Famous Patents
The first match was accidentally discovered in 1826 when John Walker scraped a stick with chemicals on the end against a stone floor.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7607610 | Ornithopter having a wing structure and a mechanism for imparting realistic, bird-like motion thereto An ornithopter having segmented, flapping wings and capable of bird-like flight. A main drive system provides flapping motion to the wings. Servo systems are provided for independently moving each wing forward and backward along a major axis of the aircraft fuselage... | 10/27/2009 |
| 7478472 | Method of making circuitized substrate with signal wire shielding A method of making a circuitized substrate in which at least one signal line used therein is shielded by a pair of opposingly positioned ground lines which in turn are electrically coupled to a ground plane located beneath the signal and ground lines and separated t... | 01/20/2009 |
| 7470990 | Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same A circuitized substrate including a composite layer including a first dielectric sub-layer including a plurality of fibers having a low coefficient of thermal expansion and a second dielectric sub-layer of a low moisture absorptivity resin, the second dielectric sub... | 12/30/2008 |
| 7429510 | Method of making a capacitive substrate using photoimageable dielectric for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate A method of forming a capacitive substrate in which at least one capacitive dielectric layer of material is screen or ink jet printed onto a conductor and the substrate is thereafter processed further, including the addition of thru-holes to couple selected elements... | 09/30/2008 |
| 7429789 | Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same A dielectric composition for forming a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like, the composition including at least two fluoropolymers and two inorganic fillers. A circuitized substrate including at least one such di... | 09/30/2008 |
| 7384856 | Method of making an internal capacitive substrate for use in a circuitized substrate and method of making said circuitized substrate A method of forming a capacitive substrate in which first and second conductors are formed opposite a dielectric, with one of these electrically coupled to a thru-hole connection. Each functions as an electrode for the resulting capacitor. The substrate is then adap... | 06/10/2008 |
| 7383629 | Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof A circuitized substrate in which two conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to an interim dielectric layer. Each of the two foil surfaces which physically bond to the dielectric are smooth (e.g., preferably by chemical proce... | 06/10/2008 |
| 7381587 | Method of making circuitized substrate A method of making a circuitized substrate and an electrical assembly utilizing same in which the substrate is comprised of at least two sub-composites in which the dielectric material of at least one of these sub-composites is heated during bonding (e.g., laminatio... | 06/03/2008 |
| 7377033 | Method of making circuitized substrate with split conductive layer and information handling system utilizing same A method of making circuitized substrate which includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate portions of the conductive layer such that the layer can be used for differe... | 05/27/2008 |
