Did You Know...
...that two musicians were responsible for the invention of color print film? Fascinated by photography, Leopold Godowsky and Leopold Mannes worked together to produce an easy-to-use, practical color film. They worked full time as music teachers and gave concerts while experimenting during their off hours in Mannes' kitchen. Their success earned them full-time, well-paying jobs at Kodak and their efforts resulted in Kodachrome film, which was introduced in 1935.
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| Number | Title | Issue Date |
| 7421087 | Transducer for electromagnetic hearing devices A hearing system for producing audio signals perceptible to an individual. The hearing system includes a transducer having a surface adapted to attach to a middle-ear acoustic member of the individual, wherein the transducer is responsive to variations in a magnetic... | 09/02/2008 |
| 4839311 | Etch back detection An improved method for the etch-back planarization of interlevel dielectric layers provides for cessation of the etch-back upon exposure of an indicator layer. the indicator layer, usually a metal, metal nitride, or silicon nitride is formed either within... | 06/13/1989 |
| 4824521 | Planarization of metal pillars on uneven substrates A method for forming vertical metal interconnects on a semiconductor substrate having an uneven surface comprises first forming a laminated metal structure over the entire substrate. The laminated metal structure includes a first metallization sublayer, a... | 04/25/1989 |
| 4806504 | Planarization method A liquid polymeric resin is applied over an irregular surface of a semiconductor substrate by first spinning followed by rotation of the substrate about an axis parallel to and spaced-apart from the plane of the substrate. Such a technique provides for pl... | 02/21/1989 |
| 4804810 | Apparatus and method for tape bonding A bonding apparatus for eutectically bonding tape leads to semiconductors and other substrates includes four separate bonding rails for applying heat. The bonding rails have a preselected distribution of mass along their length in order to compensate for ... | 02/14/1989 |
| 4791473 | Plastic package for high frequency semiconductor devices A plastic semiconductor package suitable for high frequency operation includes an internal ground plane connected to a ground ring formed on the packaged semiconductor device. The ground plane is included as a portion of a lead frame strip adjacent to the... | 12/13/1988 |
| 4752829 | Multipacket charge transfer image sensor and method An image sensor is disclosed which is capable of handling large amounts of signal charge with small shift registers. The image sensor includes photoelements 10 in which charge is accumulated in response to sensed conditions; electrically-controllable tran... | 06/21/1988 |
| 4734671 | Strain gage beam having integral overload protection A sensitive deflector beam having an integral deflectable element utilizes an immobilization pin and a limit pin to prevent damage to the deflectable element during fabrication and use. The immobilization pin is inserted through the beam and to the deflec... | 03/29/1988 |
| 4732841 | Tri-level resist process for fine resolution photolithography A multilayer photoresist system for defining very small features on a semiconductor substrate relies on forming a planarization layer directly over the substrate. An image transfer layer is formed over the planarization layer, and a photoresist imaging la... | 03/22/1988 |
| 4688075 | Integrated circuit having a pre-attached conductive mounting media and method of making the same A semiconductor wafer having a plurality of integrated circuits is provided. One surface of the wafer includes a plurality of electrical contacts on the circuits which are subsequently attached to leads. The other surface of the wafer is provided with a c... | 08/18/1987 |
| 4683023 | Tape attach machine A machine for applying an adhesive pad to the ends of semiconductor device packages includes a punch assembly, a tape feed assembly, and a package feed assembly. The tape is incrementally fed to the punch assembly where semiconductor packages are individu... | 07/28/1987 |
| 4674808 | Signal ground planes for tape bonded devices A multiple layer tape bonding technique interconnects an integrated circuit chip having signal and ground bonding pads located thereon to other electrical devices. The tape bonding structure is comprised of a first layer having electrically isolated indiv... | 06/23/1987 |
| 4653175 | Semiconductor structure having alpha particle resistant film and method of making the same An applique of a prepatterned film of alpha particle resistant material, such as polyimide, is applied to a semiconductor wafer. The prepatterned film covers only the critical areas e.g. those affected by alpha particle impingement. Bond pads and scribe s... | 03/31/1987 |
| 4537059 | Automatic brushing machine An apparatus for quality control testing of semiconductor packages comprises a support platform for holding a device in a fixed location and a reciprocatable brush which is mounted to contact the device with a constant force. The reciprocating mechanism b... | 08/27/1985 |
| 4501061 | Fluorine plasma oxidation of residual sulfur species A method for stripping an organic photoresist layer from a semiconductor device comprises oxidation of the photoresist layer with oxygen plasma and subsequent removal of residual sulfur species using a fluorine-containing plasma.... | 02/26/1985 |
| 4451971 | Lift-off wafer processing An improved lift-off process for forming metallized interconnections between various regions on a semi-conductor device relies on the use of a particular polyimide in forming a protective mask over the device. The polyimide is a copolymer of an aromatic c... | 06/05/1984 |
| 4451326 | Method for interconnecting metallic layers A method for forming multiple conductive interconnect layers on a semiconductor device comprises defining a first conductive metal layer, applying a first insulating layer thereon, planarizing the first insulating layer by etching a sacrificial planarizat... | 05/29/1984 |
