Did You Know...
...that Thomas Edison's patent application on his phonograph was approved by the Patent Office in just seven weeks? In contrast, it took Gordon Gould, the inventor of the laser, 30 years to obtain his patent -- finally awarded in 1988!
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| Number | Title | Issue Date |
| 5102830 | Integrated circuit fabrication process for preventing overprocessing during a laser scan A process for preventing overprocessing of an (IC) wafer or the like in an area of laser overlap. The invention in general comprises a process in which the surface of an (IC) wafer is coated with a composition which forms a light reflective surface upon t... | 04/07/1992 |
| 5071661 | Process for dehydrating potato products A process for dehydrating food products particularly suited to the dehydration of potatoes for use in the preparation of hashbrown potatoes. In accordance with the process of the invention, a food product, e.g. a potato is prepared into separate pieces fo... | 12/10/1991 |
| 5057888 | Double DRAM cell A double dynamic random access memory (DRAM) cell comprising two vertically stacked access transistors and storage capacitors. A first access transistor is formed on a silicon substrate. A seed contact to the first access transistor is then utilized for g... | 10/15/1991 |
| 5057658 | Apparatus for oil filtration and recirculation An apparatus for filtering and recirculating oil used in a vacuum pump is disclosed. The filtration device comprises first and second valves permitting, respectively, addition and deletion of oil from the system. A plurality of filter elements are provide... | 10/15/1991 |
| 5054188 | Trim cut and form machine A trim, form and cut machine for trimming plastic flash from an IC chip and cutting the connections between chip leads. The machine utilizes interchangeable modules and interchangeable punches and is designed with a self-cleaning feature. Air jets and pas... | 10/08/1991 |
| 5036015 | Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers A method and apparatus for detecting a planar endpoint on a semiconductor wafer during chemical/mechanical planarization of the wafer. The planar endpoint is detected by sensing a change in friction between the wafer and a polishing surface. This change o... | 07/30/1991 |
