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Attorney: Fish & Neave, Gilbert; Douglas J., McAusland; K. Iain


Number of patents: 2
Last date: December 03, 1996

NumberTitleIssue Date
5580520Lead-free alloy containing tin, silver and indium
A low melting point solder alloy comprising effective amounts of tin, silver and indium....
12/03/1996
5455004Lead-free alloy containing tin, zinc, indium and bismuth
A lead-free alloy suitable for soldering comprising from about 82% to about 90% tin, from about 4.5% to about 6% zinc, from about 3.5% to about 6% indium and from about 1% to about 5% bismuth. The melting temperature of the alloy is preferably below 190°...
10/03/1995
 
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