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| Number | Title | Issue Date |
| 7928245 | Alcohols containing imide moieties and reactive oligomers prepared therefrom This invention relates to oligomeric compounds that are prepared by the reaction of a dianhydride with an amino-alcohol to yield an imide-diol intermediate, which is then esterified with a carboxylic acid to form a reactive oligomer. An exemplary reaction scheme is ... | 04/19/2011 |
| 7902305 | Composition of cationic initiator and oxetane compound This invention relates to cationically curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition consists essentially of an oxetane compound and a cationic initiator. ... | 03/08/2011 |
| 7887716 | Barrier sealant of phenylene oxetane and cationic initiator This invention relates to cationically curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition consists essentially of an electrophoretic device containing an oxetane compound and a photoinitiating system compri... | 02/15/2011 |
| 7722786 | Conductive materials A material for producing a conductive composition comprising polymer particles, conductive particles, and a liquid medium. The material is in a liquid/dispersion form until it is cured at which time it forms an electrically conductive composition. The composition co... | 05/25/2010 |
| 7687119 | Radiation-curable desiccant-filled adhesive/sealant A radiation-curable desiccant-filled adhesive/sealant composition comprising a radiation-curable resin, one or more desiccant fillers, one or more photoinitiators or photosensitizers, and optionally, one or more inorganic or organic fillers. ... | 03/30/2010 |
| 7645637 | Methods for assembling thin semiconductor die The invention is based on the discovery that certain self-filleting die attach adhesives are useful in semiconductor die assemblies containing thin die. As used herein, the term “self-filleting” refers to any adhesive that when dispensed and then subjected to su... | 01/12/2010 |
| 7528404 | Assembly of a semiconductor die attached to substrate with oxazoline derivative bearing an electron donor or acceptor functionality An assembly of a semiconductor die attached to a substrate is made with a composition comprising compounds that contain an oxazoline functionality and an electron acceptor or an electron donor functionality. Electron donor functionalities include styrenic, cinnamyl,... | 05/05/2009 |
| 7468407 | Metal salts of quinolinols and quinolinol derivatives in curable compositions Curable compositions exhibit improved adhesion and conductivity by the addition of a metal salt of 8-quinolinol or of an 8-quinolinol derivative as an adhesion and/or conductivity promoter. The metal salt of 8-quinolinol or of an 8-quinolinol derivative is formed by... | 12/23/2008 |
| 7462651 | Radiation-curable desiccant-filled adhesive/sealant A radiation-curable desiccant-filled adhesive/sealant composition comprising a radiation-curable resin, one or more desiccant fillers, one or more photoinitiators or photosensitizers, and optionally, one or more inorganic or organic fillers. ... | 12/09/2008 |
| 7456280 | Maleimide resin with cyanurate core Isocyanurate compounds or resins have the structure (I) in which Y is an hydroxyl group —OH or a maleimide group Formula (II) provided that at least one maleimide group is present, and Q is any divalent organic moiety, aliphatic or aromatic. | 11/25/2008 |
| 7452943 | Polymer compounds containing oxetane and styrenic functionality Polymeric compounds containing an oxetane functionality and a styrenic functionality have the structure in which polymer is a polymeric backbone from which depend the oxetane and styrenic functionalities; m and n are intege... | 11/18/2008 |
| 7414103 | Siloxane resins with oxetane functionality A linear or cyclic siloxane compound contains pendant carbon to carbon double bonds, Si—H bonds, and pendant oxetane functionality. These compounds have two curing temperatures, one associated with a hydrosilation reaction between the carbon to carbon double bond ... | 08/19/2008 |
| 7390430 | Curable liquid compositions containing bisoxazoline Difunctional oxazoline resins, which may be produced in a convenient one-step reaction from an arylalkylene dinitrile by reaction with an amino alcohol, are used in compositions with an additional curable compound or resin containing one or more carbon to carbon dou... | 06/24/2008 |
| 7378523 | Quinolinols as fluxing and accelerating agents for underfill compositions Underfill compositions comprise a quinolinol or a quinolinol derivative as a fluxing agent, as an accelerating agent, or as both. The compositions are sufficiently acidic to perform well as fluxes, but not so acidic as to cause premature gelation or corrosion. The c... | 05/27/2008 |
| 7338842 | Process for exposing solder bumps on an underfill coated semiconductor A process for applying a solvent-free underfill onto a bumped semiconductor comprises: providing an underfill in a compressible state on a semiconductor, contacting the underfill with a compliant surface and applying sufficient pressure to expose the bumps, optional... | 03/04/2008 |
| 7326754 | Thermoset adhesive films This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor func... | 02/05/2008 |
| 7326746 | Curable electron donor compositions Electron donor compounds, suitable for use as adhesives or as components in adhesives, contain a carbon to carbon double bond attached to an aromatic ring and conjugated with the unsaturation in the aromatic ring. ... | 02/05/2008 |
| 7319132 | Polymer compounds containing oxetane and maleimide functionality Polymeric compounds containing an oxetane functionality and a maleimide functionality have the structure in which polymer is a polymeric backbone, m and n are integers from 2 to 500, R1 is methyl or et... | 01/15/2008 |
| 7230055 | Compositions containing oxetane compounds for use in semiconductor packaging Compositions containing oxetane compounds having ester, amide, urea, carbamate, carbonate, or carbonyl functionality one carbon atom removed from the oxetane ring cure at high temperatures are suitable for use as underfill materials within a semiconductor package, p... | 06/12/2007 |
| 7186945 | Sprayable adhesive material for laser marking semiconductor wafers and dies A sprayable adhesive composition having a viscosity within the range of 0.5 Pa.s to 5.0 Pa.s, containing at least one colored filler present in an amount up to 50% by weight of the adhesive composition, is suitable for marking identifications or fiducials on semicon... | 03/06/2007 |
| 7160946 | Method to improve high temperature cohesive strength with adhesive having multi-phase system A method for improving the cohesive strength at elevated temperature of a die attach adhesive formulation of a liquid curable resin, initiator, and filler, comprises adding to the adhesive formulation an aromatic bismaleimide resin powder that does not dissolve in t... | 01/09/2007 |
| 7135535 | Siloxane resins with oxetane functionality A linear or cyclic siloxane compound contains pendant carbon to carbon double bonds, Si—H bonds, and pendant oxetane functionality. These compounds have two curing temperatures, one associated with a hydrosilation reaction between the carbon to carbon double bond ... | 11/14/2006 |
| 7057264 | Curable compounds containing reactive groups: triazine/isocyanurates, cyanate esters and blocked isocyanates This invention is directed to compounds that can be used as antioxidants for exposed metal surfaces, and also as adhesion promoters for adhesive, coating or encapsulant resins that are applied to the metal substrates. These compounds include triazine or isocyanurate... | 06/06/2006 |
| 7034064 | Method of attaching a die to a substrate using a hybrid oxetane compound A method for attaching a silicon die to a substrate using an adhesive containing an oxetane functionality and an electron acceptor or an electron donor functionality, represented by the formula in which R1 is... | 04/25/2006 |
| 6982338 | Oxetane compounds containing maleimide functionality These compounds contain an oxetane functionality and a maleimide functionality. The oxetane functionality is homopolymerizable in reactions that undergo cationic or anionic ring opening, and the maleimide functionality is homopolymerizable, or polymerizable with com... | 01/03/2006 |
| 6953862 | Oxetane compounds containing styrenic functionality These compounds contain an oxetane functionality and a styrenic functionality. The oxetane functionality is homopolymerizable in reactions that undergo cationic or anionic ring opening, and the styrenic is polymerizable with compounds such as electron acceptor compo... | 10/11/2005 |
| 6943258 | Polymer compounds containing oxetane and cinnamyl functionality These compounds contain an oxetane functionality and a cinnamyl functionality. The oxetane functionality is homopolymerizable in reactions that can undergo cationic or anionic ring opening, and the cinnamyl functionality is polymerizable with compounds such as elect... | 09/13/2005 |
| 6908957 | Curable electron donor compounds Electron donor compounds, suitable for use as adhesives or as components in adhesives, contain a carbon to carbon double bond attached to an aromatic ring and conjugated with the unsaturation in the aromatic ring. ... | 06/21/2005 |
| 6908969 | Unsaturated compounds containing silane, electron donor and electron acceptor functionality This invention relates to curable compounds or resins containing electron donor or acceptor functionality, carbon to carbon unsaturation, and silane functionality, having the structure: in which E is an electron donor ... | 06/21/2005 |
| 6822047 | Adhesive with carboxyl benzotriazole for improved adhesion to metal substrates An adhesive for use on metal substrates, and particularly on copper substrates, comprises (a) carboxyl benzotriazole, (b) an epoxy resin having a reactive double bond, (c) a radical curing resin, and (d) a radical initiator. The combination of elements (a) and (b) i... | 11/23/2004 |
| 6809155 | Unsaturated compounds containing silane, electron donor and electron acceptor functionality This invention relates to curable compounds or resins containing electron donor or acceptor functionality, carbon to carbon unsaturation, and silane functionality, having the structure: in which E is an electron donor ... | 10/26/2004 |
| 6803406 | Electron donors, electron acceptors and adhesion promoters containing disulfide Disclosed are compounds comprising both disulfide functionality and electron donor functionality or alkoxy siloxane functionality, and curable compositions comprising compounds comprising both disulfide functionality and electron donor functionality, or electron acc... | 10/12/2004 |
| 6784025 | Semiconductor package with a die attach adhesive having silane functionality This invention relates to a semiconductor package in which a silicon die is adhered to a substrate with an adhesive comprising a resin having the structure: in which Q is an oligomeric or polymeric group containing at le... | 08/31/2004 |
| 6753434 | Oxetane compounds containing cinnamyl functionality These compounds contain an oxetane functionality and a cinnamyl functionality. The oxetane functionality is homopolymerizable in reactions that can undergo cationic or anionic ring opening, and the cinnamyl functionality is polymerizable with compounds such as elect... | 06/22/2004 |
| 6750301 | Die attach adhesives with epoxy compound or resin having allyl or vinyl groups Adhesive compositions containing a base compound or resin and an epoxy compound or resin with allyl or vinyl functionality show enhanced adhesive strength. The compositions can be used in microelectronic applications. ... | 06/15/2004 |
| 6716992 | Cycloaliphatic epoxy compounds containing styrenic, cinnamyl, or maleimide functionality A curable composition comprises a compound having at least one epoxy group and at least one maleimide, styrenic or cinnamyl group per molecule. A representative compound has the structure in which Z′ and Z are any mono... | 04/06/2004 |
| 6706835 | Curable compositions containing thiazole functionality Adhesion promoting compounds or resins containing a thiazole functionality (including benzothiazole) and a polymerizable functionality (Z) give improved adhesive strength to metal substrates. A representative structure is the following, in which R1 and R | 03/16/2004 |
| 6699929 | Die attach adhesives with vinyl ether and carbamate or urea functionality Compounds with both vinyl ether and carbamate, thiocarbamate or urea functionality are suitable for use in microelectronics applications and show enhanced adhesive strength compared to compounds that do not contain carbamate, thiocarbamate or urea functio... | 03/02/2004 |
| 6646095 | Process for the manufacture of copolymers of formaldehyde and diphenyl oxide A process for the manufacture of copolymers of formaldehyde and diphenyl oxide and a carboxylic acid uses and acid with a pKa in the range of 1.2 to 3 as the catalyst.... | 11/11/2003 |
| 6620651 | Adhesive wafers for die attach application Fabrication of a CSP or a stacked chip CSP can be accomplished with an unsupported film adhesive or an adhesive supported on a rigid carrier, using standard die attach equipment constructed for use with a paste adhesive.... | 09/16/2003 |
