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Actress Jamie Lee Curtis is a patented inventor - she created a diaper equipped with a premoistened baby wipe. And that's no act!
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| Number | Title | Issue Date |
| 7935991 | Semiconductor components with conductive interconnects A semiconductor component includes a semiconductor substrate having at least one conductive interconnect on the backside thereof bonded to an inner surface of a substrate contact. A stacked semiconductor component includes multiple semiconductor components in a stac... | 05/03/2011 |
| 7919846 | Stacked semiconductor component having through wire interconnect A stacked semiconductor component includes a plurality of semiconductor substrates in a stacked array and a continuous wire extending through aligned vias on the semiconductor substrates of the stacked array in electrical contact with contacts on the semiconductor s... | 04/05/2011 |
| 7883908 | Method for fabricating semiconductor component having encapsulated through wire interconnect (TWI) A method for fabricating a semiconductor component with an encapsulated through wire interconnect includes the steps of providing a substrate having a first side, a second side and a substrate contact; forming a via in the substrate contact and the substrate to the ... | 02/08/2011 |
| 7833832 | Method of fabricating semiconductor components with through interconnects A method for fabricating a semiconductor component with through interconnects can include the steps of providing a semiconductor substrate with substrate contacts, and forming openings from a backside of the substrate aligned with the substrate contacts. The method ... | 11/16/2010 |
| 7807502 | Method for fabricating semiconductor packages with discrete components A semiconductor package includes a substrate having contacts, and a discrete component on the substrate in electrical communication with the contacts. The package also includes a semiconductor die on the substrate in electrical communication with the contacts, and a... | 10/05/2010 |
| 7786605 | Stacked semiconductor components with through wire interconnects (TWI) A semiconductor component includes a semiconductor substrate having a substrate contact, and a through wire interconnect (TWI) bonded to the substrate contact. The through wire interconnect (TWI) includes a via through the substrate contact and the substrate, a wire... | 08/31/2010 |
| 7781868 | Semiconductor components having through interconnects and backside redistribution conductors A semiconductor component includes a semiconductor substrate having a circuit side with integrated circuits and substrate contacts and a back side, a plurality of through interconnects in the substrate, and redistribution conductors on the back side of the substrate... | 08/24/2010 |
| 7776647 | Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors A semiconductor component includes a thinned semiconductor substrate having protective polymer layers on up to six surfaces. The component also includes contacts on a circuit side of the substrate, conductive vias in electrical contact with the contacts, and conduct... | 08/17/2010 |
| 7768096 | System for fabricating semiconductor components with conductive interconnects A system for fabricating semiconductor components includes a semiconductor substrate, a thinning system for thinning the semiconductor substrate, an etching system for forming the substrate opening, and a bonding system for bonding the conductive interconnect to the... | 08/03/2010 |
| 7757385 | System for fabricating semiconductor components with through wire interconnects A method for fabricating a semiconductor component with a through wire interconnect includes the step of providing a substrate having a circuit side, a back side, and a through via. The method also includes the steps of: threading a wire through the via, forming a c... | 07/20/2010 |
| 7755385 | Method for operating an electronic device with reduced pin capacitance A method of operating an electronic device having an output driver with on die termination legs ODT, and non-ODT legs, includes the step of selectively tri-stating tuning transistors (ZQ trim devices) in the legs as a function of the operational state of the output ... | 07/13/2010 |
| 7740031 | System for blending and compressing gases A gas blending and compressing system includes a blender having a blending chamber configured to blend two or more separate gases into a blended gas, a compressor configured to compress the blended gas to a selected pressure, and a control system configured to sense... | 06/22/2010 |
| 7740010 | System and method of stoichiometric combustion for hydrogen fueled internal combustion engines A system includes a hydrogen fueled internal combustion engine, a fuel system configured to provide a flow of hydrogen fuel to the engine, and an exhaust gas recirculation (EGR) system configured to provide a flow of recirculated gas to the engine which includes exh... | 06/22/2010 |
| 7728443 | Semiconductor components with through wire interconnects A method for fabricating a semiconductor component with a through wire interconnect includes the step of providing a substrate having a circuit side, a back side, and a through via. The method also includes the steps of: threading a wire through the via, forming a c... | 06/01/2010 |
| 7727872 | Methods for fabricating semiconductor components with conductive interconnects A system for fabricating semiconductor components includes a semiconductor substrate, a thinning system for thinning the semiconductor substrate, an etching system for forming the substrate opening, and a bonding system for bonding the conductive interconnect to the... | 06/01/2010 |
| 7723831 | Semiconductor package having die with recess and discrete component embedded within the recess A semiconductor package includes a substrate having contacts, and a discrete component on the substrate in electrical communication with the contacts. The package also includes a semiconductor die on the substrate in electrical communication with the contacts, and a... | 05/25/2010 |
| 7721799 | Flow control packer (FCP) and aquifer storage and recovery (ASR) system A flow control packer (FCP) includes a packer mandrel, and an inflatable element fixedly attached at each end to the mandrel. The inflatable element includes circumferential grooves and flow control grooves formed on an outside surface thereof configured to press ag... | 05/25/2010 |
| 7721682 | System for producing a hydrogen enriched fuel A system for producing, dispensing, using and monitoring a hydrogen enriched fuel includes a producing system configured to produce the hydrogen enriched fuel, a vehicle having an engine configured to use the hydrogen enriched fuel, and a dispensing system configure... | 05/25/2010 |
| D616385 | Substrate for a surface mount light emitting diode | 05/25/2010 |
| 7717645 | Adjustable physical structures for producing hydraulic formations for whitewater recreationalists An adjustable physical structure for producing hydraulic formations for whitewater recreationalists includes a control structure, and an adjustable lip located downstream of the control structure. The control structure can include a crest and a ramp. The crest const... | 05/18/2010 |
| 7708494 | Water diversion system and method having hydraulic chute, screen assembly and wedge wire screen A water diversion system includes a hydraulic chute and a chute screen assembly in the hydraulic chute having a wedge wire screen. The water diversion system also includes at least one collection chamber located below the screen configured to collect filtered divers... | 05/04/2010 |
| 7682962 | Method for fabricating stacked semiconductor components with through wire interconnects A method for fabricating a semiconductor component with a through wire interconnect includes the step of providing a substrate having a circuit side, a back side, and a through via. The method also includes the steps of: threading a wire through the via, forming a c... | 03/23/2010 |
| 7659612 | Semiconductor components having encapsulated through wire interconnects (TWI) A semiconductor component includes a semiconductor substrate having a substrate contact, and a through wire interconnect (TWI) attached to the substrate contact. The through wire interconnect provides a multi level interconnect having contacts on opposing first and ... | 02/09/2010 |
| 7589406 | Stacked semiconductor component A semiconductor component includes a carrier and multiple semiconductor substrates stacked and interconnected on the carrier. The carrier includes conductive members bonded to corresponding conductive openings on the semiconductor substrates. The component can also ... | 09/15/2009 |
| 7579267 | Methods and systems for fabricating semiconductor components with through wire interconnects (TWI) A semiconductor component includes a semiconductor substrate having a substrate contact, and a through wire interconnect (TWI) bonded to the substrate contact. The through wire interconnect (TWI) includes a via through the substrate contact and the substrate, a wire... | 08/25/2009 |
| 7550315 | Method for fabricating semiconductor package with multi-layer die contact and external contact A semiconductor package includes a substrate formed of a board material, a semiconductor die bonded to the substrate, and an encapsulant on the die. The package also includes an array of external contacts formed as multi layered metal bumps that include a base layer... | 06/23/2009 |
| 7547385 | Method and system for producing a supercritical cryogenic fuel (SCCF) A method for producing a supercritical cryogenic fuel (SCCF) includes dissolving a hydrogen gas in fuel value proportions into a supercritical hydrocarbon fluid. The method is performed by placing a hydrogen gas and a hydrocarbon fluid at a pressure greater than the... | 06/16/2009 |
| 7539513 | Portable phone with ergonomic image projection system A portable phone includes a handset and a data projection system configured to form a visual image of data, such as caller waiting ID data, on a viewing surface viewable by a user during a two way conversation. The handset also includes a speaker, a microphone, conv... | 05/26/2009 |
| 7538413 | Semiconductor components having through interconnects A semiconductor component includes a semiconductor substrate having a substrate contact on a circuit side thereof in electrical communication with an integrated circuit, and a through interconnect in physical and electrical contact with the substrate contact configu... | 05/26/2009 |
| 7537966 | Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer A method for fabricating a BOC package includes the steps of providing a semiconductor die having planarized bumps encapsulated in a polymer layer, and providing a substrate having a plurality of conductors and an opening. The method also includes the steps of attac... | 05/26/2009 |
| 7531443 | Method and system for fabricating semiconductor components with through interconnects and back side redistribution conductors A method for fabricating semiconductor components includes the step of providing a semiconductor substrate having a circuit side, a back side, a plurality of integrated circuits on the circuit side, and a plurality of substrate contacts on the circuit side in electr... | 05/12/2009 |
| 7498675 | Semiconductor component having plate, stacked dice and conductive vias A semiconductor component includes a base die and a secondary die stacked on and bonded to the base die. The base die includes conductive vias which form an internal signal transmission system for the component, and allow the circuit side of the secondary die to be ... | 03/03/2009 |
| 7497191 | System and method for producing, dispensing, using and monitoring a hydrogen enriched fuel A system for producing, dispensing, using and monitoring a hydrogen enriched fuel includes a producing system configured to produce the hydrogen enriched fuel, a vehicle having an engine configured to use the hydrogen enriched fuel, and a dispensing system configure... | 03/03/2009 |
| 7459778 | Chip on board leadframe for semiconductor components having area array A leadframe for semiconductor components includes leadfingers, interconnect bonding sites for wire bonding to a semiconductor die, terminal bonding sites for terminal contacts for the component in an area array, and bus bars which electrically connect selected leadf... | 12/02/2008 |
| 7459393 | Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts A method for fabricating a semiconductor component includes the steps of providing a substrate having a contact on a circuit side thereof, forming an opening from a backside of the substrate to the contact, forming a conductive via in the opening in electrical conta... | 12/02/2008 |
| 7452391 | Feedforward control processes for variable output hydrogen generators Hydrogen generators and integrated hydrogen generator/fuel cells systems are operated by determining the condition of the hydrogen generator and the condition of the fuel to the hydrogen generator for selection of predetermined flow rates for each of the externally-... | 11/18/2008 |
| 7449910 | Test system for semiconductor components having conductive spring contacts An interconnect for testing a semiconductor component includes a substrate, and interconnect contacts on the substrate configured to electrically engage component contacts on a semiconductor component. Each interconnect contact includes a compliant conductive layer ... | 11/11/2008 |
| 7432604 | Semiconductor component and system having thinned, encapsulated dice A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dens... | 10/07/2008 |
| 7432600 | System having semiconductor component with multiple stacked dice A system includes a semiconductor component having a base die and a secondary die flip chip mounted to the base die. The base die includes a set of stacking contacts for flip chip mounting the secondary die to the base die, and a set of interconnect contacts configu... | 10/07/2008 |
| 7417325 | Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dens... | 08/26/2008 |
