Method of testing sensors and apparatus therefor An apparatus for testing sensors in a media includes a chamber portion (240) for holding the sensors, tanks (320, 340) for supplying the media to the chamber portion (240) and coupled in parallel to the chamber portion (240), a pressure generator (310) co... | 10/24/2000 |
| 6137272 | Method of operating an AC-DC converter An AC-to-DC-converter (100) for driving a dynamic load (160), such as a motor, has a rectifier bridge (110), a coil (120), and a switch (130) to boost an output capacitor (150) by a coil current I(t). The current (I(t)) has periodical minimum values. The ... | 10/24/2000 |
| 6135855 | Translation mechanism for a chemical mechanical planarization system and method therefor Chemical mechanical planarization (CMP) of semiconductor wafers presents a harsh abrasive and chemical environment for equipment used in a polishing process. Prior art translation mechanisms are prone to failure due to corrosion and require maintenance th... | 10/24/2000 |
| 6122963 | Electronic component for measuring acceleration An electronic component includes a support substrate (101), a fixed electrode (113) overlying the support substrate (101), a movable electrode (123, 423) overlying the support substrate and the first electrode (113) wherein the first and second electrodes... | 09/26/2000 |
| 6105428 | Sensor and method of use A sensor has an electrode (120) that is movable along three mutually perpendicular axes (10, 11, 12). The sensor also has stationary over-travel limiting structures that restrict the movement of the electrode (120) along the three axes (10, 11, 12).... | 08/22/2000 |
| 6107203 | Chemical mechanical polishing system and method therefor A chemical mechanical planarization tool (21) comprises a platen (22), a wafer carrier arm (31), a carrier assembly (37), a conditioning arm (28), and an end effector (33). A slurry delivery system (51) reduces waste by providing polishing chemistry at a ... | 08/22/2000 |
| 6096575 | Optimum condition detection method for flip-chip An optimum condition detection method for flip-chip bonding that facilitates simple detection of optimum pressure and heating temperature for flip-chip bonding implemented by use of bonding material is provided. Pressure applied to a semiconductor chip is incr... | 08/01/2000 |
| 6084241 | Method of manufacturing semiconductor devices and apparatus therefor A method of manufacturing a semiconductor device includes creating ions in a chamber (201), using the ions to generate sputtered material from a target (241, 242) in the chamber (201), creating other ions from the sputtered material in the chamber (201), ... | 07/04/2000 |
| 6070464 | Sensing structure comprising a movable mass and a self-test structure A sensing structure (10) formed overlying a substrate (50), for example a semiconductor substrate, has a movable mass (12) substantially split into two halves with a self-test structure disposed between the two halves. The self-test structure has a plural... | 06/06/2000 |
| 6070600 | Point of use dilution tool and method A dilution tool (100) and a method prepare a solution of two fluids for removing residue from a semiconductor wafer. The fluids are combined in a filter (130) to form the desired solution. Sealless pumps (141, 142) are driven by a common motor (143) to pu... | 06/06/2000 |
| 6056888 | Electronic component and method of manufacture An electronic component includes a substrate (201) with a surface (202), a resistor structure (210) supported by the substrate, and a passivation layer (300, 805) over the resistor and the surface of the substrate where the passivation layer has a hole (3... | 05/02/2000 |
| 5968849 | Method for pre-shaping a semiconductor substrate for polishing and structure A method for pre-shaping a major surface (21,22) of a semiconductor wafer (20) in preparation for polishing includes shaping the major surface (21,22) so that it has a concave shape. In a preferred method, an etching process is used to form the concave sh... | 10/19/1999 |
| 5967379 | Liquid dispenser having a container with a dispensing device A container for dispersing liquid through a dispenser is described. The container has a resealable outlet which has an outlet passageway in a tube and a stop wedged in the passageway to seal the liquid in the container. The passageway is accessible beneat... | 10/19/1999 |
| 5896898 | Dispenser A dispenser is described having a support for the container to be filled, a source of liquid and a switch controlling the flow of liquid into the container. The container is supported by a support which urges the container up or down. The switch is operat... | 04/27/1999 |
| 5868964 | Caustic-stable modified polycarboxylate compound and method of making the same A surfactant-modified polymer and method of making the same. The surfactant-modified polymer has a polycarboxylate backbone with non-ionic surfactant chemically associated therewith and is formed by the reaction of a reactant compound selected from the gr... | 02/09/1999 |
