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| Number | Title | Issue Date |
| 8144480 | Multi-layer embedded capacitance and resistance substrate core A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of ... | 03/27/2012 |
| 8084863 | Circuitized substrate with continuous thermoplastic support film dielectric layers A circuitized substrate including a dielectric layer having a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin and not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned ... | 12/27/2011 |
| 8063315 | Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a metallic component including nano-particles and may include additional elements such as solder or other metal micro-particles, as... | 11/22/2011 |
| 8028390 | Spring actuated clamping mechanism A spring actuated clamping mechanism has a backer plate with an upper surface and a lower surface. A set of apertures is formed along the periphery of the backer plate. The upper surface of the backer plate has at least one backer plate recess, and preferably four r... | 10/04/2011 |
| 7977034 | Method for making circuitized substrates having photo-imageable dielectric layers in a continuous manner Apparatus and method for making circuitized substrates using a continuous roll format in which a layer of conductor is fed into the apparatus, layers of photo-imageable dielectric are applied to opposite sides of the conductor layer, thru-holes are formed through th... | 07/12/2011 |
| 7972178 | High density connector for interconnecting fine pitch circuit packaging structures A pinned interposer and mating sockets to facilitate removable mounting of high connection density micro devices between a pair of substrates in compact electronic circuit packages. The pinned interposer has an inner set of contacts, typically in a rectangular array... | 07/05/2011 |
| 7931830 | Dielectric composition for use in circuitized substrates and circuitized substrate including same A dielectric composition which is adapted for combining with a supporting material ( e.g., fiber-glass cloth) to form a dielectric layer usable in circuitized such as PCBs, chip carriers and the like. As such a layer, it includes a resin, a predetermined percentage ... | 04/26/2011 |
| 7910156 | Method of making circuitized substrate with selected conductors having solder thereon A method of making a circuitized substrate in which conductors are formed in such a manner that selected ones of the conductors include solder while others do not and are thus adapted for receiving a different form of connection (e.g., wire-bond) than the solder cov... | 03/22/2011 |
| 7897877 | Capacitive substrate A capacitive substrate and method of making same in which first and second glass layers are used. A first conductor is formed on a first of the glass layers and a capacitive dielectric material is positioned over the conductor. The second conductor is then positione... | 03/01/2011 |
| 7875811 | High speed interposer A high speed interposer which includes a substrate having alternatingly oriented dielectric and conductive layers which form a substrate, openings which extend from one opposing surface of the substrate to a second opposing surface, conductive members positioned wit... | 01/25/2011 |
| 7870664 | Method of making circuitized substrate with a resistor A method of making a circuitized substrate including a resistor comprised of material which includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ceramic component. The ceramic component may be a... | 01/18/2011 |
| 7851906 | Flexible circuit electronic package with standoffs A flexible circuit electronic package including a heat sink, a flexible circuit having a semiconductor chip positioned thereon and electrically coupled thereto, and a quantity of heat shrunk adhesive securing the flexible circuit to the heat sink such that the flexi... | 12/14/2010 |
| 7841741 | LED lighting assembly and lamp utilizing same An LED lighting assembly including a plurality of individual LEDs mounted on a common, bendable heat sinking member designed to remove heat from the LEDs during operation and also to be formed (bent) to provide the desired light direction and intensity. Several such... | 11/30/2010 |
| 7838776 | Circuitized substrates utilizing smooth-sided conductive layers as part thereof A circuitized substrate in which two conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to an interim dielectric layer. Each of the two foil surfaces which physically bond to the dielectric are smooth (e.g., preferably by chemical proce... | 11/23/2010 |
| 7827682 | Apparatus for making circuitized substrates having photo-imageable dielectric layers in a continuous manner Apparatus and method for making circuitized substrates using a continuous roll format in which a layer of conductor is fed into the apparatus, layers of photo-imageable dielectric are applied to opposite sides of the conductor layer, thru-holes are formed through th... | 11/09/2010 |
| 7823274 | Method of making multilayered circuitized substrate assembly A method of making a multilayered circuitized substrate assembly which includes bonding at least two circuitized substrates each including at least one layer of high temperature dielectric material, one of these layers in turn including at least one thru-hole therei... | 11/02/2010 |
| 7814649 | Method of making circuitized substrate with filled isolation border A method of making a circuitized substrate which includes a plurality of contiguous open segments along a side edge portion of the at least one electrically conductive layer thereof, these open segments isolated by a barrier of dielectric material which substantiall... | 10/19/2010 |
| 7801833 | Item identification control method A system and method for identifying and controlling the movement of various items, e.g., suitcases, associated with respective ones of various individuals, e.g., those desiring to travel on a selected means of transportation such as an airline, railway or the like. ... | 09/21/2010 |
| 7800916 | Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same A circuitized substrate assembly comprised of at least two circuitized substrates each including a thin dielectric layer and a conductive layer with a plurality of conductive members as part thereof, the conductive members of each substrate being electrically couple... | 09/21/2010 |
| 7738249 | Circuitized substrate with internal cooling structure and electrical assembly utilizing same An electrical assembly which includes a circuitized substrate including a first plurality of dielectric and electrically conductive circuit layers alternatively oriented in a stacked orientation, a thermal cooling structure bonded to one of the dielectric layers and... | 06/15/2010 |
| 7713767 | Method of making circuitized substrate with internal optical pathway using photolithography A method of making a circuitized substrate (e.g., PCB) including at least one and possibly several internal optical pathways as part thereof such that the resulting substrate will be capable of transmitting and/or receiving both electrical and optical signals. The m... | 05/11/2010 |
| 7712210 | Method of providing a printed circuit board with an edge connection portion A method of making a printed circuit board in which at least two circuitized substrates are aligned and bonded together (e.g., using lamination). A gasket is provided on one of these and a facing circuitized portion on the other. The gasket forms an effective seal a... | 05/11/2010 |
| 7687724 | Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrate A circuitized substrate which utilizes at least one internal (embedded) resistor as part thereof, the resistor comprised of a material including resin and a quantity of powders of nano-particle and/or micro-particle sizes. The resistor serves to decrease the capacit... | 03/30/2010 |
| 7687722 | Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same A circuitized substrate including a composite layer comprising a first dielectric sub-layer comprised of a halogen-free resin and fibers dispersed therein and a second dielectric sub-layer without fibers but also including a halogen-free resin with inorganic particu... | 03/30/2010 |
| 7679005 | Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same A circuitized substrate in which selected ones of the signal conductors are substantially surrounded by shielding members which shield the conductors during passage of high frequency signals, e.g., to reduce noise. The shielding members may form solid members which ... | 03/16/2010 |
| 7665207 | Method of making a multi-chip electronic package having laminate carrier A method of making a multi-chip electronic package which utilizes an organic, laminate chip carrier and a pair of semiconductor chips positioned on an upper surface of the carrier in a stacked orientation. The organic, laminate chip carrier is comprised of a plurali... | 02/23/2010 |
| 7635552 | Photoresist composition with antibacterial agent A photoresist composition, e.g., a positive acting resist, for use in the formation of circuit patterns and the like on printed circuit boards and the like circuitized substrates, the photoresist composition including a quantity of silver therein in a sufficient amo... | 12/22/2009 |
| 7629684 | Adjustable thickness thermal interposer and electronic package utilizing same An electronic package which includes a substrate (e.g., a chip carrier substrate or a PCB), an electronic component (e.g., a semiconductor chip), a heatsink and a thermal interposer for effectively transferring heat from the chip to the heatsink. The interposer incl... | 12/08/2009 |
| 7629559 | Method of improving electrical connections in circuitized substrates A method of improving conductive paste connections in a circuitized substrate in which at least one and preferably a series of high voltage pulses are applied across the paste and at least one and preferably a series of high current pulses are applied, both series o... | 12/08/2009 |
| 7629541 | High speed interposer A high speed interposer which includes a substrate having alternatingly oriented dielectric and conductive layers which form a substrate, openings which extend from one opposing surface of the substrate to a second opposing surface, conductive members positioned wit... | 12/08/2009 |
| 7627947 | Method for making a multilayered circuitized substrate A method of making a multilayered circuitized substrate in which a continuous process is used to form electrically conductive layers which each will form part of a sub-composite. The sub-composites are then aligned such that openings within the conductive layers are... | 12/08/2009 |
| 7622384 | Method of making multi-chip electronic package with reduced line skew A method of making an electronic package which includes a circuitized substrate having at least two electrical components positioned thereon. The package includes patterns of contact sites, each for having one of the components coupled thereto. The patterns of conta... | 11/24/2009 |
| 7596863 | Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein A method of making a printed circuit board in which at least three substrates are aligned and bonded together (e.g., using lamination). Two of the substrates have openings formed therein, with each opening including a cover member located therein. During lamination,... | 10/06/2009 |
| 7595454 | Method of making a circuitized substrate with enhanced circuitry and electrical assembly utilizing said substrate A method of making a circuitized substrate in which pairs of vertically oriented though holes are formed such that at least one of the through holes is partially embedded within a lower one, thus assuring a sound connection following subsequent lamination or other s... | 09/29/2009 |
| 7589283 | Method of making circuitized substrate with improved impedance control circuitry, electrical assembly and information handling system A method of making a circuitized substrate designed to substantially eliminate impedance disruptions during passage of signals through signal lines of the substrate's circuitry. The produced substrate includes a first conductive layer with a plurality of conductors ... | 09/15/2009 |
| 7552091 | Method and system for tracking goods A method and system for tracking goods, etc., food products, which involves identifying the received goods at a specified location and thereafter assigning an encoded readable code to each of the goods which can be only accessed by authorized personnel responsible f... | 06/23/2009 |
| 7547577 | Method of making circuitized substrate with solder paste connections A method of making a circuitized substrate assembly in which two or more subassemblies are aligned and bonded together. The bonding, preferably using lamination, results in effective electrical connections being formed between respective pairs of conductors of the s... | 06/16/2009 |
| 7541265 | Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate A material for use as part of an internal capacitor within a circuitized substrate includes a polymer (e.g., a cycloaliphatic epoxy or phenoxy based) resin and a quantity of nano-powders of ferroelectric ceramic material (e.g., barium titanate) having a particle siz... | 06/02/2009 |
| 7541058 | Method of making circuitized substrate with internal optical pathway A circuitized substrate (e.g., PCB) including an internal optical pathway as part thereof such that the substrate is capable of transmitting and/or receiving both electrical and optical signals. The substrate includes an angular reflector on one of the cladding laye... | 06/02/2009 |
| 7530167 | Method of making a printed circuit board with low cross-talk noise A method of making a printed circuit board in which the board includes a common power plane having dielectric layers on opposing sides thereof and a signal layer on each of said dielectric layers, each signal layer comprising a plurality of substantially parallel si... | 05/12/2009 |
