Bizarre Patents
Pillow with retractable umbrella
A pillow assembly having a supporting assembly and a retractable umbrella assembly that is easily transportable and allows a user to support his/her head while covering their face from sunlight.
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| Number | Title | Issue Date |
| 8138239 | Polymer thermal interface materials In some embodiments, polymer thermal interface materials are presented. In this regard, a thermal interface material is introduced comprising a polymer matrix, a matrix additive, wherein the matrix additive comprises a fluxing agent, and a spherical filler material,... | 03/20/2012 |
| 8119508 | Forming integrated circuits with replacement metal gate electrodes In a metal gate replacement process, a stack of at least two polysilicon layers or other materials may be formed. Sidewall spacers may be formed on the stack. The stack may then be planarized. Next, the upper layer of the stack may be selectively removed. Then, the ... | 02/21/2012 |
| 8093704 | Package on package using a bump-less build up layer (BBUL) package In some embodiments, package on package using a bump-less build up layer (BBUL) package is presented. In this regard, an apparatus is introduced comprising a microelectronic die having an active surface, an inactive surface parallel to said active surface, and at le... | 01/10/2012 |
| 8084856 | Thermal spacer for stacked die package thermal management In some embodiments, a thermal spacer for stacked die package thermal management is presented. In this regard, an apparatus is introduced having a top integrated circuit die, a bottom integrated circuit die, and a thermal spacer between the top and bottom integrated... | 12/27/2011 |
| 8018288 | High-linearity low noise amplifier Embodiments of a high-linearity low-noise amplifier (LNA) are generally described herein. Other embodiments may be described and claimed. In some embodiments, an RF input signal may be amplified with a cascode amplifier. The cascode amplifier may include integrated ... | 09/13/2011 |
| 8017022 | Selective electroless plating for electronic substrates In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including forming a film on a surface of a substrate, the film designed to prevent the seeding of an electroless plating catalyst, laser... | 09/13/2011 |
| 8013439 | Injection molded metal stiffener for packaging applications In some embodiments, an injection molded metal stiffener for packaging applications is presented. In this regard, an apparatus is introduced comprising a microelectronic device package substrate, a microelectronic device coupled with a top surface of the package sub... | 09/06/2011 |
| 8012808 | Integrated micro-channels for 3D through silicon architectures Some embodiments of the present invention include apparatuses and methods relating to integrated micro-channels for removing heat from 3D through silicon architectures. ... | 09/06/2011 |
| 7982478 | Liquid TIM dispense and removal method and assembly In some embodiments, a liquid TIM dispense and removal method and assembly is presented. In this regard, a method is introduced including loading an absorbent material of a thermal control unit with a liquid thermal interface material (TIM), pressing the absorbent m... | 07/19/2011 |
| 7975158 | Noise reduction method by implementing certain port-to-port delay A noise reduction method by implementing certain point-to-point delay is disclosed. In this regard a method is introduced comprising determining a frequency of a greatest noise on a high-speed data link when turning on a power delivery network, determining a delay t... | 07/05/2011 |
| 7960190 | Temporary package for at-speed functional test of semiconductor chip In some embodiments, a temporary package for at-speed functional test of semiconductor chip, including high power chips, is presented. In this regard, a method is introduced including placing an integrated circuit die on a contactor layer, the contactor layer to ele... | 06/14/2011 |
| 7919859 | Copper die bumps with electromigration cap and plated solder Embodiments of the invention include apparatuses and methods relating to copper die bumps with electtomigration cap and plated solder. In one embodiment, an apparatus comprises an integrated circuit die, a plurality of copper bumps on a surface of the die, electromi... | 04/05/2011 |
| 7900029 | Method and apparatus to simplify configuration calculation and management of a processor system Methods and apparatus to simplify configuration calculation and management of a processor system are disclosed. An example disclosed method reads system configuration data from registers of a processing system, caches the system configuration data in an allocated me... | 03/01/2011 |
| 7791585 | Method of fabricating flexible display A method of fabricating a flexible display, the method comprising selecting a first flexible sheet and a second flexible sheet; and forming a number of magnetic display elements having magnetically controllable reflectivity between the first flexible sheet and the s... | 09/07/2010 |
| 7768079 | Transistors with high-k dielectric spacer liner to mitigate lateral oxide encroachement Embodiments of the invention generally relate to transistors with high-k dielectric spacer liner to mitigate lateral oxide encroachment. In this regard a semiconductor device is introduced having a substrate, a high-k gate dielectric layer on the substrate, a metal ... | 08/03/2010 |
| 7761723 | Processor temperature control interface Techniques for a processor temperature control interface. In one embodiment, a processor includes a bidirectional interface and output logic to assert a first signal indicating an internal high temperature on the bidirectional interface. Throttling logic throttles o... | 07/20/2010 |
| 7760140 | Multiband antenna array using electromagnetic bandgap structures In some embodiments, a multiband antenna array using electromagnetic bandgap structures is presented. In this regard, an antenna array is introduced having two or more planar antennas situated substantially on a surface of a substrate, a first set of electromagnetic... | 07/20/2010 |
| 7759022 | Phase shift mask structure and fabrication process A photomask and method for fabricating a photomask are generally described. In one example, a photomask includes a substrate, a multilayer (ML) stack having a peripheral region that is rendered substantially opaque for a desired wavelength of radiation by localized ... | 07/20/2010 |
| 7750441 | Conductive interconnects along the edge of a microelectronic device Embodiments of the invention include apparatuses and methods relating to conductive interconnects along the edges of a microelectronic device. In one embodiment, the conductive interconnect has the shape of a half cylinder. ... | 07/06/2010 |
| 7723841 | Thermal spacer for stacked die package thermal management In some embodiments, a thermal spacer for stacked die package thermal management is presented. In this regard, an apparatus is introduced having a top integrated circuit die, a bottom integrated circuit die, and a thermal spacer between the top and bottom integrated... | 05/25/2010 |
| 7675160 | Individual sub-assembly containing a ceramic interposer, silicon voltage regulator, and array capacitor In some embodiments, an individual sub-assembly containing a ceramic interposer, silicon voltage regulator, and array capacitor is presented. In this regard, an apparatus is introduced having a table-shaped ceramic interposer containing conductive traces, a silicon ... | 03/09/2010 |
| 7662501 | Transpiration cooling and fuel cell for ultra mobile applications In some embodiments, transpiration cooling and fuel cell for ultra mobile applications is presented. In this regard, an apparatus is introduced having an integrated circuit device, a fuel cell to power the integrated circuit device, wherein the fuel cell produces wa... | 02/16/2010 |
| 7649265 | Micro-via structure design for high performance integrated circuits In some embodiments, a micro-via structure design for high performance integrated circuits is presented. In this regard, an integrated circuit chip package is introduced having a dielectric layer, a plated throughhole in the dielectric layer, and a micro-via coupled... | 01/19/2010 |
| 7638877 | Alternative to desmear for build-up roughening and copper adhesion promotion In some embodiments, an alternative to desmear for build-up roughening and copper adhesion promotion is presented. In this regard, a substrate in introduced having a dielectric layer, a plurality of polyelectrolyte multilayers on the dielectric layer, and a copper p... | 12/29/2009 |
| 7633753 | Piezoelectric air jet augmented cooling for electronic devices In some embodiments, piezoelectric air jet augmented cooling for electronic devices is presented. In this regard, an apparatus is introduced having a plurality of more than about one hundred lead-free piezoelectric layers and electrodes stacked on top of each other ... | 12/15/2009 |
| 7630942 | Multi-core stochastic discrimination In some embodiments, multi-core stochastic discrimination is generally presented. In this regard, a method is introduced comprising providing random regions of a feature space to parallel cores, testing each random region for enrichment in parallel, recording covera... | 12/08/2009 |
| 7629680 | Direct power delivery into an electronic package In some embodiments, direct power delivery into an electronic package is presented. In this regard, a substrate is introduced having a conductive substrate core designed to physically connect with a power cable. Other embodiments are also disclosed and claimed. ... | 12/08/2009 |
| 7613223 | Time-frequency coding in a multi-band ultra-wideband system Time-frequency coding in a multi-band ultra-wideband system is generally described. In this regard a hopping code agent is presented to select a frequency hopping code for encoding and decoding from a set of predetermined FHC's for communicating with other devices i... | 11/03/2009 |
| 7609575 | Method, apparatus and system for N-dimensional sparse memory using serial optical memory In some embodiments, a method, apparatus and system for n-dimensional sparse memory using serial optical memory are presented. In this regard, a memory device is introduced to circulate a signal among a plurality of optical emitters and receivers. Other embodiments ... | 10/27/2009 |
| 7609574 | Method, apparatus and system for global shared memory using serial optical memory In some embodiments, a method, apparatus and system for global shared memory using serial optical memory are presented. In this regard, a memory device is introduced to circulate a signal among a plurality of optical emitters and receivers. Other embodiments are als... | 10/27/2009 |
| 7605671 | Component-less termination for electromagnetic couplers used in high speed/frequency differential signaling Component-less termination for electromagnetic couplers used in high speed/frequency differential signaling is described. In one embodiment, the apparatus includes a first signal line and a second signal line forming a differential pair, a first electromagnetic coup... | 10/20/2009 |
| 7554198 | Flexible joint methodology to attach a die on an organic substrate In some embodiments, flexible joint methodology to attach a die on an organic substrate is presented. In this regard, an integrated circuit chip package substrate is introduced having an organic substrate, an interposer coupled with a surface of the organic substrat... | 06/30/2009 |
| 7533316 | Method and apparatus for disabling and swapping cores in a multi-core microprocessor In some embodiments, a method and apparatus for disabling and swapping cores in a multi-core microprocessor are presented. In this regard, a test agent is introduced to disable a core, to configure a mode, and to configure a site. Other embodiments are also disclose... | 05/12/2009 |
| 7523435 | Pixelated masks for high resolution photolithography Some embodiments of the present invention include apparatuses and methods relating to pixelated masks for high resolution photolithography. ... | 04/21/2009 |
| 7519790 | Method, apparatus and system for memory instructions in processors with embedded memory controllers In some embodiments, a method, apparatus and system for memory instructions in processors with embedded memory controllers are presented. In this regard, a memory agent is introduced to configure memory coupled with a processor through a memory interface by invoking... | 04/14/2009 |
| 7464300 | Method, apparatus and system to detect and signal sequential hot plug failure diagnostics In some embodiments, a method, apparatus and system to detect and signal sequential hot plug failure diagnostics are presented. In this regard, a diagnostic agent is introduced to store a plurality of bits corresponding to a hot plug error code in a register sequent... | 12/09/2008 |
| 7463486 | Transpiration cooling for passive cooled ultra mobile personal computer In some embodiments, transpiration cooling for passive cooled ultra mobile personal computer is presented. In this regard, an apparatus is introduced having a plurality of integrated circuit device(s), a power source to power the integrated circuit device(s), a chas... | 12/09/2008 |
| 7462551 | Adhesive system for supporting thin silicon wafer In some embodiments, an adhesive system for supporting thin silicon wafer is presented. In this regard, a method is introduced to bond a silicon wafer to a translucent carrier through the use of an adhesive. Other embodiments are also disclosed and claimed. ... | 12/09/2008 |
| 7452637 | Method and apparatus for clean photomask handling Some embodiments of the present invention include protecting a photomask from particle defects by heating the photomask to initiate a thermophoretic force. ... | 11/18/2008 |
| 7441132 | Circuit for enabling dual mode safe power-on sequencing A circuit that enables a safe power-on sequencing is described. The circuit enables a processor to be powered by an internal or external voltage source. The circuit detects for the presence of an external voltage regulator. If an external voltage generator is not pr... | 10/21/2008 |
